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  • Moisture Sensitivity Level (MSL)
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  • Part Status
  • Peripherals
  • Primary Attributes

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Microsemi Embedded - System On Chip (SoC)

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Factory Lead Time

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Number of I/Os

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Frequency

Time@Peak Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Number of Outputs

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Speed

RAM Size

Core Processor

Peripherals

Propagation Delay

Connectivity

Architecture

Number of Inputs

Programmable Logic Type

Number of Logic Elements/Cells

Core Architecture

Number of Gates

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Primary Attributes

Number of Registers

Max Junction Temperature (Tj)

Number of Logic Cells

Flash Size

Height

Height Seated (Max)

Length

Width

Radiation Hardening

RoHS Status

Lead Free

M2S050T-1VFG400I
M2S050T-1VFG400I

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

400-LFBGA

-

400

400-VFBGA (17x17)

-

207

-40°C~100°C TJ

Tray

-

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

RoHS Compliant

-

M2S050T-1FGG896
M2S050T-1FGG896

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

896-BGA

-

-

896-FBGA (31x31)

-

377

0°C~85°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

RoHS Compliant

Lead Free

M2S050-1FGG896I
M2S050-1FGG896I

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

896-BGA

-

-

896-FBGA (31x31)

-

377

-40°C~100°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

RoHS Compliant

-

M2S050-1VF400I
M2S050-1VF400I

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

400-LFBGA

-

400

400-VFBGA (17x17)

-

207

-40°C~100°C TJ

Tray

-

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

Contains Lead

M2S050T-1FG896I
M2S050T-1FG896I

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

896-BGA

-

896

896-FBGA (31x31)

-

377

-40°C~100°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050T

-

-

-

1.2V

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

1.26V

1.14V

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-

M2S010-VFG256
M2S010-VFG256

Microsemi Corporation

In Stock

-

Datasheet

11 Weeks

IN PRODUCTION (Last Updated: 2 days ago)

256-LBGA

YES

-

-

FLASH

138

0°C~85°C TJ

Tray

2015

SmartFusion®2

e3

-

Active

3 (168 Hours)

256

MATTE TIN

-

-

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1.2V

0.8mm

-

340MHz

NOT SPECIFIED

-

S-PBGA-B256

138

Not Qualified

-

-

1.2V

-

-

3.45V

1.14V

256kB

-

-

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

3.316 ns

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

138

FIELD PROGRAMMABLE GATE ARRAY

12084

-

-

-

-

-

FPGA - 10K Logic Modules

-

85°C

-

256KB

1.56mm

-

14mm

14mm

-

RoHS Compliant

Lead Free

M2S010-TQG144I
M2S010-TQG144I

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 2 days ago)

144-LQFP

YES

-

-

-

84

-40°C~100°C TJ

Tray

2015

SmartFusion®2

e3

yes

Active

3 (168 Hours)

144

MATTE TIN

-

-

-

8542.39.00.01

QUAD

GULL WING

NOT SPECIFIED

1.2V

0.5mm

-

-

NOT SPECIFIED

-

S-PQFP-G144

-

-

-

1.26V

-

1.14V

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

FPGA - 10K Logic Modules

-

-

-

256KB

-

1.6mm

20mm

20mm

-

RoHS Compliant

-

M2S010-VF400
M2S010-VF400

Microsemi Corporation

In Stock

-

Datasheet

11 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

400-LFBGA

-

400

400-VFBGA (17x17)

-

195

0°C~85°C TJ

Tray

-

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S010

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 10K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-

M2S010T-VF400
M2S010T-VF400

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

400-LFBGA

-

400

400-VFBGA (17x17)

-

195

0°C~85°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S010T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 10K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-

M2S010T-FG484
M2S010T-FG484

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 3 weeks ago)

484-BGA

-

-

484-FPBGA (23x23)

-

233

0°C~85°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S010T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 10K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-

M2S010-VF400I
M2S010-VF400I

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

400-LFBGA

YES

-

-

-

195

-40°C~100°C TJ

Tray

2015

SmartFusion®2

e0

-

Active

3 (168 Hours)

400

Tin/Lead (Sn/Pb)

-

-

-

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1.2V

0.8mm

not_compliant

-

NOT SPECIFIED

-

S-PBGA-B400

195

Not Qualified

-

1.26V

1.2V

1.14V

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

195

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

FPGA - 10K Logic Modules

-

-

12084

256KB

-

1.51mm

17mm

17mm

-

Non-RoHS Compliant

-

A2F200M3F-1FG484
A2F200M3F-1FG484

Microsemi Corporation

In Stock

-

Datasheet

12 Weeks

-

484-BGA

-

484

484-FPBGA (23x23)

-

MCU - 41, FPGA - 94

0°C~85°C TJ

Tray

2009

SmartFusion®

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

100MHz

-

A2F200

-

-

-

-

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

-

1mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

-

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

-

ARM

200000

120MHz

8

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

-

-

256KB

-

-

-

-

No

Non-RoHS Compliant

-

M2S010T-1VF400I
M2S010T-1VF400I

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 3 weeks ago)

400-LFBGA

-

400

400-VFBGA (17x17)

-

195

-40°C~100°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

166MHz

-

M2S010T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 10K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-

A2F500M3G-1FG256
A2F500M3G-1FG256

Microsemi Corporation

In Stock

-

Datasheet

12 Weeks

-

256-LBGA

-

256

256-FPBGA (17x17)

-

MCU - 25, FPGA - 66

0°C~85°C TJ

Tray

2009

SmartFusion®

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

100MHz

-

A2F500M3G

-

-

-

1.5V

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

-

-

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

-

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

-

ARM

500000

120MHz

24

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

-

-

512KB

-

-

-

-

No

Non-RoHS Compliant

-

M2S025-FG484
M2S025-FG484

Microsemi Corporation

In Stock

-

Datasheet

11 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

484-BGA

-

-

484-FPBGA (23x23)

-

267

0°C~85°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S025

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 25K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-

M2S050T-FCS325I
M2S050T-FCS325I

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 2 weeks ago)

325-TFBGA, CSPBGA

YES

-

-

-

200

-40°C~100°C TJ

Tray

2015

SmartFusion®2

e0

-

Active

3 (168 Hours)

325

Tin/Lead (Sn/Pb)

-

-

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1.2V

0.5mm

not_compliant

-

NOT SPECIFIED

-

S-PBGA-B325

200

Not Qualified

-

1.26V

1.2V

1.14V

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

200

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

-

56340

256KB

-

1.01mm

11mm

11mm

-

Non-RoHS Compliant

-

M2S050T-1FCS325I
M2S050T-1FCS325I

Microsemi Corporation

In Stock

-

Datasheet

10 Weeks

IN PRODUCTION (Last Updated: 2 weeks ago)

325-TFBGA, CSPBGA

YES

-

-

-

200

-40°C~100°C TJ

Tray

2015

SmartFusion®2

e0

-

Active

3 (168 Hours)

325

Tin/Lead (Sn/Pb)

-

-

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1.2V

0.5mm

not_compliant

-

NOT SPECIFIED

-

S-PBGA-B325

200

Not Qualified

-

1.26V

1.2V

1.14V

-

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

200

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

-

-

FPGA - 50K Logic Modules

-

-

56340

256KB

-

1.01mm

11mm

11mm

-

Non-RoHS Compliant

-

M2S050T-1FGG896I
M2S050T-1FGG896I

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

896-BGA

-

896

896-FBGA (31x31)

-

377

-40°C~100°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050T

-

-

-

1.2V

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

1

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

RoHS Compliant

-

M2S050T-1FGG484
M2S050T-1FGG484

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

484-BGA

-

-

484-FPBGA (23x23)

-

267

0°C~85°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

RoHS Compliant

-

M2S050T-1FG896
M2S050T-1FG896

Microsemi Corporation

In Stock

-

Datasheet

8 Weeks

IN PRODUCTION (Last Updated: 1 month ago)

896-BGA

-

-

896-FBGA (31x31)

-

377

0°C~85°C TJ

Tray

2009

SmartFusion®2

-

-

Active

3 (168 Hours)

-

-

85°C

0°C

-

-

-

-

-

-

-

-

166MHz

-

M2S050T

-

-

-

-

-

-

-

CAN, Ethernet, I2C, SPI, UART, USART, USB

-

-

-

-

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

CANbus, Ethernet, I2C, SPI, UART/USART, USB

MCU, FPGA

-

-

-

ARM

-

-

-

-

FPGA - 50K Logic Modules

-

-

-

256KB

-

-

-

-

-

Non-RoHS Compliant

-