- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S090-1FGG676 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | - | - | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 676 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | 166MHz | NOT SPECIFIED | M2S090 | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | RoHS Compliant | - | ||
 M2S150T-FCVG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | - | - | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 273 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | RoHS Compliant | - | ||
 M2S090T-FG676 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | - | - | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | - | ||
 M2S150TS-FCSG536 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 536 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | - | - | NOT SPECIFIED | - | S-PBGA-B536 | - | - | - | 1.26V | - | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | - | 512KB | - | - | - | RoHS Compliant | - | ||
M2S150TS-1FCS536 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | no | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B536 | - | - | - | 1.26V | - | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | - | 512KB | - | - | - | Non-RoHS Compliant | - | ||
M2S150T-1FCS536I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B536 | 293 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 150K Logic Modules | 146124 | 512KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S025-FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 325-TFBGA, CSPBGA | YES | - | - | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | - | ||
 M2S025-VFG400 Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | FPGA - 25K Logic Modules | - | 256KB | - | - | - | RoHS Compliant | - | ||
M2S010-FGG484 Microsemi Corporation | 8 | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | 484 | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S010 | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 50kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | 12084 | ARM | 1007 | FPGA - 10K Logic Modules | - | 256KB | - | 23mm | 23mm | RoHS Compliant | Lead Free | ||
M2S025T-FGG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | 484 | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025T | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | FPGA - 25K Logic Modules | - | 256KB | - | - | - | RoHS Compliant | - | ||
 M2S005-VF256I Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | - | - | 161 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B256 | 161 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | - | ||
M2S010T-VFG256I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | 256-LBGA | YES | - | - | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | - | ||
M2S005S-VF256 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | - | - | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B256 | 161 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | - | ||
M2S010TS-1VF400 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | 400-LFBGA | YES | - | - | 195 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B400 | 195 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 195 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 10K Logic Modules | 12084 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | - | ||
M2S025-1VFG400I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | FPGA - 25K Logic Modules | - | 256KB | - | - | - | RoHS Compliant | - | ||
M2S025-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | FPGA - 25K Logic Modules | - | 256KB | - | - | - | RoHS Compliant | - | ||
M2S025TS-1VFG256I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | - | - | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | - | - | - | 1.26V | - | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | - | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | - | ||
M2S025TS-1VF256I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LFBGA | YES | - | - | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | no | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B256 | - | - | - | 1.26V | - | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | - | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | - | ||
M2S060T-1FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | - | ||
M2S025-1VFG256I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | 256-LBGA | YES | - | - | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | - |