- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S12DG256CFUE NXP USA Inc. | 840 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | - | A/D 16x10b | 59 | 262144 | -40°C~85°C TA | Tray | 2001 | HCS12 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DG256 | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 4K x 8 | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MPC5554MVR132 NXP USA Inc. | 4000 | - | Datasheet | 25 Weeks | Surface Mount | 416-BBGA | YES | - | A/D 40x12b | 256 | 2097152 | -40°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | e1 | Not For New Designs | 3 (168 Hours) | 416 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | IT ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MPC5554 | S-PBGA-B416 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, SCI, SPI | 32 | YES | NO | YES | NO | 24 | - | - | 32 | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
 MC9S08DV16ACLF NXP USA Inc. | 19 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 16x12b | 39 | - | -40°C~85°C TA | Tray | 2013 | S08 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08DV16 | S-PQFP-G48 | - | 5.5V | - | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08DZ32AMLC NXP USA Inc. | 985 | - | Datasheet | 10 Weeks | Surface Mount | 32-LQFP | - | 32-LQFP (7x7) | A/D 10x12b | 25 | - | -40°C~125°C TA | Tray | 2008 | S08 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9S08DZ32 | - | - | - | - | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | - | S08 | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | ROHS3 Compliant | ||
 MKL15Z128VLH4 NXP USA Inc. | 1600 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x16b; D/A 1x12b | 54 | 131072 | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 16-BIT ADC AND 12-BIT DAC AVAILABLE | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL15Z128 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MK20FX512VMD12 NXP USA Inc. | 4 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | - | A/D 58x16b; D/A 2x12b | 100 | 524288 | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK20FX512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.32.5/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 16K x 8 | CORTEX-M4F | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 MK21DN512AVLK5 NXP USA Inc. | 450 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | - | A/D 20x16b | 60 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | S-PQFP-G80 | - | 3.6V | - | 1.71V | Internal | 50MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
MK40DX256VLH7 NXP USA Inc. | 343 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 18x16b; D/A 1x12b | 36 | 262144 | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK40DX256 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MK22FN1M0VLH12 NXP USA Inc. | 5 | - | Datasheet | - | Surface Mount | 64-LQFP | YES | - | A/D 22x16b; D/A 1x12b | 40 | 1048576 | -40°C~105°C TA | Tray | 2013 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK22FN1M0 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | CORTEX-M4F | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08JM60CLD NXP USA Inc. | 48 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | - | A/D 8x12b | 33 | 60912 | -40°C~85°C TA | Tray | 2007 | S08 | e3 | Active | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08JM60 | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 48MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 24MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SCI, SPI, USB | 8 | YES | YES | YES | NO | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9RS08KA4CTG NXP USA Inc. | 3600 | - | - | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 12x10b | 14 | 4096 | -40°C~85°C TA | Tube | 2015 | RS08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9RS08KA4 | R-PDSO-G16 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 126 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C | 8 | YES | NO | YES | NO | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MKV10Z64VFM7 NXP USA Inc. | 26 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | - | A/D 2x16b; D/A 1x12b | 28 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | YES | YES | NO | YES | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 S9S08SG16E1CTLR NXP USA Inc. | 7186 | - | Datasheet | 12 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 16x10b | 22 | - | -40°C~85°C TA | Tape & Reel (TR) | 1999 | S08 | - | Active | 3 (168 Hours) | 28 | - | - | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | NOT SPECIFIED | S9S08SG16 | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | - | - | - | - | - | - | 9.7mm | 4.4mm | ROHS3 Compliant | ||
MC56F84442VLH NXP USA Inc. | 2400 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x12b, 8x16b | 54 | 65536 | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F844 | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 2.7V | Internal | 60MHz | 8K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | NO | - | 2K x 8 | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MC9S12C64CFUE NXP USA Inc. | 10551 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | - | A/D 8x10b | 60 | 65536 | -40°C~85°C TA | Tray | 1996 | HCS12 | e3 | Active | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12C64 | S-PQFP-G80 | Not Qualified | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | - | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MKL16Z64VFT4 NXP USA Inc. | 257 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | A/D - 16bit; D/A - 12bit | 40 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | DIFFERENTIAL ANALOG CHANNEL INPUTS: 6-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL16Z64 | S-XQCC-N48 | - | 3.6V | - | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MC56F8246MLF NXP USA Inc. | 170 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 10x12b; D/A 1x12b | 39 | 49152 | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F8246 | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 3K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 24K x 16 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC9S08AC60CFGE NXP USA Inc. | 2400 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | - | A/D 8x10b | 34 | 63280 | -40°C~85°C TA | Tray | 2000 | S08 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08AC60 | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MKL26Z64VFT4 NXP USA Inc. | 260 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | A/D - 16bit; D/A - 12bit | 36 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL26Z64 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MCF51AC256ACLKE NXP USA Inc. | 26336 | - | Datasheet | 10 Weeks | Surface Mount | 80-LQFP | YES | - | A/D 24x12b | 69 | 262144 | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MCF51AC256 | S-PQFP-G80 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 32 | YES | NO | YES | NO | - | - | - | - | 1.74mm | 14mm | 14mm | ROHS3 Compliant |