- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Number of Serial I/Os | Number of Timers | Number of External Interrupts | On Chip Data RAM Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MK50DN512CMD10 NXP USA Inc. | 2000 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 41x16b; D/A 2x12b | 96 | - | 524288 | - | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK50DN512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 S9S12G96F0CLF NXP USA Inc. | 1282 |
| Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 12x10b | 40 | - | 98304 | Automotive grade | -40°C~85°C TA | Tray | 2007 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | S9S12G96 | S-PQFP-G48 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | - | - | - | - | - | 3K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S912XET256BMAG NXP USA Inc. | 2 | - | - | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 16384 | 262144 | - | -40°C~125°C TA | Tray | 1996 | HCS12X | - | - | Active | 3 (168 Hours) | 144 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.5mm | - | - | S-PQFP-G144 | - | 5.5V | - | 3.13V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 32 | YES | NO | YES | NO | 22 | 4K x 8 | 8 | - | NO | YES | - | 16 | 8 | 3 | 3 | 8 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08QE16CFT NXP USA Inc. | 1500 | - | Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 10x12b | 38 | - | - | - | -40°C~85°C TA | Tray | 2006 | S08 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MC9S08QE16 | S-PQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MC56F8006VWLR NXP USA Inc. | 61 | - | Datasheet | 12 Weeks | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | YES | A/D 15x12b | 23 | - | 16384 | - | -40°C~105°C TA | Tape & Reel (TR) | 1999 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 40 | MC56F8006 | R-PDSO-G28 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 32MHz | 1K x 16 | 1.8V~3.6V | MICROCONTROLLER, RISC | 56800E | LVD, POR, PWM, WDT | 64MHz | FLASH | 16-Bit | 16KB 8K x 16 | I2C, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 17.925mm | 7.5mm | ROHS3 Compliant | ||
 MK20DX256ZVLK10 NXP USA Inc. | 3 | - | Datasheet | - | Surface Mount | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | 52 | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX256 | S-PQFP-G80 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||
 MC9S08DZ128CLH NXP USA Inc. | 120 |
| Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 24x12b | 53 | - | 131072 | - | -40°C~85°C TA | Tray | 2002 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08DZ128 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 38.4MHz | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | 16 | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MC9S12C64MFAE NXP USA Inc. | 128 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 31 | - | 65536 | - | -40°C~125°C TA | Tray | 2005 | HCS12 | e3 | - | Active | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | - | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC9S12C64 | S-PQFP-G48 | Not Qualified | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | - | - | CPU12 | - | - | - | 16 | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC9S12C32MFAE25 NXP USA Inc. | 934 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 31 | - | 32768 | - | -40°C~125°C TA | Tray | 2005 | HCS12 | e3 | - | Active | 3 (168 Hours) | 48 | EAR99 | MATTE TIN | - | - | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC9S12C32 | S-PQFP-G48 | Not Qualified | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | - | - | CPU12 | - | - | - | 16 | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MK02FN128VLH10 NXP USA Inc. | 2252 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x16b; D/A 1x12b | 46 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K02 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
S9KEAZ64ACLH NXP USA Inc. | 98 | - | Datasheet | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b | 57 | - | - | - | -40°C~85°C TA | Tray | 2012 | Kinetis KEA | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MC9S08QE16CWL NXP USA Inc. | 5 |
| Datasheet | 10 Weeks | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | YES | A/D 10x12b | 22 | - | 16384 | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 40 | MC9S08QE16 | R-PDSO-G28 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 17.925mm | 7.5mm | ROHS3 Compliant | ||
 MKL34Z64VLL4 NXP USA Inc. | 265 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D - 16bit | 84 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL3 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1V | 0.5mm | 40 | MKL34Z64 | S-PQFP-G100 | Not Qualified | 1.1V | 1.8/3.3V | 0.9V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
MCF52254AF80 NXP USA Inc. | 10000 | - | - | 10 Weeks | Surface Mount | 100-LQFP | YES | A/D 8x12b | 56 | - | 524288 | - | 0°C~70°C TA | Tray | 2004 | MCF5225x | e3 | - | Active | 3 (168 Hours) | 100 | 5A992 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MCF52254 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 80MHz | 64K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 S9S12ZVL32F0MLC NXP USA Inc. | 2500 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | A/D 6x10b | 19 | - | - | - | -40°C~125°C TA | Tray | 2011 | S12 MagniV | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | - | 0.8mm | NOT SPECIFIED | - | - | - | - | - | - | Internal | 32MHz | 1K x 8 | 5.5V~18V | MICROCONTROLLER | S12Z | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | - | 16 | YES | NO | YES | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MKL17Z64VDA4 NXP USA Inc. | 415 | - | Datasheet | 13 Weeks | Surface Mount | 36-XFBGA | YES | A/D 15x16b | 32 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e1 | - | Active | 3 (168 Hours) | 36 | 3A991.A.2 | TIN SILVER COPPER | DIFFERENTIAL ANALOG CHANNEL INPUTS: 4-CH 16-BIT | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 0.5mm | 40 | - | S-PBGA-B36 | - | 3.6V | - | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 0.5mm | 3.5mm | 3.5mm | ROHS3 Compliant | ||
 MC9S12DG128CFUER NXP USA Inc. | 313 |
| Datasheet | 15 Weeks | Surface Mount | 80-QFP | YES | A/D 16x10b | 59 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DG128 | S-PQFP-G80 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 2K x 8 | - | - | - | - | - | 16 | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
MK30DX256VLQ10 NXP USA Inc. | 20 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 102 | - | 262144 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K30 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK30DX256 | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
MK82FN256VLL15 NXP USA Inc. | 81 | - | - | 13 Weeks | Surface Mount | 100-LQFP | - | A/D 18x16b; D/A 2x6b, 1x12b | 66 | - | - | - | -40°C~105°C TA | Tray | 2014 | Kinetis K8x | - | - | Active | 3 (168 Hours) | - | 5A992 | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | Internal | 150MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM | - | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SPI, UART/USART, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5746CSK1MMH6 NXP USA Inc. | 26 | - | Datasheet | 18 Weeks | Surface Mount | 100-LBGA | YES | A/D 80x10b, 64x12b | 65 | - | - | - | -40°C~125°C TA | Tray | 2016 | MPC57xx | - | yes | Active | 3 (168 Hours) | 100 | - | - | - | - | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | - | - | - | 1.32V | - | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | - | 32 | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 11mm | 11mm | ROHS3 Compliant |