- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
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 MC9S08JM16CLD NXP USA Inc. | 100 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x12b | 33 | - | - | - | -40°C~85°C TA | Tray | 2014 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08JM16 | S-PQFP-G44 | - | 5.5V | - | 2.7V | External | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI, USB | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MK20DN512ZVLQ10 NXP USA Inc. | 185 | - | Datasheet | 15 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN512 | S-PQFP-G144 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 S9KEAZN32ACLC NXP USA Inc. | 7500 | - | - | 20 Weeks | Surface Mount | 32-LQFP | - | A/D 16x12b | 28 | - | - | - | -40°C~85°C TA | Tray | 2013 | Kinetis KEA | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK60DN256VMD10 NXP USA Inc. | 205 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 100 | - | 262144 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK60DN256 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 S9S12G64F0VLF NXP USA Inc. | 500 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 12x10b | 40 | - | 65536 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 20mA | 16 | YES | NO | YES | - | - | 2K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MKL25Z128VFT4 NXP USA Inc. | 195 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 13x16b; D/A 1x12b | 36 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL25Z128 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MKL04Z8VLC4 NXP USA Inc. | 1753 | - | Datasheet | 13 Weeks | Surface Mount | 32-LQFP | YES | A/D 14x12b | 28 | - | 8192 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 40 | MKL04Z8 | S-PQFP-G32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 1K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MKL26Z128VMC4 NXP USA Inc. | 2053 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D - 16bit; D/A - 12bit | 84 | - | 131072 | - | -40°C~105°C TA | Tray | 2013 | Kinetis KL2 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MKL26Z128 | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MC908MR32CFUE NXP USA Inc. | 1000 | - | Datasheet | 10 Weeks | Surface Mount | 64-QFP | YES | A/D 10x10b | 44 | - | - | - | -40°C~85°C TA | Tray | 2005 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908MR32 | S-PQFP-G64 | - | 5.5V | - | 4.5V | Internal | 8MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | - | 8 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 2.4mm | 14mm | 14mm | ROHS3 Compliant | ||
S9KEAZN32AMLC NXP USA Inc. | 2475 | - | - | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 16x12b | 28 | 4096 | 32768 | - | -40°C~125°C TA | Tray | 2013 | Kinetis KEA | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | - | 40 | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | - | - | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC56F84789VLL NXP USA Inc. | 2700 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b, 16x16b; D/A 1x12b | 86 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F847 | R-PQFP-G100 | Not Qualified | 3.6V | 3/3.3V | 2.7V | Internal | 100MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08SE8CTG NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 10x10b | 14 | - | 8192 | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08SE8 | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
MCF52223CAF80 NXP USA Inc. | 631 | - | Datasheet | 10 Weeks | Surface Mount | 100-LQFP | YES | A/D 8x12b | 56 | - | 262144 | - | -40°C~85°C TA | Tray | 2001 | MCF5222x | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MCF52223 | S-PQFP-G100 | Not Qualified | 3.6V | 3/3.3V | 3V | Internal | 80MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S12DP512MPVE NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | - | - | -40°C~125°C TA | Tray | 2001 | HCS12 | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DP512 | S-PQFP-G112 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 50MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 20 | 4K x 8 | - | - | - | - | - | 16 | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC56F8367MPYE NXP USA Inc. | 2033 | - | - | 10 Weeks | Surface Mount | 160-LQFP | YES | A/D 16x12b | 76 | - | 524288 | - | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8367 | S-PQFP-G160 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 18K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | CANbus, EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 24 | - | - | - | YES | YES | - | 16 | FIXED POINT | YES | MULTIPLE | 1.6mm | 24mm | 24mm | ROHS3 Compliant | ||
 MKV31F256VLH12P NXP USA Inc. | 994 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 2x16b; D/A 1x12b | 46 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | - | 3.6V | - | 1.71V | Internal | 120MHz | 48K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MK60DN512VLL10R NXP USA Inc. | 12 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | - | 524288 | - | -40°C~105°C TA | Tape & Reel (TR) | 2012 | Kinetis K60 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | K60DN512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
 MKL27Z256VFM4 NXP USA Inc. | 2450 | - | - | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 16x16b; D/A 1x12b | 23 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
MK40DX256VLL7 NXP USA Inc. | 37 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 34x16b; D/A 1x12b | 66 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK40DX256 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
MKL05Z32VLF4 NXP USA Inc. | 1267 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 14x12b; D/A 1x12b | 41 | - | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL05Z32 | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant |