- Architecture
- Connectivity
- Core Processor
- Flash Size
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
Attribute column
Manufacturer
Microsemi Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Propagation Delay | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Primary Attributes | Max Junction Temperature (Tj) | Number of Logic Cells | Flash Size | Height | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S025-FG484I Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | - | 484-BGA | YES | - | - | - | 267 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | 27696 | 256KB | - | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | - | ||
 M2S050-VF400 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | - | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
M2S025T-FG484I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | - | - | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | 27696 | 256KB | - | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | - | ||
 M2S050-1FCS325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | - | - | 200 | -40°C~100°C TJ | Tray | - | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | - | 56340 | 256KB | - | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | - | ||
M2S025T-VFG400I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | - | - | - | 207 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 400 | MATTE TIN | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Modules | - | 27696 | 256KB | - | 1.51mm | 17mm | 17mm | RoHS Compliant | - | ||
M2S050T-FG484 Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | - | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050T | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
M2S050-FG484I Microsemi Corporation | In Stock | - | Datasheet | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | - | 484-FPBGA (23x23) | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
M2S050-1VFG400I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | - | 207 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | RoHS Compliant | - | ||
M2S090-FCSG325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | - | - | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 325 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | R-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | - | 86316 | 512KB | - | 1.16mm | 13.5mm | 11mm | RoHS Compliant | - | ||
 M2S050-1FG896I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | - | - | 896-FBGA (31x31) | - | 377 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
M2S050TS-1FG484I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | - | 484 | 484-FPBGA (23x23) | - | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S050TS | - | - | - | 1.2V | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | FPGA - 50K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - | ||
M2S060TS-1VF400I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | - | - | - | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 60K Logic Modules | - | 56520 | 256KB | - | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | - | ||
 M2S090-FG676I Microsemi Corporation | In Stock | - | Datasheet | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | - | - | - | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | - | NOT SPECIFIED | - | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | - | 86316 | 512KB | - | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | - | ||
 M2S150-FC1152 Microsemi Corporation | In Stock | - | Datasheet | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | - | - | - | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S150 | S-PBGA-B1152 | 574 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | FPGA - 150K Logic Modules | - | 146124 | 512KB | - | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | - | ||
M2S090-1FG676I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | - | - | - | 425 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S090 | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | FPGA - 90K Logic Modules | - | 86316 | 512KB | - | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | - | ||
M2S090-1FG676 Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | - | - | - | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S090 | S-PBGA-B676 | 425 | Not Qualified | - | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | - | ARM | FPGA - 90K Logic Modules | - | 86316 | 512KB | - | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | - | ||
M2S090T-FCS325I Microsemi Corporation | In Stock | - | Datasheet | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | - | - | - | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | - | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | - | NOT SPECIFIED | - | R-PBGA-B325 | 180 | Not Qualified | - | 1.26V | 1.2V | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | - | 86316 | 512KB | - | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | - | ||
 M2S010-VFG256 Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 256-LBGA | YES | - | - | FLASH | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | - | Active | 3 (168 Hours) | 256 | MATTE TIN | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | - | 340MHz | NOT SPECIFIED | - | S-PBGA-B256 | 138 | Not Qualified | - | - | 1.2V | - | - | 3.45V | 1.14V | 256kB | - | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 3.316 ns | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | FPGA - 10K Logic Modules | 85°C | - | 256KB | 1.56mm | - | 14mm | 14mm | RoHS Compliant | Lead Free | ||
 M2S010-TQG144I Microsemi Corporation | In Stock | - | Datasheet | 8 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 144-LQFP | YES | - | - | - | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 144 | MATTE TIN | - | - | - | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | - | - | NOT SPECIFIED | - | S-PQFP-G144 | - | - | - | 1.26V | - | 1.14V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 10K Logic Modules | - | - | 256KB | - | 1.6mm | 20mm | 20mm | RoHS Compliant | - | ||
M2S010-VF400 Microsemi Corporation | In Stock | - | Datasheet | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | - | 400 | 400-VFBGA (17x17) | - | 195 | 0°C~85°C TJ | Tray | - | SmartFusion®2 | - | - | Active | 3 (168 Hours) | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | 166MHz | - | M2S010 | - | - | - | - | - | - | - | CAN, Ethernet, I2C, SPI, UART, USART, USB | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | ARM | FPGA - 10K Logic Modules | - | - | 256KB | - | - | - | - | Non-RoHS Compliant | - |