- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MK60FN1M0VMD15 NXP USA Inc. | 400 |
| Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 58x16b; D/A 2x12b | 100 | - | 1048576 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK60FN1M0 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 150MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 MC9S08QE4CLC NXP USA Inc. | 15 | - | Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 10x12b | 26 | - | 4096 | -40°C~85°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08QE4 | S-PQFP-G32 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MKV10Z32VFM7 NXP USA Inc. | 8900 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 16x12b; D/A 1x12b | 28 | 8192 | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | S-PQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 75MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | NO | - | - | - | - | CORTEX-M0 | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MC908GR16CFAE NXP USA Inc. | 4344 |
| Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 37 | - | - | -40°C~85°C TA | Tray | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY AT 4.1MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC908GR16 | S-PQFP-G48 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 1K x 8 | 3V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32.8MHz | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MKL26Z32VFM4 NXP USA Inc. | 2191 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D - 16bit; D/A - 12bit | 23 | - | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL26Z32 | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 S9KEAZ128AMLK NXP USA Inc. | 26730 | - | - | 20 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b | 71 | - | - | -40°C~125°C TA | Tray | 2008 | Kinetis KEA | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | - | 40 | - | S-PQFP-G80 | - | 5.5V | - | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | - | YES | NO | YES | NO | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MKE06Z128VLK4 NXP USA Inc. | 8639 | - | - | 20 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b; D/A 2x6b | 71 | 16384 | 131072 | -40°C~105°C TA | Tray | 2002 | Kinetis KE06 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.65mm | 40 | - | S-PQFP-G80 | - | 5.5V | - | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | - | - | 8 | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MKE02Z16VLD2 NXP USA Inc. | 1760 | - | - | 20 Weeks | Surface Mount | 44-LQFP | YES | A/D 16x12b; D/A 2x6b | 37 | 2048 | 16384 | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | - | ROHS3 Compliant | ||
 MK22FX512VLL12 NXP USA Inc. | 1350 | - | Datasheet | - | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | - | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MK22FX512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | - | - | - | - | CORTEX-M4 | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK10DN64VLH5 NXP USA Inc. | 5 |
| - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 19x16b | 44 | - | 65536 | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN64 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
FS32K144HRT0MLLT NXP USA Inc. | 900 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | -40°C~125°C TA | Tray | 2011 | S32K | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
S9KEAZ64AMLH NXP USA Inc. | 7920 | - | Datasheet | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 57 | - | - | -40°C~125°C TA | Tray | 2012 | Kinetis KEA | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | NO | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S9KEAZN8AMTG NXP USA Inc. | 9504 | - | - | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 14 | - | - | -40°C~125°C TA | Tube | 2013 | Kinetis KEA | e3 | Active | 3 (168 Hours) | 24 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | R-XQCC-N24 | - | 5.5V | - | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | YES | - | - | - | - | - | - | 4mm | 4mm | ROHS3 Compliant | ||
FS32K144HRT0VLLT NXP USA Inc. | 1800 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | -40°C~105°C TA | Tray | 2011 | S32K | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MKL05Z8VFK4 NXP USA Inc. | 457 |
| Datasheet | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b; D/A 1x12b | 22 | - | 8192 | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | 12-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL05Z8 | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 1K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | 1mm | 4mm | 4mm | ROHS3 Compliant | ||
 MC68HC11E1CFNE3 NXP USA Inc. | 1456 | - | Datasheet | 17 Weeks | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | - | - | -40°C~85°C TA | Tube | 1999 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | MATTE TIN | SEATED HT-CALCULATED | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 40 | MC68HC11 | S-PQCC-J52 | - | 5.5V | - | 4.5V | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | - | POR, WDT | 12MHz | ROMless | 8-Bit | - | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | - | - | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | ||
MKE02Z64VLC4 NXP USA Inc. | 2 | - | - | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 16x12b; D/A 2x6b | 28 | 4096 | 65536 | -40°C~105°C TA | Tray | 2014 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | - | 40 | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | ROHS3 Compliant | ||
MC9S08PA4AVTG NXP USA Inc. | 14400 | - | Datasheet | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 14 | - | - | -40°C~105°C TA | Tube | 2012 | S08 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | - | R-PDSO-G16 | - | 5.5V | - | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | - | 128 x 8 | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 MK52DN512CLQ10 NXP USA Inc. | 32 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 41x16b; D/A 2x12b | 96 | - | 524288 | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK52DN512 | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | 20mm | 20mm | ROHS3 Compliant | ||
MK20DX256VLL10 NXP USA Inc. | 75 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | - | 262144 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX256 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant |