- Speed
- HTS Code
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Package Body Material
- Package Code
- Package Style
- Surface Mount
- Terminal Form
- Terminal Position
- JESD-30 Code
Attribute column
Manufacturer
MOTOROLA Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Material | Number of Terminals | Clock Frequency-Max | Gross weight | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Thread | Transport packaging size/quantity | JESD-609 Code | ECCN Code | Type | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of External Interrupts | Shaft diameter | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XPC8255AZUMHBA Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 480 | 66.66 MHz | - | MOTOROLA INC | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Transferred | - | - | 2.1 V | 1.9 V | 2 V | - | - | - | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | - | S-PBGA-B480 | Not Qualified | COMMERCIAL | 266 MHz | MICROPROCESSOR, RISC | - | 32 | 1.65 mm | 32 | YES | - | 64 | FLOATING POINT | YES | - | - | - | 37.5 mm | 37.5 mm | ||
XPC755BRX300LB Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 360 | 300 MHz | - | MOTOROLA INC | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | - | 2.1 V | 1.9 V | 2 V | - | - | - | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | - | S-CBGA-B360 | Not Qualified | - | 300 MHz | MICROPROCESSOR, RISC | - | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | 25 mm | 25 mm | ||
XPC860ENZP66C1 Motorola Mobility LLC | In Stock | - | Datasheet | YES | - | 357 | 66 MHz | - | MOTOROLA INC | - | - | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.465 V | 3.135 V | 3.3 V | - | - | e0 | 3A991.A.2 | - | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | - | 66 MHz | MICROPROCESSOR, RISC | - | 32 | 2.05 mm | 32 | - | - | 32 | - | - | - | - | - | 25 mm | 25 mm | ||
MC6800CLD Motorola Semiconductor Products | In Stock | - | Datasheet | NO | - | 40 | - | - | MOTOROLA INC | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | - | R-XDIP-T40 | - | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC860ENZP50D3 Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 357 | 50 MHz | - | MOTOROLA INC | - | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | No | 3.465 V | 3.135 V | 3.3 V | - | - | e0 | 3A991.A.2 | - | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | - | S-PBGA-B357 | Not Qualified | - | 50 MHz | MICROPROCESSOR, RISC | - | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | - | - | - | 25 mm | 25 mm | ||
MC68030RC25B Motorola Semiconductor Products | 35 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PCF5232CAB80 Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 160 | - | - | MOTOROLA INC | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP160,1.2SQ | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | - | No | - | - | - | - | - | e0 | - | - | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.635 mm | unknown | - | S-PQFP-G160 | Not Qualified | INDUSTRIAL | 80 MHz | MICROPROCESSOR, RISC | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | ||
PCC5E0RX266WB0B Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 840 | - | - | MOTOROLA INC | - | - | PLASTIC/EPOXY | BGA | BGA, BGA840,29X29,40 | BGA840,29X29,40 | SQUARE | GRID ARRAY | Obsolete | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | - | S-PBGA-B840 | Not Qualified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MC9328MXLDVH20 Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 256 | 16 MHz | - | MOTOROLA INC | 70 °C | -30 °C | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | - | No | 2 V | 1.8 V | 1.9 V | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | - | S-PBGA-B256 | Not Qualified | OTHER | 200 MHz | MICROPROCESSOR, RISC | - | 32 | 1.6 mm | 25 | YES | YES | 32 | FIXED POINT | YES | - | - | - | 14 mm | 14 mm | ||
XC7455ARX1250PF Motorola Semiconductor Products | In Stock | - | Datasheet | - | - | - | - | - | MOTOROLA INC | - | - | - | - | , | - | - | - | Transferred | - | - | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XC7455CRX933LF Motorola Mobility LLC | In Stock | - | Datasheet | YES | - | 483 | 133 MHz | - | MOTOROLA INC | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | BGA | - | 1.35 V | 1.25 V | 1.3 V | - | - | - | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 483 | S-CBGA-B483 | Not Qualified | - | 933 MHz | MICROPROCESSOR, RISC | - | 32 | 3.2 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | 29 mm | 29 mm | ||
 MC68HC001FC10 Motorola Mobility LLC | In Stock | - | Datasheet | YES | - | 68 | 10 MHz | - | MOTOROLA INC | 70 °C | - | PLASTIC/EPOXY | BQFP | BQFP, SPQFP68,.7SQ | SPQFP68,.7SQ | SQUARE | FLATPACK, BUMPER | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | - | - | e0 | - | - | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.635 mm | unknown | 68 | S-PQFP-G68 | Not Qualified | COMMERCIAL | 10 MHz | MICROPROCESSOR | 30 mA | 32 | 3.04 mm | 24 | NO | NO | 16 | FIXED POINT | NO | 0 | 3 | - | 13.97 mm | 13.97 mm | ||
MC68EC040RC40 Motorola Semiconductor Products | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC8240RZU250D Motorola Semiconductor Products | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
XPC7450RX600LE Motorola Semiconductor Products | In Stock | - | Datasheet | YES | - | 483 | 133 MHz | - | MOTOROLA INC | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483 | - | SQUARE | GRID ARRAY | Obsolete | - | - | 1.85 V | 1.55 V | 1.6 V | - | - | - | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | - | S-CBGA-B483 | Not Qualified | - | 600 MHz | MICROPROCESSOR, RISC | - | 32 | 3.22 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | 29 mm | 29 mm | ||
XCF5202PU33A Motorola Semiconductor Products | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 XPC850SRCZT66BU Motorola Mobility LLC | In Stock | - | Datasheet | YES | Brass | 256 | 33 MHz | 1.35 | MOTOROLA INC | - | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,50 | BGA256,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | - | 3.465 V | 3.135 V | 3.3 V | M5 | 28.5*21*19/5000 | - | 3A991.A.2 | Threaded bushing with hole series BN1035 | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | - | 66 MHz | MICROPROCESSOR, RISC | - | 32 | 2.35 mm | 26 | YES | YES | 32 | FIXED POINT | YES | - | - | 5.5 mm | 23 mm | 23 mm | ||
XPC755BRX300LE Motorola Mobility LLC | In Stock | - | Datasheet | YES | - | 360 | 100 MHz | - | MOTOROLA INC | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | BGA | - | 2.1 V | 1.8 V | 2 V | - | - | - | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | Not Qualified | - | 300 MHz | MICROPROCESSOR, RISC | - | 32 | 3.2 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | 25 mm | 25 mm | ||
XPC7400RX500PK Motorola Semiconductor Products | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 XC7445ARX733LF Motorola Mobility LLC | In Stock | - | Datasheet | YES | - | 360 | 133 MHz | - | MOTOROLA INC | - | - | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | BGA | - | 1.35 V | 1.25 V | 1.3 V | - | - | - | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | Not Qualified | - | 733 MHz | MICROPROCESSOR, RISC | - | 32 | 3.2 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | - | - | - | 25 mm | 25 mm |