- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
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 MIMXRT1051CVL5B NXP USA Inc. | 10000 | - | Datasheet | 14 Weeks | Surface Mount | 196-LFBGA | YES | A/D 20x12b | 127 | - | - | - | -40°C~105°C TJ | Tray | 2016 | RT1050 | - | - | Active | 3 (168 Hours) | 196 | - | - | 24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE | - | BOTTOM | BALL | 260 | - | 0.65mm | - | 40 | - | - | S-PBGA-B196 | - | 1.26V | - | 1.15V | Internal/External | 528MHz | 512K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | - | - | - | - | - | - | - | - | YES | YES | - | FLOATING POINT | YES | 1.52mm | 10mm | 10mm | ROHS3 Compliant | ||
 MKL16Z32VLH4 NXP USA Inc. | 977 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D - 16bit; D/A - 12bit | 54 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | DIFFERENTIAL ANALOG CHANNEL INPUTS: 8-CH 16-BIT | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MKL16Z32 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK10DX256ZVLQ10 NXP USA Inc. | 3250 | - | Datasheet | - | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 104 | - | - | - | -40°C~105°C TA | Tray | 2013 | Kinetis K10 | e3 | - | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MK10DX256 | - | S-PQFP-G144 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK10DX64VLK7 NXP USA Inc. | 457 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 31x16b; D/A 1x12b | 56 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK10DX64 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 MC9S08QD4CSC NXP USA Inc. | 3637 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | - | - | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | IT ALSO OPERATES AT 3V SUPPLY | - | DUAL | GULL WING | 260 | 5V | 1.27mm | - | 40 | MC9S08QD4 | - | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
 LPC824M201JHI33E NXP USA Inc. | 20000 | - | Datasheet | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x12b | 29 | - | 32768 | - | -40°C~105°C TA | Tray | 2005 | LPC82x | - | - | Discontinued | 3 (168 Hours) | 33 | - | - | SEATED HGT-NOM | - | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | - | NOT SPECIFIED | LPC824M201 | 32 | S-PQCC-N33 | - | 3.6V | - | 1.8V | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | - | 8 | - | - | - | - | - | - | 0.85mm | 5mm | 5mm | ROHS3 Compliant | ||
MK20FX512VLQ12 NXP USA Inc. | 10086 |
| Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 58x16b; D/A 2x12b | 100 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK20FX512 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.32.5/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | - | CORTEX-M4F | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
S9S08AW60E5MPUE NXP USA Inc. | 1600 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | - | 63280 | Automotive grade | -40°C~125°C TA | Tray | 2000 | S08 | - | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | 3V | 0.5mm | - | - | S9S08AW60 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | - | - | - | - | - | - | AEC-Q100 | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S912ZVML31F1WKH NXP USA Inc. | 2500 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | A/D 9x12b | 31 | - | - | - | -40°C~150°C TA | Tray | 2011 | S12 MagniV | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | Internal | 40MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | LINbus, SCI, SPI | - | - | - | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKE02Z32VFM4 NXP USA Inc. | 2450 | - | - | 20 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 16x12b; D/A 2x6b | 28 | 4096 | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | - | 40 | - | - | S-XQCC-N32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08AC32CFGE NXP USA Inc. | 4591 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x10b | 34 | - | 32768 | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | - | 40 | MC9S08AC32 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
S9KEAZ64AVLH NXP USA Inc. | 800 | - | Datasheet | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 57 | - | - | - | -40°C~105°C TA | Tray | 2006 | Kinetis KEA | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08QG8MFFE NXP USA Inc. | 300 | - | Datasheet | 10 Weeks | Surface Mount | 16-VQFN Exposed Pad | YES | A/D 8x10b | 12 | - | 8192 | - | -40°C~125°C TA | Bulk | 2005 | S08 | - | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | - | 40 | MC9S08QG8 | - | S-XQCC-N16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
 MC9S08PT32VLC NXP USA Inc. | 1250 | - | Datasheet | - | Surface Mount | 32-LQFP | YES | A/D 16x12b | 28 | - | 32768 | - | -40°C~105°C TA | Tray | 2013 | S08 | e3 | - | Not For New Designs | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | - | 40 | MC9S08PT32 | - | S-PQFP-G32 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | - | 256 x 8 | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MC56F8257MLH NXP USA Inc. | 1200 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x12b | 54 | - | 65536 | - | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MC56F8257 | - | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC9S08DV32AMLC NXP USA Inc. | 750 |
| Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 10x12b | 25 | - | - | - | -40°C~125°C TA | Tray | 2005 | S08 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | - | 40 | MC9S08DV32 | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
S9KEAZN64ACLH NXP USA Inc. | 1600 | - | Datasheet | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 57 | - | - | - | -40°C~85°C TA | Tray | 2012 | Kinetis KEA | - | yes | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | - | 256 x 8 | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MCF52256AG80 NXP USA Inc. | 600 | - | - | 10 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x12b | 96 | - | 262144 | - | 0°C~70°C TA | Tray | 2004 | MCF5225x | e3 | - | Active | 3 (168 Hours) | 144 | 5A992 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MCF52256 | - | S-PQFP-G144 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 80MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08MP16VLF NXP USA Inc. | 1000 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 13x12b; D/A 3x5b | 40 | - | 16384 | - | -40°C~105°C TA | Tray | 2009 | S08 | e3 | - | Active | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | - | 40 | MC9S08MP16 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 51.34MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MCHC908QT2CDWE NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | A/D 4x8b | 5 | - | - | - | -40°C~85°C TA | Tube | 1996 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | - | DUAL | GULL WING | 260 | 5V | 1.27mm | - | 40 | MCHC908QT2 | - | R-PDSO-G8 | - | - | - | - | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |