- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Density | Core Architecture | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S150T-1FCV484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | - | - | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 484 | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 273 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 150K Logic Modules | 146124 | - | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | - | ||
 M2S150-1FCSG536 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 536 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | - | - | NOT SPECIFIED | - | S-PBGA-B536 | 293 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 150K Logic Modules | 146124 | - | 512KB | - | - | - | RoHS Compliant | - | ||
M2S150TS-FCS536I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | no | Active | 3 (168 Hours) | 536 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B536 | - | - | - | 1.26V | - | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 150K Logic Modules | - | - | 512KB | - | - | - | Non-RoHS Compliant | - | ||
M2S150TS-1FCS536I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | - | - | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 536 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B536 | - | - | - | 1.26V | - | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 150K Logic Modules | - | - | 512KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S150T-1FC1152 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | - | - | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S150T | S-PBGA-B1152 | 574 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | - | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | FPGA - 150K Logic Modules | 146124 | - | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | - | ||
A2F500M3G-FG484M Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | 484-BGA | YES | - | - | MCU - 41, FPGA - 128 | -55°C~125°C TJ | Tray | - | SmartFusion® | - | - | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.5V | 1mm | - | 80MHz | NOT SPECIFIED | A2F500M3G | S-PBGA-B484 | - | - | - | 1.575V | - | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 500000 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | - | ||
 M2S050T-FGG896ES Microsemi Corporation | In Stock | - | Datasheet | - | - | 896-BGA | - | - | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2016 | SmartFusion®2 | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | RoHS Compliant | Lead Free | ||
M2S150S-1FCG1152I Microsemi Corporation | In Stock | - | Datasheet | - | - | 1152-BBGA, FCBGA | - | - | 1152-FCBGA (35x35) | 574 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | - | Obsolete | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S150S | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | ARM | FPGA - 150K Logic Modules | - | - | 512KB | - | - | - | RoHS Compliant | - | ||
M2S150S-1FC1152I Microsemi Corporation | In Stock | - | Datasheet | - | - | 1152-BBGA, FCBGA | - | - | 1152-FCBGA (35x35) | 574 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | - | Obsolete | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S150S | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | ARM | FPGA - 150K Logic Modules | - | - | 512KB | - | - | - | Non-RoHS Compliant | - | ||
M2S050S-1FG484I Microsemi Corporation | In Stock | - | Datasheet | - | - | 484-BGA | - | 484 | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | - | - | Obsolete | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050S | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
M2S050-1FG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S060-1VF400 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | - | - | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 400 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | 56520 | - | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | - | ||
M2S050-VFG400I Microsemi Corporation | 67 | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | - | - | 207 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 400 | - | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | - | ||
M2S060-FG484I Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 484 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | 56520 | - | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | - | ||
M2S025TS-1VFG400T2 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | - | - | - | 207 | -40°C~125°C TJ | Tray | 2016 | Automotive, AEC-Q100, SmartFusion®2 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | - | 256KB | - | - | - | RoHS Compliant | - | ||
M2S050T-1FG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | 1.26V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 256 kb | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | Lead Free | ||
M2S050-FGG896I Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | YES | - | - | 377 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 896 | - | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 377 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 2.44mm | 31mm | 31mm | RoHS Compliant | - | ||
M2S050TS-FGG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 484 | - | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | - | ||
M2S050T-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | RoHS Compliant | - | ||
M2S050TS-FG896I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | YES | - | - | 377 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 896 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 377 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | - |