- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
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 MC9S08QG4CDTER NXP USA Inc. | 1478 | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | 4096 | - | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QG4 | R-PDSO-G16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MC9S08QG4CFFE NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Surface Mount | 16-VQFN Exposed Pad | YES | A/D 8x10b | 12 | - | 4096 | - | -40°C~85°C TA | Tray | 2003 | S08 | - | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | 40 | MC9S08QG4 | S-XQCC-N16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
 MC9S08DZ96CLF NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b | 39 | - | 98304 | - | -40°C~85°C TA | Tray | 2002 | S08 | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08DZ96 | S-PQFP-G48 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 38.4MHz | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | 16 | 2K x 8 | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MK70FX512VMJ12 NXP USA Inc. | 5 | - | Datasheet | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K70 | e1 | - | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FX512 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 16K x 8 | - | CORTEX-M4F | - | - | - | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||
 MKE04Z8VWJ4 NXP USA Inc. | 1558 | - | - | 20 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 10x12b; D/A 2x6b | 18 | - | - | - | -40°C~105°C TA | Tube | 2014 | Kinetis KE04 | e3 | - | Active | 3 (168 Hours) | 20 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | - | 40 | - | R-PDSO-G20 | - | 5.5V | - | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | - | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
S9S08SC4E0MTG NXP USA Inc. | 4145 | - | - | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | 4096 | Automotive grade | -40°C~125°C TA | Bulk | 1999 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | S9S08SC4 | R-PDSO-G16 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 40MHz | 256 x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | 8.9mA | 8 | YES | NO | YES | - | - | - | - | - | AEC-Q100 | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 MK60FN1M0VMD12 NXP USA Inc. | 352 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 58x16b; D/A 2x12b | 100 | - | 1048576 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK60FN1M0 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 MC9S12C32CFUE16 NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | A/D 8x10b | 60 | - | 32768 | - | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | - | Active | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12C32 | S-PQFP-G80 | Not Qualified | 2.75V | 2.53.3/5V | 2.35V | Internal | 16MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | - | - | CPU12 | - | 16 | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S08QD2MSC NXP USA Inc. | 23898 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | - | - | - | -40°C~125°C TA | Tube | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9S08QD2 | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 2KB 2K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
 MCF52254CAF66 NXP USA Inc. | 387 | - | - | 10 Weeks | Surface Mount | 100-LQFP | YES | A/D 8x12b | 56 | - | 524288 | - | -40°C~85°C TA | Tray | 2004 | MCF5225x | e3 | - | Active | 3 (168 Hours) | 100 | 5A992 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MCF52254 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 66MHz | 64K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK60DN256VLQ10 NXP USA Inc. | 5089 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK60DN256 | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08MP16VLC NXP USA Inc. | 32 | - | Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 13x12b; D/A 3x5b | 25 | - | 16384 | - | -40°C~105°C TA | Tray | 2009 | S08 | e3 | - | Active | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08MP16 | S-PQFP-G32 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 51.34MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | YES | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MKE02Z64VLC2 NXP USA Inc. | 2820 | - | - | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 16x12b; D/A 2x6b | 28 | 4096 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | S-PQFP-G32 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | - | - | - | ROHS3 Compliant | ||
S9S08DZ60F2MLC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | - | A/D 10x12b | 25 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | S9S08DZ60 | - | - | - | - | - | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08PT60VLD NXP USA Inc. | 3200 | - | Datasheet | - | Surface Mount | 44-LQFP | YES | A/D 16x12b | 37 | - | 61440 | - | -40°C~105°C TA | Tray | 2002 | S08 | e3 | - | Not For New Designs | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08PT60 | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MKE02Z64VQH4 NXP USA Inc. | In Stock | - | - | 20 Weeks | Surface Mount | 64-QFP | YES | A/D 16x12b; D/A 2x6b | 57 | 4096 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | - | 40 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKV30F64VFM10 NXP USA Inc. | 20341 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 2x16b; D/A 1x12b | 26 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | - | - | 3.6V | - | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MK20DX128VFT5 NXP USA Inc. | 1033 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 11x16b | 29 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
MK30DX256VLL7 NXP USA Inc. | 305 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 38x16b; D/A 1x12b | 70 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K30 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK30DX256 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MPC5125YVN400 NXP USA Inc. | 1200 | - | - | 10 Weeks | Surface Mount | 324-BBGA | YES | - | 64 | - | - | - | -40°C~125°C TJ | Tray | 2002 | MPC51xx | e2 | - | Active | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Silver (Sn/Ag) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 1mm | 40 | MPC5125 | S-PBGA-B324 | Not Qualified | 1.47V | 1.43.3V | 1.33V | External | 400MHz | 32K x 8 | 1.08V~3.6V | MICROCONTROLLER | e300 | DMA, WDT | 35MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | - | 32 | NO | YES | NO | NO | - | - | - | - | - | - | FLASH | 2.55mm | 23mm | 23mm | ROHS3 Compliant |