- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S090T-1FG676I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 676-BGA | YES | - | - | 425 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | - | - | - | FPGA - 90K Logic Modules | - | 86316 | 512KB | 2.44mm | 27mm | 27mm | - | Non-RoHS Compliant | - | ||
 M2S150T-1FC1152I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 1152-BBGA, FCBGA | YES | - | - | 574 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S150T | S-PBGA-B1152 | 574 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | - | - | - | FPGA - 150K Logic Modules | - | 146124 | 512KB | 2.9mm | 35mm | 35mm | - | Non-RoHS Compliant | - | ||
 M2S050-FGG484I Microsemi Corporation | In Stock | - | Datasheet | 4 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 56340 | 256KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | - | ||
 M2S025-1FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 325-TFBGA, CSPBGA | YES | - | - | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 27696 | 256KB | 1.01mm | 11mm | 11mm | - | Non-RoHS Compliant | - | ||
 M2S025T-1VF400 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S025T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 25K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
A2F500M3G-1FG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 484-BGA | - | 484 | - | MCU - 41, FPGA - 128 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | - | BOTTOM | BALL | 225 | 1.5V | - | - | 100MHz | 20 | A2F500M3G | - | 128 | - | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | - | 1mA | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | 500000 | - | 24 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | - | 512KB | 2.44mm | 23mm | 23mm | No | Non-RoHS Compliant | Contains Lead | ||
A2F500M3G-1FGG484I Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | Surface Mount | 484-BGA | - | 484 | - | MCU - 41, FPGA - 128 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e1 | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | - | 100MHz | 30 | A2F500M3G | - | 128 | Not Qualified | 1.5V | - | 1.51.82.53.3V | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | - | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | 5500 | ARM | 500000 | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 512KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | - | ||
M2S090-1FGG676I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 676-BGA | YES | - | - | 425 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | Matte Tin (Sn) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | 166MHz | NOT SPECIFIED | M2S090 | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | - | - | - | - | FPGA - 90K Logic Modules | - | 86316 | 512KB | 2.44mm | 27mm | 27mm | - | RoHS Compliant | - | ||
M2S050T-1VFG400I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | RoHS Compliant | - | ||
 M2S050T-1FGG896 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 896-BGA | - | - | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | RoHS Compliant | Lead Free | ||
M2S050-1FGG896I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 896-BGA | - | - | 896-FBGA (31x31) | 377 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | RoHS Compliant | - | ||
M2S050-1VF400I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | Contains Lead | ||
M2S050T-1FG896I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 896-BGA | - | 896 | 896-FBGA (31x31) | 377 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
A2F500M3G-FGG484I Microsemi Corporation | 305 | - | Datasheet | 12 Weeks | - | Surface Mount | 484-BGA | - | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 80MHz | - | A2F500M3G | - | - | - | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | - | - | 5500 | ARM | 500000 | 100MHz | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 512KB | - | - | - | - | RoHS Compliant | Lead Free | ||
M2S050T-FGG484I Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | - | 484-BGA | YES | - | - | 267 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 56340 | 256KB | 2.44mm | 23mm | 23mm | - | RoHS Compliant | - | ||
M2S010T-FG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 484-BGA | YES | - | - | 233 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 233 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 10K Logic Modules | - | 12084 | 256KB | 2.44mm | 23mm | 23mm | - | Non-RoHS Compliant | - | ||
M2S025T-FCS325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | - | - | 325-TFBGA, CSPBGA | YES | - | - | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 27696 | 256KB | 1.01mm | 11mm | 11mm | - | Non-RoHS Compliant | - | ||
A2F500M3G-1FG484 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | - | - | 484-BGA | - | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | 0°C~85°C TJ | Tray | 2009 | SmartFusion® | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 100MHz | - | A2F500M3G | - | - | - | 1.5V | - | - | - | EBI/EMI, Ethernet, I2C, SPI, UART, USART | - | - | - | 1mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | MCU, FPGA | - | - | - | ARM | 500000 | 120MHz | 24 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | - | 512KB | - | - | - | No | Non-RoHS Compliant | - | ||
M2S050T-FCS325 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | - | 325-TFBGA, CSPBGA | YES | - | - | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | - | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 56340 | 256KB | 1.01mm | 11mm | 11mm | - | Non-RoHS Compliant | - | ||
M2S010T-1FG484 Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | - | 484-BGA | - | - | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S010T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | ARM | - | - | - | - | FPGA - 10K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - |