- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S060TS-1FG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 60K Logic Modules | 56520 | - | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | Contains Lead | ||
 A2F200M3F-PQ208I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 208-BFQFP | YES | 208 | - | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | - | - | - | - | QUAD | GULL WING | 225 | 1.5V | 0.5mm | - | 80MHz | 20 | A2F200 | - | 66 | Not Qualified | - | 1.575V | - | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | - | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | - | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | 200000 | 256KB | 4.1mm | - | - | Non-RoHS Compliant | - | ||
 M2S005-VFG256 Microsemi Corporation | 17 | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 256-LFBGA | YES | - | - | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B256 | 161 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 161 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 5K Logic Modules | 6060 | - | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | - | ||
 M2S005S-1VF400I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 169 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S005S | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | ARM | - | - | - | FPGA - 5K Logic Modules | - | - | 128KB | - | - | - | Non-RoHS Compliant | - | ||
M2S010-1VF400 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S010 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | ARM | - | - | - | FPGA - 10K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
M2S010-FG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 233 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 233 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 10K Logic Modules | 12084 | - | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | - | ||
M2S005-1FG484 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 484-BGA | - | - | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S005 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | ARM | - | - | - | FPGA - 5K Logic Modules | - | - | 128KB | - | - | - | Non-RoHS Compliant | - | ||
M2S050T-FGG484 Microsemi Corporation | 15 | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | - | 484 | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | ARM | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | RoHS Compliant | Contains Lead | ||
 M2S005-TQG144 Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 144-LQFP | YES | 144 | - | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | - | - | - | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | - | 84 | Not Qualified | 1.2V | 1.26V | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 5K Logic Modules | 6060 | - | 128KB | 1.6mm | 20mm | 20mm | RoHS Compliant | - | ||
A2F200M3F-PQG208I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 208-BFQFP | YES | 208 | - | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2007 | SmartFusion® | - | Active | 3 (168 Hours) | 208 | Pure Matte Tin (Sn) | - | - | - | - | QUAD | GULL WING | 245 | 1.5V | 0.5mm | - | 80MHz | 30 | A2F200 | - | 66 | Not Qualified | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | - | - | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | - | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | 200000 | 256KB | 4.1mm | - | - | RoHS Compliant | - | ||
M2S005S-1FG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 484-BGA | - | - | 484-FPBGA (23x23) | 209 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S005S | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | ARM | - | - | - | FPGA - 5K Logic Modules | - | - | 128KB | - | - | - | Non-RoHS Compliant | - | ||
M2S010-FGG484I Microsemi Corporation | 60 | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | 484 | - | 233 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | - | 233 | Not Qualified | 1.2V | 1.26V | - | - | - | - | - | 256kB | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | - | 400MHz | 1007 | FPGA - 10K Logic Modules | - | - | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | - | ||
M2S010-VFG256I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | 256-LFBGA | - | 256 | - | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | - | 138 | Not Qualified | - | - | 1.2V | - | - | 1.26V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 10K Logic Modules | 12084 | - | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | Lead Free | ||
M2S010-VFG400I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | YES | - | - | 195 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B400 | 195 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 195 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 10K Logic Modules | 12084 | - | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | Lead Free | ||
A2F200M3F-FG256 Microsemi Corporation | 679 | - | Datasheet | 12 Weeks | - | Surface Mount | 256-LBGA | - | 256 | - | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2012 | SmartFusion® | - | Active | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | - | - | - | - | BOTTOM | BALL | 225 | 1.5V | 1mm | - | 80MHz | 30 | A2F200 | - | 66 | Not Qualified | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | - | 2mA | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | 200000 | - | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | 256KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | - | ||
 A2F500M3G-CSG288 Microsemi Corporation | In Stock | - | Datasheet | 16 Weeks | - | - | 288-TFBGA, CSPBGA | YES | - | - | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e1 | Active | 3 (168 Hours) | 288 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.5V | 0.5mm | - | 80MHz | NOT SPECIFIED | A2F500M3G | S-PBGA-B288 | 78 | Not Qualified | - | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | - | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 500000 | 512KB | 1.05mm | 11mm | 11mm | RoHS Compliant | - | ||
 M2S025T-FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 325-TFBGA, CSPBGA | YES | - | - | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 180 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Modules | 27696 | - | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | - | ||
M2S050-FCS325 Microsemi Corporation | In Stock | - | Datasheet | 13 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | 325-TFBGA, CSPBGA | YES | - | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 200 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | Contains Lead | ||
M2S025T-VF400I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | YES | - | - | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 207 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Modules | 27696 | - | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | - | ||
M2S010-TQ144 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | - | 144-LQFP | YES | - | - | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PQFP-G144 | 84 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 84 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | 256KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | - |