- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S025TS-1FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||
 M2S025-1FGG484 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025 | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | ARM | FPGA - 25K Logic Modules | - | 256KB | - | - | - | RoHS Compliant | ||
M2S025TS-1FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | - | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | ||
M2S060-1FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | ||
M2S050TS-FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | ||
M2S060TS-FCS325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||
M2S090-FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | RoHS Compliant | ||
M2S060-1FCS325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||
M2S050TS-1FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | ||
M2S060TS-1FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | ||
M2S150-FCVG484 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | - | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | RoHS Compliant | ||
M2S090TS-1FGG484T2 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 267 | -40°C~125°C TJ | Tray | 2016 | Automotive, AEC-Q100, SmartFusion®2 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 90K Logic Modules | - | 512KB | - | - | - | RoHS Compliant | ||
M2S090TS-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | - | 267 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | 166MHz | NOT SPECIFIED | M2S090TS | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||
M2S150TS-FCV484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | - | 273 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | - | no | Active | 3 (168 Hours) | 484 | - | - | - | LG-MIN,WD-MIN | 8542.39.00.01 | BOTTOM | BALL | - | 1.2V | 0.8mm | - | - | - | - | S-PBGA-B484 | - | - | 1.26V | - | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | - | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||
 M2S150T-1FCSG536I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | - | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | - | - | NOT SPECIFIED | - | S-PBGA-B536 | 293 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | 146124 | 512KB | - | - | - | RoHS Compliant | ||
 M2S090-FGG676I Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | - | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 676 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | RoHS Compliant | ||
 M2S150-1FC1152 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | - | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S150 | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | ||
M2S150T-1FCVG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | - | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | RoHS Compliant | ||
M2S150-1FCSG536I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | - | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | - | - | - | NOT SPECIFIED | - | S-PBGA-B536 | 293 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | 146124 | 512KB | - | - | - | RoHS Compliant | ||
M2S060-1FG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | - | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant |