- Ihs Manufacturer
- Memory IC Type
- Package Description
- Part Life Cycle Code
- Reach Compliance Code
- JESD-30 Code
- Manufacturer Part Number
- Memory Density
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
Attribute column
Manufacturer
Microsemi Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Material | Number of Terminals | Access Time-Max | Adjustment range (amperage) | Amperage adjustment range (max.) | Amperage adjustment range (min.) | Base Product Number | Clock Frequency-Max (fCLK) | Content | Diameter before shrinkage | Diameter of protected wire (cable) | Dim | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Max. temperature | Mfr | Min. temperature | No. of pins | Number of auxiliary contacts as normally closed contact | Number of auxiliary contacts as normally open contact | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Rated permanent current Iu | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | RoHS-compliant | Supply Voltage-Nom (Vsup) | Switching voltage (max.) | Usage Level | Voltage, Rating | Packaging | Series | Tolerance | ECCN Code | Temperature Coefficient | Type | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Color | Additional Feature | HTS Code | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Depth | Reach Compliance Code | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Alternate Memory Width | Refresh Cycles | Access Mode | Self Refresh | Height | Length | Width |
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 24AA04TSN Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
EDI88130CS55CB Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
WE512K8-150CIA Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MERCURY SYSTEMS INC | - | WE512K8-150CIA | - | - | - | - | - | - | - | - | - | - | - | - | - | , | - | - | - | Active | - | - | - | 5.69 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | EEPROM MODULE | 5 V | - | - | - | - | - | - | - | ||
W3H128M72E-400SBM Microsemi | In Stock | - | - | - | - | - | - | 40 - 100 A | 100A | 40A | - | - | 1pc(s) | - | - | (W x H x D) 105 x 198 x 86 mm | - | - | - | +70°C | - | -25°C | 3-pin | 0 | 0 | - | - | - | - | - | - | - | - | - | - | - | - | - | 100A | - | - | - | Yes | - | 600V AC | - | - | - | - | - | - | - | 3VA6210-6JT31-0AA0 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 86mm | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 198mm | - | 105mm | ||
MAX24710EXG+PROG Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
93AA46CI/MS Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 150 V | - | - | 0.5 % | - | 100 ppm/°C | - | 2.7 Ω | 155 °C | -55 °C | Thin Film | - | - | - | 500 mW | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 650 µm | - | - | ||
MAX24310EXG+PROG Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
WS512K32N-17H1QA Microsemi | In Stock | - | - | NO | - | 66 | 17 ns | - | - | - | DTS20Z11 | - | - | - | - | - | WHITE MICROELECTRONICS | White Microelectronics | WS512K32N-17H1QA | - | TE Connectivity Deutsch Connectors | - | - | - | - | 524288 words | 512000 | 125 °C | -55 °C | Bag | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, HIP-66 | - | SQUARE | IN-LINE | Transferred | Active | - | - | 5.55 | - | - | 5 V | - | Military grade | - | - | * | - | - | - | - | - | - | - | - | - | USER CONFIGURABLE AS 2M X 8 | - | - | CMOS | HEX | PIN/PEG | - | 1 | - | - | unknown | S-CHIP-P66 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | - | 512KX32 | - | - | 32 | - | 16777216 bit | MIL-STD-883 | PARALLEL | - | SRAM MODULE | - | 16 | - | - | - | - | - | - | ||
WSF512K32-29G2TIA Microsemi | In Stock | - | - | YES | - | 68 | - | - | - | - | - | - | - | - | - | - | MERCURY SYSTEMS INC | Miscellaneous | WSF512K32-29G2TIA | - | - | - | - | - | - | 524288 words | 512000 | 85 °C | -40 °C | - | CERAMIC, METAL-SEALED COFIRED | QFP | QFP, | - | SQUARE | FLATPACK | Obsolete | - | - | - | 5.66 | No | - | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SRAM IS ORGANISED AS 512K X 32 | 8542.32.00.71 | - | CMOS | QUAD | GULL WING | - | 1 | 1.27 mm | - | unknown | S-CQFP-G68 | - | 5.5 V | INDUSTRIAL | 4.5 V | - | ASYNCHRONOUS | - | 512KX32 | - | 4.57 mm | 32 | - | 16777216 bit | - | - | - | MEMORY CIRCUIT | - | - | - | - | - | - | 22.36 mm | 22.36 mm | ||
W3H32M72E-400SBM Microsemi Corporation | In Stock | - | Datasheet | YES | synthetic polyolefin | 208 | 0.6 ns | - | - | - | - | 200 MHz | - | 10.5 mm | 5.2…9.0 mm | - | MICROSEMI CORP | - | - | - | - | - | - | - | - | 33554432 words | 32000000 | 125 °C | -55 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA208,11X19,40 | BGA208,11X19,40 | RECTANGULAR | GRID ARRAY | Transferred | - | - | - | - | - | - | 1.8 V | - | - | - | spool 100 m | - | - | EAR99 | - | Heat shrink tubing without adhesive | - | - | - | - | black | - | 8542.32.00.36 | - | - | BOTTOM | BALL | - | - | 1 mm | - | compliant | R-PBGA-B208 | Not Qualified | - | MILITARY | - | - | - | 1.7 mA | 32MX72 | 3-STATE | - | 72 | 0.035 A | 2415919104 bit | - | - | COMMON | DDR DRAM MODULE | - | - | 8192 | - | - | - | - | - | ||
W3H32M64E-400SBI Microsemi | In Stock | - | - | YES | - | 208 | 0.6 ns | - | - | - | - | - | - | - | - | - | MERCURY SYSTEMS INC | Mercury Systems Inc | W3H32M64E-400SBI | - | - | - | - | - | - | 33554432 words | 32000000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Contact Manufacturer | - | - | 30 | 5.18 | - | - | 1.8 V | - | - | - | - | - | - | EAR99 | - | - | - | - | - | - | - | AUTO/SELF REFRESH | 8542.32.00.36 | - | CMOS | BOTTOM | BALL | 225 | 1 | - | - | unknown | R-PBGA-B208 | Not Qualified | 1.9 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | - | 32MX64 | - | - | 64 | - | 2147483648 bit | - | - | - | DDR DRAM | - | - | - | FOUR BANK PAGE BURST | YES | - | - | - | ||
EDI88512CA-55CB Microsemi | In Stock | - | - | NO | - | 32 | 55 ns | - | - | - | - | - | - | - | - | - | MERCURY SYSTEMS INC | Mercury Systems Inc | EDI88512CA55CB | - | - | - | - | - | - | 524288 words | 512000 | 125 °C | -55 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | - | - | - | 5.58 | - | - | 5 V | - | - | - | - | - | - | 3A001.A.2.C | - | - | - | - | - | - | - | - | 8542.32.00.41 | - | CMOS | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | - | unknown | R-CDIP-T32 | - | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | - | 512KX8 | - | 3.937 mm | 8 | - | 4194304 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | 40.64 mm | 15.24 mm | ||
5962-9318706H5A Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
EDI8L32512C15AC Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
EDI8L32512C17AI Microsemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
W332M64V-133BI Microsemi | In Stock | - | - | YES | - | 219 | 5.5 ns | - | - | - | - | - | - | - | - | - | MERCURY SYSTEMS INC | Mercury Systems Inc | W332M64V-133BI | - | - | - | - | - | - | 33554432 words | 32000000 | 85 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | - | 30 | 5.37 | - | - | 3.3 V | - | - | - | - | - | - | EAR99 | - | - | - | - | - | - | - | AUTO/SELF REFRESH | 8542.32.00.36 | - | CMOS | BOTTOM | BALL | 225 | 1 | - | - | unknown | S-PBGA-B219 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | 1 | SYNCHRONOUS | - | 32MX64 | - | - | 64 | - | 2147483648 bit | - | - | - | SYNCHRONOUS DRAM | - | - | - | FOUR BANK PAGE BURST | YES | - | - | - |