- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | ROM Programmability | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 SPC5602DF1VLL4 NXP USA Inc. | 19 | - | - | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x12b | 79 | - | 262144 | Automotive grade | -40°C~105°C TA | Tray | 2003 | MPC56xx Qorivva | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | SPC5602 | - | S-PQFP-G100 | Not Qualified | 3.6V | 3.3/5V | 3V | Internal | 48MHz | 16K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 130mA | 32 | YES | YES | YES | NO | - | 4K x 16 | - | - | - | - | AEC-Q100 | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
 MKE02Z32VLC4R NXP USA Inc. | 13300 | - | Datasheet | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 16x12b; D/A 2x6b | 28 | 4096 | 32768 | - | -40°C~105°C TA | Tape & Reel (TR) | 2013 | Kinetis KE02 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | - | 40 | - | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MKE02Z64VQH2 NXP USA Inc. | 2 | - | - | 20 Weeks | Surface Mount | 64-QFP | YES | A/D 16x12b; D/A 2x6b | 57 | 4096 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | - | 40 | - | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
SPC5606BK0MLL6 NXP USA Inc. | 1950 | - | Datasheet | 14 Weeks | Surface Mount | 100-LQFP | YES | A/D 7x10b, 5x12b | 77 | - | 1048576 | Automotive grade | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | - | SPC5606 | - | S-PQFP-G100 | Not Qualified | - | 3.3/5V | - | Internal | 64MHz | 80K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z0h | DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | - | - | - | - | - | 64K x 8 | - | - | - | - | AEC-Q100 | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 S912ZVML31F1WKF NXP USA Inc. | 250 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | A/D 4x12b | 31 | - | - | - | -40°C~150°C TA | Bulk | 2012 | S12 MagniV | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | - | Internal | 40MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | LINbus, SCI | - | - | - | - | - | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9RS08KA8CWJ NXP USA Inc. | In Stock | - | - | 10 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 12x10b | 18 | - | 8192 | - | -40°C~85°C TA | Tube | 2006 | RS08 | e3 | - | Active | 3 (168 Hours) | 20 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 1.27mm | - | 40 | MC9RS08KA8 | - | R-PDSO-G20 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 254 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 12.8mm | 7.5mm | ROHS3 Compliant | ||
 S912XEP100W1MAG NXP USA Inc. | 2376 | - | - | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 65536 | 1048576 | Automotive grade | -40°C~125°C TA | Tray | 1996 | HCS12X | - | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.5mm | - | - | - | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 64K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | 23 | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | 16 | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
FS32K144HAT0MLLT NXP USA Inc. | 891 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | - | A/D 16x12b; D/A 1x8b | - | - | - | - | -40°C~125°C TA | Tray | - | S32K | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M4F | POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL36Z128VLH4 NXP USA Inc. | 1000 |
| Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D - 16bit; D/A - 12bit | 50 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL3 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MKL36Z128 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK60DN512VMC10 NXP USA Inc. | 800 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 38x16b; D/A 2x12b | 86 | - | 524288 | - | -40°C~105°C TA | Tray | 2013 | Kinetis K60 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | - | 40 | K60DN512 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||
MC9S12XDP512VAG NXP USA Inc. | 1200 | - | Datasheet | 10 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x10b | 119 | - | 524288 | - | -40°C~105°C TA | Tray | 2005 | HCS12X | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MC9S12XDP512 | - | S-PQFP-G144 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 32K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 4K x 8 | - | CPU12 | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC56F8365VFGE NXP USA Inc. | 87 | - | Datasheet | 10 Weeks | Surface Mount | 128-LQFP | YES | A/D 16x12b | 49 | - | 524288 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MC56F8365 | - | R-PQFP-G128 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 18K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | CANbus, EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 11 | - | - | - | YES | YES | - | 4 | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||
MCF52256CAG66 NXP USA Inc. | 254 | - | - | 10 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x12b | 96 | - | 262144 | - | -40°C~85°C TA | Tray | 2004 | MCF5225x | e3 | - | Active | 3 (168 Hours) | 144 | 5A992 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MCF52256 | - | S-PQFP-G144 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 66MHz | 64K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
LPC4320FBD144,551 NXP USA Inc. | 30000 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x10b; D/A 1x10b | 83 | - | 0 | - | -40°C~85°C TA | Tray | 2009 | LPC43xx | e3 | - | Active | 3 (168 Hours) | 144 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | NOT SPECIFIED | LPC4320 | 144 | S-PQFP-G144 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 200K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | - | CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | 24 | - | - | CORTEX-M4 | - | - | - | 32 | - | FLASH | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08AC32CFGER NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x10b | 34 | - | 32768 | - | -40°C~85°C TA | Tape & Reel (TR) | 2007 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | - | 40 | MC9S08AC32 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MCHC908QY2CDWE NXP USA Inc. | 3691 | - | Datasheet | - | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 4x8b | 13 | - | - | - | -40°C~85°C TA | Tube | 1996 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | - | 40 | MCHC908QY2 | - | R-PDSO-G16 | - | 5.5V | - | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||
 MC9S12DG256MPVE NXP USA Inc. | 10602 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | 262144 | - | -40°C~125°C TA | Tray | 2001 | HCS12 | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | - | 40 | MC9S12DG256 | - | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 19 | 4K x 8 | - | CPU12 | - | - | - | 16 | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
MC56F8355VFGE NXP USA Inc. | 3255 | - | Datasheet | 10 Weeks | Surface Mount | 128-LQFP | YES | A/D 16x12b | 49 | - | 262144 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MC56F8355 | - | R-PQFP-G128 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 10K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 256KB 128K x 16 | CANbus, EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 11 | - | - | - | YES | YES | - | 4 | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||
MCF51EM256CLL NXP USA Inc. | 374 | - | Datasheet | 10 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b | 63 | - | 262144 | - | -40°C~85°C TA | Tray | 2002 | MCF51EM | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES 1.8 V AT 20 MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MCF51EM256 | - | S-PQFP-G100 | Not Qualified | 3.6V | 2/3.3V | 2.5V | External | 50MHz | 16K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | Coldfire V1 | LCD, LVD, PWM, WDT | 0.032MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
 MKL14Z64VLK4 NXP USA Inc. | 71 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b | 70 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MKL14Z64 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant |