- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S12XEQ512CAL NXP USA Inc. | 1047 | - | Datasheet | 12 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | - | 524288 | - | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.65mm | 40 | MC9S12XEQ512 | - | S-PQFP-G112 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | NO | YES | NO | - | 4K x 8 | - | CPU12 | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK10DN512VMC10 NXP USA Inc. | 6568 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 42x16b; D/A 2x12b | 90 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DN512 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||
 MC9S08DZ60ACLH NXP USA Inc. | 1600 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 24x12b | 53 | - | - | - | -40°C~85°C TA | Tray | 1996 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08DZ60 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 2K x 8 | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC9S08DZ60AMLH NXP USA Inc. | 9 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 24x12b | 53 | - | - | - | -40°C~125°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08DZ60 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 2K x 8 | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MK66FN2M0VMD18 NXP USA Inc. | 25 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 2x16b; D/A 2x12b | 100 | 262144 | 2097152 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | NOT SPECIFIED | - | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 S9S08SG8E2CTGR NXP USA Inc. | 766 | - | Datasheet | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | 8192 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2014 | S08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | S9S08SG8 | - | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | AEC-Q100 | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 LPC812M101JDH20FP NXP USA Inc. | 1 | - | Datasheet | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | - | 18 | 4096 | 16384 | - | -40°C~105°C TA | Tube | 2010 | LPC81xM | - | Active | 1 (Unlimited) | 20 | - | - | - | - | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | NOT SPECIFIED | - | 20 | R-PDSO-G20 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | NO | NO | YES | NO | - | - | - | CORTEX-M0 | - | - | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
MC9S08PA16VTG NXP USA Inc. | 15 | - | Datasheet | 14 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 14 | - | 16384 | - | -40°C~105°C TA | Tray | 2002 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | MC9S08PA16 | - | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
MC9S08QE128CLH NXP USA Inc. | 1663 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 22x12b | 54 | - | 131072 | - | -40°C~85°C TA | Tray | 2009 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08QE128 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12XEQ512CAA NXP USA Inc. | 130 | - | Datasheet | 12 Weeks | Surface Mount | 80-QFP | YES | A/D 12x12b | 59 | - | 524288 | - | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.65mm | 40 | MC9S12XEQ512 | - | S-PQFP-G80 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | NO | YES | NO | - | 4K x 8 | - | CPU12 | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 FS32K142HAT0MLLT NXP USA Inc. | 47 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | - | A/D 16x12b; D/A 1x8b | - | - | - | - | -40°C~125°C TA | Tray | - | S32K | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 80MHz | 32K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M4F | POR, PWM, WDT | - | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKE02Z32VLD4R NXP USA Inc. | 1500 | - | Datasheet | 20 Weeks | Surface Mount | 44-LQFP | YES | A/D 16x12b; D/A 2x6b | 37 | 4096 | 32768 | - | -40°C~105°C TA | Tape & Reel (TR) | 2013 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | - | S-PQFP-G44 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MKE04Z64VLK4 NXP USA Inc. | 10000 | - | - | 20 Weeks | Surface Mount | 80-LQFP | - | A/D 16x12b; D/A 2x6b | 71 | - | - | - | -40°C~105°C TA | Tray | 2014 | Kinetis KE04 | e3 | Active | 3 (168 Hours) | - | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK24FN1M0VLL12R NXP USA Inc. | 6000 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 32x16b; D/A 2x12b | 66 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G100 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK02FN128VFM10 NXP USA Inc. | 1576 | - | - | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x16b; D/A 1x12b | 26 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K02 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
S912XET256W1MAL NXP USA Inc. | 2352 | - | - | 16 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | 16384 | 262144 | Automotive grade | -40°C~125°C TA | Tray | 2012 | HCS12X | - | Active | 3 (168 Hours) | 112 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.65mm | - | - | - | S-PQFP-G112 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | - | 4K x 8 | - | CPU12 | AEC-Q100 | - | - | 20mm | 20mm | ROHS3 Compliant | ||
MC9S12B128MFUE NXP USA Inc. | 477 | - | Datasheet | - | Surface Mount | 80-QFP | - | A/D 8x10b | 59 | - | - | - | -40°C~125°C TA | Tray | 2002 | HCS12 | e3 | Obsolete | 3 (168 Hours) | - | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | MC9S12B128 | - | - | - | - | - | - | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5606BF1MLQ6 NXP USA Inc. | 4158 | - | - | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 15x10b, 5x12b | 121 | - | 1048576 | Automotive grade | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | SPC5606 | - | S-PQFP-G144 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 80K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | - | 32 | 64K x 8 | - | - | AEC-Q100 | 64 | - | 20mm | 20mm | ROHS3 Compliant | ||
 S912ZVC12F0VLF NXP USA Inc. | 218 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 10x10b; D/A 1x8b | 28 | - | - | - | -40°C~105°C TA | Tray | 2013 | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 8K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
LPC11U67JBD48E NXP USA Inc. | 7500 | - | Datasheet | 16 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x12b | 34 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | - | Active | 3 (168 Hours) | 48 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC11U | 48 | S-PQFP-G48 | - | 3.6V | - | 2.4V | Internal | 50MHz | 20K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | - | 32 | YES | NO | YES | NO | - | 4K x 8 | 8 | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant |