- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S025-1FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 325-TFBGA, CSPBGA | YES | - | - | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | - | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Modules | - | 27696 | - | 256KB | 1.01mm | 11mm | 11mm | - | RoHS Compliant | ||
 A2F060M3E-1FG256M Microsemi Corporation | In Stock | - | Datasheet | - | - | - | 256-LBGA | - | 256 | - | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | - | SmartFusion® | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | - | unknown | 100MHz | - | A2F060M3E | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | - | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | - | - | - | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | - | - | - | 128KB | - | - | - | - | Non-RoHS Compliant | ||
 M2S010S-TQ144I Microsemi Corporation | In Stock | - | Datasheet | - | OBSOLETE (Last Updated: 1 month ago) | - | 144-LQFP | - | - | 144-TQFP (20x20) | 84 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | ||
M2S050-FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | 325-TFBGA, CSPBGA | YES | - | - | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | - | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 50K Logic Modules | - | 56340 | - | 256KB | 1.01mm | 11mm | 11mm | - | RoHS Compliant | ||
 A2F200M3F-1PQG208I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 208-BFQFP | - | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | - | Active | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 100MHz | - | A2F200 | - | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | 100MHz | 8 | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | 256KB | - | - | - | - | RoHS Compliant | ||
M2S025T-FCSG325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 325-TFBGA, CSPBGA | YES | - | - | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | - | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Modules | - | 27696 | - | 256KB | 1.01mm | 11mm | 11mm | - | RoHS Compliant | ||
A2F060M3E-TQG144 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 144-LQFP | - | - | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2000 | SmartFusion® | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 80MHz | - | A2F060M3E | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | - | - | - | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | - | - | - | 128KB | - | - | - | - | RoHS Compliant | ||
A2F060M3E-FG256 Microsemi Corporation | In Stock | - | Datasheet | 2 Weeks | - | Surface Mount | 256-LBGA | - | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 80MHz | - | A2F060M3E | - | - | - | 1.5V | - | - | - | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | 100MHz | 8 | - | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | - | - | - | 128KB | - | - | - | - | Non-RoHS Compliant | ||
A2F060M3E-TQ144I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 144-LQFP | - | - | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | - | Obsolete | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 80MHz | - | A2F060M3E | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | - | - | - | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | - | - | - | 128KB | - | - | - | - | Non-RoHS Compliant | ||
 M2S090T-FGG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | - | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | ARM | - | - | - | FPGA - 90K Logic Modules | - | 86316 | - | 512KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | ||
 M2S090T-FGG676I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 676-BGA | YES | - | - | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | - | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 90K Logic Modules | - | 86316 | - | 512KB | 2.44mm | 27mm | 27mm | - | RoHS Compliant | ||
M2S005S-FG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 209 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 209 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 209 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 5K Logic Modules | - | 6060 | - | 128KB | 2.44mm | 23mm | 23mm | - | Non-RoHS Compliant | ||
 M2S010TS-1VFG400 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 400-LFBGA | - | - | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | - | 256KB | - | - | - | - | RoHS Compliant | ||
M2S010TS-VF256 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 256-LFBGA | YES | - | - | 138 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 10K Logic Modules | - | 12084 | - | 256KB | 1.56mm | 14mm | 14mm | - | Non-RoHS Compliant | ||
M2S010TS-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | - | - | 484-FPBGA (23x23) | 233 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S010TS | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 10K Logic Modules | - | - | - | 256KB | - | - | - | - | RoHS Compliant | ||
M2S090T-1FGG484M Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 484-BGA | YES | - | - | 267 | -55°C~125°C TJ | Tray | - | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 90K Logic Modules | - | 86316 | - | 512KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | ||
A2F060M3E-TQ144 Microsemi Corporation | In Stock | - | Datasheet | 2 Weeks | - | - | 144-LQFP | YES | - | - | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 144 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | QUAD | GULL WING | 225 | 1.5V | 0.5mm | - | 80MHz | 20 | A2F060M3E | S-PQFP-G144 | 33 | Not Qualified | - | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | - | - | - | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 33 | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | - | - | - | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | - | - | 60000 | 128KB | 1.6mm | 20mm | 20mm | - | Non-RoHS Compliant | ||
A2F060M3E-1FG256 Microsemi Corporation | In Stock | - | Datasheet | - | - | - | 256-LBGA | - | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2009 | SmartFusion® | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 100MHz | - | A2F060M3E | - | - | - | 1.5V | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | 100MHz | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | - | - | 128KB | - | - | - | No | Non-RoHS Compliant | ||
A2F060M3E-1TQ144I Microsemi Corporation | In Stock | - | Datasheet | - | - | - | 144-LQFP | - | - | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | - | Obsolete | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 100MHz | - | A2F060M3E | - | - | - | - | - | - | - | EBI/EMI, I2C, SPI, UART, USART | - | - | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | - | - | - | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | - | - | - | 128KB | - | - | - | - | Non-RoHS Compliant | ||
 A2F500M3G-1CSG288I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 288-TFBGA, CSPBGA | YES | - | - | MCU - 31, FPGA - 78 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e1 | Active | 3 (168 Hours) | 288 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.5mm | - | 100MHz | 30 | A2F500M3G | S-PBGA-B288 | 78 | Not Qualified | 1.5V | - | 1.51.82.53.3V | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 500000 | 512KB | 1.05mm | 11mm | 11mm | - | RoHS Compliant |