- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MK21DN512AVMC5 NXP USA Inc. | 3 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 20x16b; D/A 1x12b | 64 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.65mm | NOT SPECIFIED | - | - | - | 3.6V | - | 1.71V | Internal | 50MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MKE04Z8VFK4 NXP USA Inc. | 4640 |
| - | 20 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b; D/A 2x6b | 22 | - | - | - | -40°C~105°C TA | Tray | 2014 | Kinetis KE04 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | S-XQCC-N24 | - | 5.5V | - | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 4mm | 4mm | ROHS3 Compliant | ||
 MKE02Z32VLD2 NXP USA Inc. | 1165 | - | - | 20 Weeks | Surface Mount | 44-LQFP | YES | A/D 16x12b; D/A 2x6b | 37 | 4096 | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | MATTE TIN | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK20DX256VMD10 NXP USA Inc. | 202 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 100 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK20DX256 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 S9S08SG4E2CTGR NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | 4096 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1999 | S08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | S9S08SG4 | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MKE02Z32VLH4 NXP USA Inc. | 15 | - | - | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | 57 | 4096 | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S9S12GA240F0MLL NXP USA Inc. | 2250 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 2x8b | 86 | - | 245760 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12GA240 | S-PQFP-G100 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MC56F8346VFVE NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 144-LQFP | YES | A/D 16x12b | 62 | - | 131072 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8346 | S-PQFP-G144 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 6K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 128KB 64K x 16 | CANbus, EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 17 | - | - | - | YES | YES | - | 16 | FIXED POINT | YES | MULTIPLE | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MKL27Z256VFT4 NXP USA Inc. | 15280 | - | - | 13 Weeks | Surface Mount | 48-UFQFN Exposed Pad | YES | A/D 16x16b; D/A 1x12b | 36 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | DIFFERENTIAL ANALOG CHANNEL INPUTS: 1-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | - | 40 | - | S-XQCC-N48 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK80FN256VLL15 NXP USA Inc. | 17 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 1x16b; D/A 2x6b, 1x12b | 66 | - | - | - | -40°C~105°C TA | Tray | 2014 | Kinetis K8x | - | Active | 3 (168 Hours) | 100 | 5A992 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | S-PQFP-G100 | - | 3.6V | - | 1.71V | Internal | 150MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SPI, UART/USART, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
S9S12G128F0VLL NXP USA Inc. | 48 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 12x10b | 86 | - | 131072 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12G128 | S-PQFP-G100 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 22mA | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK10DX128VLK7 NXP USA Inc. | 1 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 31x16b; D/A 1x12b | 56 | - | 131072 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX128 | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
MK21FN1M0VLQ12 NXP USA Inc. | 33 | - | Datasheet | 26 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | 1048576 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | MK21FN1M0 | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
MC9S08QE128CFT NXP USA Inc. | 1078 | - | Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 10x12b | 38 | - | 131072 | - | -40°C~85°C TA | Tray | 2006 | S08 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08QE128 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
MCF51CN128CGT NXP USA Inc. | 25 |
| Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 12x12b | 38 | - | 131072 | - | -40°C~85°C TA | Tray | 2005 | MCF51CN | - | Active | 3 (168 Hours) | 48 | 5A992 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 2.7V | 0.5mm | 40 | MCF51CN128 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | External | 50MHz | 24K x 8 | 1.8V~3.6V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | Ethernet, I2C, SCI, SPI | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
 S912XEQ512F1MAA NXP USA Inc. | 1260 | - | Datasheet | 12 Weeks | Surface Mount | 80-QFP | YES | A/D 8x12b | 59 | - | 524288 | Automotive grade | -40°C~125°C TA | Tray | 2013 | HCS12X | - | Active | 3 (168 Hours) | 80 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.65mm | - | S912XEQ512 | S-PQFP-G80 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
MK10DX256VMD10 NXP USA Inc. | 1500 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | 104 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK10DX256 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
MC9S08PT32VLD NXP USA Inc. | 30 | - | Datasheet | 20 Weeks | Surface Mount | 44-LQFP | YES | A/D 16x12b | 37 | - | 32768 | - | -40°C~105°C TA | Tray | 2002 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08PT32 | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
S912XET256J2MAA NXP USA Inc. | 10 | - | Datasheet | 16 Weeks | Surface Mount | 80-QFP | YES | A/D 8x12b | 59 | - | 262144 | - | -40°C~125°C TA | Tray | 2012 | HCS12X | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.635mm | 40 | S912XET256 | S-PQFP-G80 | Not Qualified | - | 3.3/5V | - | External | 50MHz | 16K x 8 | 1.72V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 16 | - | - | - | - | - | 4K x 8 | - | CPU12 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MKL13Z64VLK4 NXP USA Inc. | 4 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 20x16b; D/A 1x12b | 70 | 8192 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3V | 0.5mm | NOT SPECIFIED | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | FlexIO, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant |