- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S08QD2CSC NXP USA Inc. | 4900 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | - | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | IT ALSO OPERATES AT 3V SUPPLY | - | DUAL | GULL WING | 260 | 5V | 1.27mm | 40 | MC9S08QD2 | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 2KB 2K x 8 | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
 MKL43Z256VLH4 NXP USA Inc. | 480 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x16b; D/A 1x12b | 50 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL4 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | - | 40 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LCD, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK22FX512AVMC12 NXP USA Inc. | 9 | - | - | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 38x16b; D/A 2x12b | 100 | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
MK20DX256VMC7R NXP USA Inc. | 25 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 35x16b; D/A 1x12b | 70 | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2012 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK20DX256 | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
MKL25Z64VLH4 NXP USA Inc. | 10 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 14x16b; D/A 1x12b | 50 | - | 65536 | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL25Z64 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MCF5328CVM240 NXP USA Inc. | 2420 | - | Datasheet | 12 Weeks | Surface Mount | 256-LBGA | YES | - | 94 | - | - | -40°C~85°C TA | Tray | 2006 | MCF532x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5328 | S-PBGA-B256 | Not Qualified | 1.6V | - | 1.4V | External | 240MHz | 32K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, LCD, PWM, WDT | 80MHz | ROMless | 32-Bit | - | EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | 32 | - | - | - | - | 24 | - | - | - | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
 MCF54452VR266 NXP USA Inc. | 5048 | - | Datasheet | 10 Weeks | Surface Mount | 360-BBGA | YES | - | 132 | - | - | 0°C~70°C TA | Tray | 2006 | MCF5445x | e2 | Active | 3 (168 Hours) | 360 | 5A992 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF54452 | S-PBGA-B360 | Not Qualified | 1.65V | 1.51.82.53.3V | 1.35V | Internal | 266MHz | 32K x 8 | 1.35V~3.6V | MICROPROCESSOR, RISC | Coldfire V4 | DMA, WDT | 66MHz | ROMless | 32-Bit | - | I2C, SPI, SSI, UART/USART, USB OTG | 32 | - | - | - | - | 32 | - | - | - | YES | YES | 32 | FIXED POINT | YES | 2.48mm | 23mm | 23mm | ROHS3 Compliant | ||
 MC9S08QE128CLD NXP USA Inc. | 9 |
| Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 10x12b | 34 | - | 131072 | -40°C~85°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08QE128 | S-PQFP-G44 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08DV32ACLF NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b | 39 | - | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08DV32 | S-PQFP-G48 | - | 5.5V | - | 2.7V | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC56F82746VLF NXP USA Inc. | 7500 | - | - | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 10x12b; D/A 2x12b | 39 | - | 65536 | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F82746 | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | 2.7V | Internal | 100MHz | 4K x 16 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 32K x 16 | CANbus, I2C, SCI, SPI | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MC9S08AC60CPUE NXP USA Inc. | 3200 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | - | 63280 | -40°C~85°C TA | Tray | 2000 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC9S08AC60 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MKE02Z32VQH2 NXP USA Inc. | 21 | - | - | 20 Weeks | Surface Mount | 64-QFP | YES | A/D 16x12b; D/A 2x6b | 57 | 4096 | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MKV30F128VLH10 NXP USA Inc. | 12000 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 2x16b; D/A 1x12b | 46 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | - | 3.6V | - | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12XEQ512MAA NXP USA Inc. | 38 | - | Datasheet | 12 Weeks | Surface Mount | 80-QFP | YES | A/D 12x12b | 59 | - | 524288 | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.65mm | 40 | MC9S12XEQ512 | S-PQFP-G80 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | - | 4K x 8 | - | CPU12 | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 S912ZVML12F3WKH NXP USA Inc. | 159 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | A/D 9x12b | 31 | - | - | -40°C~150°C TA | Tray | - | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 8K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK21FN1M0AVMC12 NXP USA Inc. | 8000 | - | - | 13 Weeks | Surface Mount | 121-LFBGA | - | A/D 40x16b; D/A 2x12b | 81 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08PA16AVTG NXP USA Inc. | 2580 | - | Datasheet | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 14 | - | - | -40°C~105°C TA | Tube | 2008 | S08 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 MC68332GCEH25 NXP USA Inc. | 10000 |
| Datasheet | - | Surface Mount | 132-BQFP Bumpered | YES | - | 15 | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 132 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 245 | 5V | 0.635mm | 30 | MC68332 | S-PQFP-G132 | Not Qualified | - | - | - | Internal | 25MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | - | - | - | - | - | 16 | - | - | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | ||
MC9S08PT60VQH NXP USA Inc. | 2000 | - | Datasheet | - | Surface Mount | 64-QFP | YES | A/D 16x12b | 57 | - | 61440 | -40°C~105°C TA | Tray | 2006 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08PT60 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK10DN512ZVLL10 NXP USA Inc. | 1156 | - | Datasheet | 15 Weeks | Surface Mount | 100-LQFP | YES | A/D 37x16b; D/A 2x12b | 70 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G100 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant |