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  • Operating Temperature-Min
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Datasheet

RoHS

Surface Mount

Number of Terminals

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Ihs Manufacturer

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Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

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Part Life Cycle Code

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Rohs Code

Supply Voltage-Nom (Vsup)

JESD-609 Code

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HTS Code

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Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

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Reach Compliance Code

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Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Operating Mode

Supply Current-Max

Organization

Seated Height-Max

Memory Width

Standby Current-Max

Memory Density

Memory IC Type

Mixed Memory Type

Length

Width

In Stock

-

Datasheet

YES

64

70 ns

SPANSION INC

3

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-64

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

3 V

e1

EAR99

TIN SILVER COPPER

-

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

64

R-PBGA-B64

Not Qualified

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

-

8MX16

1.2 mm

16

-

134217728 bit

MEMORY CIRCUIT

FLASH+PSRAM

11.6 mm

8 mm

In Stock

-

Datasheet

-

-

-

SPANSION INC

-

-

-

-

-

-

-

,

-

-

-

Obsolete

-

Yes

-

-

EAR99

-

-

8542.32.00.71

-

-

260

-

-

unknown

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

Datasheet

YES

84

70 ns

SPANSION INC

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

3 V

e1

EAR99

TIN SILVER COPPER

-

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

Not Qualified

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

-

16MX16

1.2 mm

16

-

268435456 bit

MEMORY CIRCUIT

FLASH+PSRAM

11.6 mm

8 mm

In Stock

-

Datasheet

YES

64

-

SPANSION INC

3

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

3 V

e1

EAR99

TIN SILVER COPPER

PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

64

R-PBGA-B64

Not Qualified

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

-

8MX16

1.2 mm

16

-

134217728 bit

MEMORY CIRCUIT

-

11.6 mm

8 mm

In Stock

-

Datasheet

YES

56

-

SPANSION INC

-

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

-

EAR99

-

PSRAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

56

R-PBGA-B56

Not Qualified

1.95 V

OTHER

1.7 V

SYNCHRONOUS

-

16MX16

1.2 mm

16

-

268435456 bit

MEMORY CIRCUIT

-

9.2 mm

8 mm

In Stock

-

Datasheet

YES

84

-

SPANSION INC

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

EAR99

TIN SILVER COPPER

PSRAM IS ALSO ORGANIZED AS 4M X 16

8542.32.00.71

BOTTOM

BALL

-

1

0.8 mm

compliant

-

84

R-PBGA-B84

Not Qualified

1.95 V

OTHER

1.7 V

SYNCHRONOUS

-

16MX16

1.2 mm

16

-

268435456 bit

MEMORY CIRCUIT

-

11.6 mm

8 mm

In Stock

-

Datasheet

YES

56

-

SPANSION INC

-

-

-

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA56,10X14,20

BGA56,10X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

Transferred

-

Yes

1.8 V

-

EAR99

-

-

8542.32.00.71

BOTTOM

BALL

260

-

0.5 mm

unknown

40

-

R-PBGA-B56

Not Qualified

-

OTHER

-

-

-

-

-

-

-

-

MEMORY CIRCUIT

FLASH+PSRAM

-

-

In Stock

-

Datasheet

YES

84

-

SPANSION INC

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

EAR99

TIN SILVER COPPER

PSRAM IS ALSO ORGANIZED AS 4M X 16

8542.32.00.71

BOTTOM

BALL

-

1

0.8 mm

compliant

-

84

R-PBGA-B84

Not Qualified

1.95 V

OTHER

1.7 V

SYNCHRONOUS

-

16MX16

1.2 mm

16

-

268435456 bit

MEMORY CIRCUIT

-

11.6 mm

8 mm

In Stock

-

Datasheet

YES

84

80 ns

SPANSION INC

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

EAR99

TIN SILVER COPPER

PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

Not Qualified

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

0.054 mA

16MX16

1.2 mm

16

0.00007 A

268435456 bit

MEMORY CIRCUIT

FLASH+PSRAM

11.6 mm

8 mm

In Stock

-

Datasheet

YES

56

-

SPANSION INC

-

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

-

EAR99

-

PSRAM IS ORGANIZED AS 8M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

56

R-PBGA-B56

Not Qualified

1.95 V

OTHER

1.7 V

SYNCHRONOUS

-

16MX16

1.2 mm

16

-

268435456 bit

MEMORY CIRCUIT

-

9.2 mm

8 mm

In Stock

-

Datasheet

YES

56

-

SPANSION INC

-

16 words

16

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

9.20 X 8 MM, 0.50 MM PITCH, LEAD FREE, VFBGA-56

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

-

EAR99

-

PSRAM IS ORGANIZED AS 8M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

compliant

40

56

R-PBGA-B56

Not Qualified

1.95 V

OTHER

1.7 V

SYNCHRONOUS

-

16X16

1.2 mm

16

-

256 bit

MEMORY CIRCUIT

-

9.2 mm

8 mm

In Stock

-

Datasheet

YES

73

-

SPANSION INC

3

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

LFBGA,

-

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

No

3 V

e0

EAR99

TIN LEAD

PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

-

1

0.8 mm

compliant

-

73

R-PBGA-B73

Not Qualified

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

-

4MX16

1.4 mm

16

-

67108864 bit

MEMORY CIRCUIT

-

11.6 mm

8 mm

In Stock

-

Datasheet

YES

52

-

SPANSION INC

-

-

-

85 °C

-25 °C

PLASTIC/EPOXY

-

, BGA52,6X10,20

BGA52,6X10,20

-

-

Obsolete

-

Yes

1.8 V

-

EAR99

-

-

8542.32.00.71

-

-

260

-

-

unknown

40

-

-

Not Qualified

-

OTHER

-

-

-

-

-

-

-

-

MEMORY CIRCUIT

FLASH+PSRAM

-

-

In Stock

-

Datasheet

YES

137

-

SPANSION INC

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

LFBGA,

-

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

EAR99

TIN SILVER COPPER

MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

compliant

40

137

R-PBGA-B137

Not Qualified

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

-

16MX16

1.4 mm

16

-

268435456 bit

MEMORY CIRCUIT

-

12 mm

9 mm

In Stock

-

Datasheet

YES

84

80 ns

SPANSION INC

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.8 V

e1

EAR99

TIN SILVER COPPER

PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

Not Qualified

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

0.054 mA

16MX16

1.2 mm

16

0.00007 A

268435456 bit

MEMORY CIRCUIT

FLASH+PSRAM

11.6 mm

8 mm

In Stock

-

Datasheet

-

-

-

SPANSION INC

-

-

-

-

-

-

-

-

-

-

-

Obsolete

-

Yes

-

-

EAR99

-

-

8542.32.00.71

-

-

260

-

-

unknown

40

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

In Stock

-

Datasheet

YES

64

-

SPANSION INC

-

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

No

3 V

e0

EAR99

TIN LEAD

PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

-

1

0.8 mm

compliant

-

64

R-PBGA-B64

Not Qualified

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

-

8MX16

1.2 mm

16

-

134217728 bit

MEMORY CIRCUIT

-

11.6 mm

8 mm

In Stock

-

Datasheet

YES

56

-

SPANSION INC

3

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

TFBGA,

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

3 V

e1

EAR99

TIN SILVER COPPER

PSRAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

-

1

0.8 mm

compliant

-

56

R-PBGA-B56

Not Qualified

3.1 V

COMMERCIAL EXTENDED

2.7 V

ASYNCHRONOUS

-

4MX16

1.2 mm

16

-

67108864 bit

MEMORY CIRCUIT

-

9 mm

7 mm

In Stock

-

Datasheet

YES

56

-

SPANSION INC

3

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

-

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

3 V

e1

EAR99

TIN SILVER COPPER

SRAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

56

R-PBGA-B56

Not Qualified

3.1 V

COMMERCIAL EXTENDED

2.7 V

ASYNCHRONOUS

-

4MX16

1.2 mm

16

-

67108864 bit

MEMORY CIRCUIT

-

9 mm

7 mm