- ECCN Code
- HTS Code
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Package Description
- Rohs Code
- Memory IC Type
- Number of Terminals
- Operating Temperature-Max
- Operating Temperature-Min
- Package Body Material
Attribute column
Manufacturer
spansion Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Organization | Seated Height-Max | Memory Width | Memory Density | Memory IC Type | Mixed Memory Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 S71PL032J40BAW0K2 Spansion | In Stock | - | Datasheet | YES | 56 | 65 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA56,8X8,32 | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 56 | R-PBGA-B56 | Not Qualified | 3.6 V | COMMERCIAL EXTENDED | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | MEMORY CIRCUIT | FLASH+PSRAM | 9 mm | 7 mm | ||
 S72NS512RD0AHGL03 Spansion | In Stock | - | Datasheet | - | - | - | SPANSION INC | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | Yes | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | 260 | - | - | unknown | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 S71PL129JC0BFW9B0 Spansion | In Stock | - | Datasheet | YES | 64 | - | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64 | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | EAR99 | TIN SILVER COPPER | PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
S71PL127JB0BAWQB0 Spansion | In Stock | - | Datasheet | YES | 64 | - | SPANSION INC | - | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | - | 3 V | - | - | EAR99 | - | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | unknown | - | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
S71PL064JB0BFWQB0 Spansion | In Stock | - | Datasheet | YES | 56 | 65 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 9 X 7 MM, 1.20 MM PITCH, LEAD FREE, FBGA-56 | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | Yes | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 56 | R-PBGA-B56 | Not Qualified | 3.6 V | COMMERCIAL EXTENDED | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | MEMORY CIRCUIT | FLASH+PSRAM | 9 mm | 7 mm | ||
S71GL032NA0BFW0U0 Spansion | In Stock | - | Datasheet | YES | 56 | - | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 1M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 56 | R-PBGA-B56 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | MEMORY CIRCUIT | - | 9 mm | 7 mm | ||
 S71PL256NC0HFW5U0 Spansion | In Stock | - | Datasheet | YES | 84 | 70 ns | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | EAR99 | TIN SILVER COPPER | - | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | FLASH+PSRAM | 11.6 mm | 8 mm | ||
S71NS256PB0ZJETV2 Spansion | In Stock | - | Datasheet | - | - | - | SPANSION INC | - | - | - | - | - | - | - | , | - | - | - | Transferred | - | Yes | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | 260 | - | - | unknown | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
S71VS256RC0ZHK2L0 Spansion | In Stock | - | Datasheet | YES | 56 | - | SPANSION INC | - | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | - | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | - | - | EAR99 | - | PSRAM IS ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PBGA-B56 | Not Qualified | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 7.7 mm | 6.2 mm | ||
S71GL256NB0BAWAZ3 Spansion | In Stock | - | Datasheet | YES | 84 | - | SPANSION INC | - | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | - | EAR99 | TIN LEAD | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 84 | R-PBGA-B84 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
S71PL127JB0BAW9Z Spansion | In Stock | - | Datasheet | YES | 64 | - | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | - | EAR99 | TIN LEAD | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
S72NS256PD0AJBLG2 Spansion | In Stock | - | Datasheet | YES | 133 | - | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e2 | - | EAR99 | TIN SILVER COPPER NICKEL | DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 133 | S-PBGA-B133 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.1 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 8 mm | 8 mm | ||
 S71NS256NC0BJWVN3 Spansion | In Stock | - | Datasheet | YES | 60 | - | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60 | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e2 | - | EAR99 | TIN SILVER COPPER NICKEL | PSRAM IS ORGANIZED AS 16M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 60 | R-PBGA-B60 | Not Qualified | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 11 mm | 10 mm | ||
S72NS256PD0AJBLG3 Spansion | In Stock | - | Datasheet | YES | 133 | - | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e2 | - | EAR99 | TIN SILVER COPPER NICKEL | DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 133 | S-PBGA-B133 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.1 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 8 mm | 8 mm | ||
S71WS256ND0BAWYM Spansion | In Stock | - | Datasheet | YES | 84 | - | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | - | EAR99 | TIN SILVER COPPER | PSRAM IS ALSO ORGANIZED AS 8M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 84 | R-PBGA-B84 | Not Qualified | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 12 mm | 9 mm | ||
S71NS128PC0ZHETV0 Spansion | In Stock | - | Datasheet | - | - | - | SPANSION INC | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | Yes | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | 260 | - | - | unknown | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
S71JL064H80BAW010 Spansion | In Stock | - | Datasheet | YES | 73 | - | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | - | EAR99 | TIN LEAD | STATIC RAM IS ORGANIZED AS 512K X 16/1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 73 | R-PBGA-B73 | Not Qualified | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
S71PL127JB0BFW9Z Spansion | In Stock | - | Datasheet | YES | 64 | - | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | EAR99 | TIN SILVER COPPER | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
S71GL512NC0BFWEZ2 Spansion | In Stock | - | Datasheet | YES | 84 | - | SPANSION INC | 3 | 33554432 words | 32000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 32MX16 | 1.2 mm | 16 | 536870912 bit | MEMORY CIRCUIT | - | 12 mm | 9 mm | ||
S71NS256PB0ZJETV0 Spansion | In Stock | - | Datasheet | YES | 56 | - | SPANSION INC | - | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | - | - | EAR99 | - | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PBGA-B56 | Not Qualified | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | MEMORY CIRCUIT | - | 9.2 mm | 8 mm |