- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() MK60DN256VLL10 NXP USA Inc. | 900 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | 262144 | - | -40°C~105°C TA | Tray | 2013 | Kinetis K60 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK60DN256 | - | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
![]() MCF5251VM140 NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 225-LFBGA | YES | A/D 6x12b | - | - | - | -20°C~70°C TA | Tray | 2006 | MCF525x | - | - | Active | 3 (168 Hours) | 225 | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | MCF5251 | - | S-PBGA-B225 | Not Qualified | 1.32V | 1.23.3V | 1.08V | External | 140MHz | 128K x 8 | 1.08V~3.6V | MICROPROCESSOR | Coldfire V2 | DMA | 140MHz | ROMless | 32-Bit | - | ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG | - | 32 | - | - | - | - | 24 | - | - | YES | NO | - | 32 | FIXED POINT | YES | 1.6mm | 13mm | 13mm | ROHS3 Compliant | ||
![]() MIMXRT1021DAG5A NXP USA Inc. | 3000 | - | Datasheet | 14 Weeks | Surface Mount | 144-LQFP | YES | A/D 19x12b | 96 | - | - | 0°C~95°C TJ | Tray | - | RT1020 | - | - | Active | 3 (168 Hours) | 144 | - | - | - | - | QUAD | GULL WING | 260 | - | 0.5mm | 40 | - | - | - | - | 1.3V | - | 1.25V | Internal/External | 500MHz | 256K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 24MHz | External Program Memory | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
![]() MKV42F128VLH16 NXP USA Inc. | 160 | - | - | 13 Weeks | Surface Mount | 64-LQFP | - | A/D 29x12b | 48 | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis KV | - | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | Internal | 168MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() S9S08DZ60F2MLH NXP USA Inc. | 29205 | - | - | 12 Weeks | Surface Mount | 64-LQFP | - | A/D 24x12b | 53 | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | S9S08DZ60 | - | - | - | - | - | - | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MK40DX256VMD10 NXP USA Inc. | 32 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 98 | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK40DX256 | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
![]() S9S12G64F0MLFR NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 12x10b | 40 | 65536 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12G64 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 2K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
![]() MC9S08LL8CLF NXP USA Inc. | 735 |
| Datasheet | 15 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x12b | 31 | 8192 | - | -40°C~85°C TA | Tray | 2003 | S08 | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08LL8 | - | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LCD, LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 10KB 10K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.4mm | 7mm | 7mm | ROHS3 Compliant | ||
![]() S9S12GN32F0MFT NXP USA Inc. | 50 | - | Datasheet | 12 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | A/D 8x10b | 40 | 32768 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | NO LEAD | - | 5V | 0.5mm | - | S9S12GN32 | - | S-PQCC-N48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | - | - | 1K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
![]() MC9S12XDG128CAA NXP USA Inc. | 1200 | - | Datasheet | 24 Weeks | Surface Mount | 80-QFP | YES | A/D 8x10b | 59 | 131072 | - | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12XDG128 | - | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 12K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 2K x 8 | CPU12 | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
![]() MC9S12XET256MAA NXP USA Inc. | 4000 | - | Datasheet | 16 Weeks | Surface Mount | 80-QFP | YES | A/D 12x12b | 59 | 262144 | - | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.65mm | 40 | MC9S12XET256 | - | S-PQFP-G80 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | NO | YES | NO | - | 4K x 8 | CPU12 | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
![]() MC9S08QE64CLC NXP USA Inc. | 2000 |
| Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 10x12b | 26 | 65536 | - | -40°C~85°C TA | Tray | 2009 | S08 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08QE64 | - | S-PQFP-G32 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
![]() MC9S08QE128CLK NXP USA Inc. | 2000 |
| Datasheet | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 24x12b | 70 | 131072 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QE128 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
![]() MC56F8255VLD NXP USA Inc. | 30 | - | Datasheet | 12 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x12b; D/A 1x12b | 35 | 65536 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 40 | MC56F8255 | - | S-PQFP-G44 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, I2C, LINbus, SCI, SPI | - | 16 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
![]() LPC812M101JDH16J NXP USA Inc. | 4699 | - | Datasheet | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | - | 14 | 16384 | - | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC81xM | - | - | Active | 1 (Unlimited) | 16 | - | - | - | - | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | NOT SPECIFIED | LPC812M101 | 16 | R-PDSO-G16 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | NO | NO | YES | NO | - | - | CORTEX-M0 | - | - | - | - | - | - | 1.1mm | 5mm | 4.4mm | ROHS3 Compliant | ||
![]() S9S12GN32F1MLC NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | A/D 8x10b | 26 | 32768 | Automotive grade | -40°C~125°C TA | Tray | 1997 | HCS12 | - | - | Active | 3 (168 Hours) | 32 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.8mm | - | S9S12GN32 | - | S-PQFP-G32 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | - | - | - | - | - | 1K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC908QY4ACDWE NXP USA Inc. | 10 | - | Datasheet | 12 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 6x10b | 13 | - | - | -40°C~85°C TA | Tube | 2004 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | 40 | MC908QY4 | - | R-PDSO-G16 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||
![]() S912ZVCA64F0MLF NXP USA Inc. | 8750 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 10x12b; D/A 1x8b | 28 | - | - | -40°C~125°C TA | Tray | 2013 | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 4K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC9S08QE64CLH NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 22x12b | 54 | 65536 | - | -40°C~85°C TA | Tray | 2009 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08QE64 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
![]() MK50DX256CLK7 NXP USA Inc. | 276 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 30x16b; D/A 1x12b | 39 | 262144 | - | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK50DX256 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant |