- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MKE04Z128VLH4 NXP USA Inc. | 6336 | - | - | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | 58 | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis KE04 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | NOT SPECIFIED | - | - | - | - | 5.5V | - | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MKV10Z64VLF7 NXP USA Inc. | 318 | - | - | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 2x16b; D/A 1x12b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | - | NOT SPECIFIED | - | - | S-PQFP-G48 | - | 3.6V | - | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | YES | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08QD4MSC NXP USA Inc. | 80 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | - | - | - | -40°C~125°C TA | Tube | 2005 | S08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9S08QD4 | - | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
 S912XDP512J1MAL NXP USA Inc. | 2906 | - | Datasheet | 12 Weeks | Surface Mount | 112-LQFP | YES | A/D 8x10b, 16x10b | 91 | - | 524288 | - | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | Not For New Designs | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | S912XDP512 | - | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 32K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | YES | YES | NO | 23 | 4K x 8 | - | CPU12 | - | 16 | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MKE04Z64VQH4 NXP USA Inc. | 18 | - | - | 20 Weeks | Surface Mount | 64-QFP | - | A/D 16x12b; D/A 2x6b | 58 | - | - | - | -40°C~105°C TA | Tray | 2013 | Kinetis KE04 | e3 | Active | 3 (168 Hours) | - | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK12DX128VLF5 NXP USA Inc. | 705 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 18x16b | 33 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.55mm | 40 | MK12DX128 | - | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 SPC5777CCK3MME3 NXP USA Inc. | 12000 | - | Datasheet | 16 Weeks | Surface Mount | 416-BGA | YES | A/D 16b Sigma-Delta, eQADC | - | 524288 | 8388608 | - | -40°C~125°C TA | Tray | 2012 | MPC57xx | - | Active | 3 (168 Hours) | 416 | 5A992 | - | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 1mm | NOT SPECIFIED | - | - | S-PBGA-B416 | - | 1.32V | - | 1.2V | Internal | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | - | 32 | YES | YES | YES | NO | - | - | 8 | - | - | - | - | 2.02mm | 27mm | 27mm | ROHS3 Compliant | ||
 MC9S08SE8CTGR NXP USA Inc. | 3000 | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 10x10b | 14 | - | 8192 | - | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.635mm | 40 | MC9S08SE8 | - | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
S9S08QD4J1MSCR NXP USA Inc. | 5000 |
| Datasheet | 16 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | - | - | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2004 | S08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | S9S08QD4 | - | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | AEC-Q100 | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
MKV31F128VLH10P NXP USA Inc. | 19 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 2x16b; D/A 1x12b | 46 | 24576 | 122880 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 100MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | 8 | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MC908AZ60ACFUE NXP USA Inc. | 1000 | - | Datasheet | - | Surface Mount | 64-QFP | YES | A/D 15x8b | 52 | - | - | - | -40°C~85°C TA | Tray | 2005 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 64 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908AZ60 | - | S-PQFP-G64 | Not Qualified | 5.5V | - | 4.5V | Internal | 8.4MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 1K x 8 | - | - | - | - | - | 2.45mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK61FX512VMJ12 NXP USA Inc. | 5000 | - | Datasheet | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 77x16b; D/A 2x12b | 128 | - | 524288 | - | -40°C~105°C TA | Tray | 2011 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK61FX512 | - | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 16K x 8 | - | CORTEX-M4 | - | - | - | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||
 MC9S08PA60VLD NXP USA Inc. | 5 | - | Datasheet | - | Surface Mount | 44-LQFP | YES | A/D 12x12b | 37 | - | 61440 | - | -40°C~105°C TA | Tray | 2012 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08PA60 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | NO | - | 256 x 8 | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK60DX256VMD10 NXP USA Inc. | 486 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 100 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK60DX256 | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 MC9S12XEP100CAG NXP USA Inc. | 3200 | - | Datasheet | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | - | 1048576 | - | -40°C~85°C TA | Tray | 2008 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | MC9S12XEP100 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 64K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | YES | YES | NO | 23 | 4K x 8 | - | CPU12 | - | 16 | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 LPC4330FET180,551 NXP USA Inc. | 91 |
| Datasheet | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 8x10b; D/A 1x10b | 118 | - | 0 | - | -40°C~85°C TA | Tray | 2010 | LPC43xx | e1 | Active | 3 (168 Hours) | 180 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC4330 | 180 | S-PBGA-B180 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | - | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | 24 | - | - | CORTEX-M4 | - | 32 | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||
 S9S12G128F0MLL NXP USA Inc. | 580 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 12x10b | 86 | - | 131072 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | S9S12G128 | - | S-PQFP-G100 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | - | - | - | - | - | 4K x 8 | - | CPU12 | AEC-Q100 | - | - | - | - | - | ROHS3 Compliant | ||
MK22FX512VLQ12 NXP USA Inc. | 102 | - | Datasheet | 26 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK22FX512 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08SH8CTJ NXP USA Inc. | 2095 | - | Datasheet | 22 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 17 | - | 8192 | - | -40°C~85°C TA | Tube | 2012 | S08 | e3 | Active | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | - | 0.65mm | 40 | MC9S08SH8 | - | R-PDSO-G20 | Not Qualified | - | 3/5V | - | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
MKE06Z64VLH4 NXP USA Inc. | 3200 | - | - | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | 58 | 16384 | 131072 | - | -40°C~105°C TA | Tray | 2014 | Kinetis KE06 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | - | 8 | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant |