- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A2F200M3F-FG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 484-BGA | - | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 94 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 80MHz | - | A2F200 | - | - | - | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 2mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | 200000 | 100MHz | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S025-VF400 Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 25K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S025T-1FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 325-TFBGA, CSPBGA | YES | - | - | 180 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Modules | 27696 | - | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | - | ||
 A2F500M3G-1CS288I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 288-TFBGA, CSPBGA | YES | - | - | MCU - 31, FPGA - 78 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | Active | 3 (168 Hours) | 288 | TIN LEAD SILVER | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 235 | 1.5V | 0.5mm | - | 100MHz | 20 | A2F500M3G | S-PBGA-B288 | 78 | Not Qualified | - | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 500000 | 512KB | 1.05mm | 11mm | 11mm | Non-RoHS Compliant | - | ||
M2S025T-FG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | - | - | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 25K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
 A2F500M3G-1FGG256I Microsemi Corporation | In Stock | - | Datasheet | - | - | - | 256-LBGA | YES | 256 | - | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | - | 100MHz | 30 | A2F500M3G | - | 66 | Not Qualified | - | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | ARM | 500000 | - | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 512KB | 1.7mm | 17mm | 17mm | RoHS Compliant | Lead Free | ||
M2S050-1VF400 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S050-FG896 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 896-BGA | - | - | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
M2S090T-FG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 90K Logic Modules | 86316 | - | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | - | ||
M2S010T-FGG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 233 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 233 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 10K Logic Modules | 12084 | - | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | - | ||
A2F500M3G-FG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 484-BGA | - | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 80MHz | - | A2F500M3G | - | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | 2mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | - | - | - | ARM | 500000 | 100MHz | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 512KB | - | - | - | Non-RoHS Compliant | - | ||
M2S025T-FGG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Modules | 27696 | - | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | - | ||
M2S050-1FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | 325-TFBGA, CSPBGA | YES | - | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | - | ||
M2S025-1FG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | - | 484 | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025 | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 25K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
M2S050T-1FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | 325-TFBGA, CSPBGA | YES | - | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | - | ||
M2S090-1FG484 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S090 | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | FIELD PROGRAMMABLE GATE ARRAY | ARM | - | - | - | FPGA - 90K Logic Modules | 86316 | - | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | Contains Lead | ||
M2S050T-VF400I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | 400-LFBGA | YES | - | - | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 50K Logic Modules | 56340 | - | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | - | ||
M2S050-1VFG400 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | RoHS Compliant | - | ||
M2S050TS-1FG896I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 896-BGA | - | - | 896-FBGA (31x31) | 377 | -40°C~100°C TJ | Tray | 2013 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050TS | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | Non-RoHS Compliant | - | ||
 M2S090T-FG676I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 676-BGA | YES | - | - | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | - | Active | 3 (168 Hours) | 676 | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | - | 1.2V | 1mm | - | - | - | - | S-PBGA-B676 | - | - | - | 1.26V | - | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 90K Logic Modules | - | - | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | - |