- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
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 MC9S08PA4VTG NXP USA Inc. | 307 | - | Datasheet | 8 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 14 | - | 4096 | -40°C~105°C TA | Tube | 2012 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | MC9S08PA4 | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | - | 128 x 8 | - | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 MK20DN512VLK10 NXP USA Inc. | 1140 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | 52 | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN512 | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||
 MKE02Z64VLH4 NXP USA Inc. | 1584 | - | - | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | 57 | 4096 | 65536 | -40°C~105°C TA | Tray | 2013 | Kinetis KE02 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | - | NOT SPECIFIED | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK02FN64VFM10 NXP USA Inc. | 1450 | - | - | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x16b; D/A 1x12b | 26 | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K02 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MKL02Z32VFK4 NXP USA Inc. | 9638 | - | Datasheet | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b | 22 | - | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KL02 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL02Z32 | S-PQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | - | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 4mm | 4mm | ROHS3 Compliant | ||
 MK10DN512VLQ10 NXP USA Inc. | 3948 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 104 | - | 524288 | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK64FX512VMD12 NXP USA Inc. | 3800 | - | - | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 41x16b; D/A 2x12b | 100 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | - | S-PBGA-B144 | - | 3.6V | - | 1.71V | Internal | 120MHz | 192K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 MK64FN1M0VDC12 NXP USA Inc. | 20 | - | - | 13 Weeks | Surface Mount | 121-XFBGA | YES | A/D 37x16b; D/A 2x12b | 83 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | - | 40 | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MKV58F1M0VLQ24 NXP USA Inc. | 562 | - | Datasheet | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 4x12b, 1x16b; D/A 1x12b | 111 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | - | 3.6V | - | 1.71V | Internal | 240MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
MK64FX512VLQ12 NXP USA Inc. | 3000 | - | - | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 41x16b; D/A 2x12b | 100 | - | - | -40°C~105°C TA | Tray | 2011 | Kinetis K60 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | S-PQFP-G144 | - | 3.6V | - | 1.71V | Internal | 120MHz | 192K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC56F8014VFAE NXP USA Inc. | 861 | - | Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 8x12b | 26 | - | 16384 | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 40 | MC56F8014 | S-PQFP-G32 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 32MHz | 2K x 16 | 3V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 8MHz | FLASH | 16-Bit | 16KB 8K x 16 | I2C, SCI, SPI | 16 | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | MULTIPLE | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MKL25Z128VLH4 NXP USA Inc. | 18 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 14x16b; D/A 1x12b | 50 | - | 131072 | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL25Z128 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK70FN1M0VMJ15 NXP USA Inc. | 5000 | - | Datasheet | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | - | 1048576 | -40°C~105°C TA | Tray | 2011 | Kinetis K70 | - | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper - with Nickel barrier | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FN1M0 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 150MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | 17mm | 17mm | ROHS3 Compliant | ||
MKE04Z8VTG4 NXP USA Inc. | In Stock | - | - | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 6x12b; D/A 2x6b | 14 | - | - | -40°C~105°C TA | Tube | 2014 | Kinetis KE04 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | - | - | 8542.31.00.01 | DUAL | GULL WING | NOT SPECIFIED | 3V | - | NOT SPECIFIED | - | R-PDSO-G16 | - | 5.5V | - | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK26FN2M0VLQ18 NXP USA Inc. | 204 |
| Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 5x12b, 3x16b; D/A 2x12b | 100 | 262144 | 2097152 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S12C32CFAE25 NXP USA Inc. | 831 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 31 | - | 32768 | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | Active | 3 (168 Hours) | 48 | EAR99 | MATTE TIN | - | - | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC9S12C32 | S-PQFP-G48 | Not Qualified | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | - | - | CPU12 | - | - | 16 | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MK10DX128VLH7 NXP USA Inc. | 4000 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 26x16b; D/A 1x12b | 44 | - | 131072 | -40°C~105°C TA | Tray | - | Kinetis K10 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX128 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MK64FN1M0VMD12 NXP USA Inc. | 2049 | - | - | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 41x16b; D/A 2x12b | 100 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | - | S-PBGA-B144 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 MK20DN512VLL10 NXP USA Inc. | 561 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | - | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
MK60DN512VMD10 NXP USA Inc. | 26800 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 100 | - | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER OVER NICKEL | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | K60DN512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant |