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  • Peripherals
  • Program Memory Type
  • RAM Size

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NXP Embedded - Microcontrollers

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10000 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Data Converters

Number of I/Os

ROM(word)

Usage Level

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Time@Peak Reflow Temperature-Max (s)

Base Part Number

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Oscillator Type

Speed

RAM Size

Voltage - Supply (Vcc/Vdd)

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Clock Frequency

Program Memory Type

Core Size

Program Memory Size

Connectivity

Supply Current-Max

Bit Size

Has ADC

DMA Channels

PWM Channels

DAC Channels

Address Bus Width

EEPROM Size

CPU Family

Boundary Scan

Low Power Mode

Screening Level

External Data Bus Width

Format

Integrated Cache

Source Url Status Check Date

Height Seated (Max)

Length

Width

RoHS Status

LPC43S57JET256E
LPC43S57JET256E

NXP USA Inc.

327

-

Datasheet

12 Weeks

Surface Mount

256-LBGA

-

-

A/D 8x10b; D/A 1x10b

164

-

-

-40°C~105°C TA

Tray

2010

LPC43xx

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

260

-

-

NOT SPECIFIED

-

256

-

-

-

-

-

Internal

204MHz

136K x 8

2.2V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M4/M0

Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT

-

FLASH

32-Bit Dual-Core

1MB 1M x 8

CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC9S08JM16CLC
MC9S08JM16CLC

NXP USA Inc.

5

-

Datasheet

10 Weeks

Surface Mount

32-LQFP

YES

-

A/D 4x12b

21

-

-

-40°C~85°C TA

Tray

2006

S08

e3

-

Active

3 (168 Hours)

32

EAR99

Matte Tin (Sn)

-

8542.31.00.01

QUAD

GULL WING

260

3V

0.8mm

40

MC9S08JM16

-

S-PQFP-G32

-

5.5V

-

2.7V

External

48MHz

1K x 8

2.7V~5.5V

MICROCONTROLLER

-

LVD, POR, PWM, WDT

16MHz

FLASH

8-Bit

16KB 16K x 8

I2C, LINbus, SCI, SPI, USB

-

8

YES

NO

YES

NO

-

-

-

-

-

-

-

-

-

-

1.6mm

7mm

7mm

ROHS3 Compliant

MK11DN512AVLK5
MK11DN512AVLK5

NXP USA Inc.

8190

-

-

13 Weeks

Surface Mount

80-LQFP

YES

-

A/D 24x16b

60

-

-

-40°C~105°C TA

Tray

2002

Kinetis K10

-

-

Active

3 (168 Hours)

80

3A991.A.2

-

-

8542.31.00.01

QUAD

GULL WING

NOT SPECIFIED

3.3V

0.5mm

NOT SPECIFIED

-

-

S-PQFP-G80

-

3.6V

-

1.71V

Internal

50MHz

64K x 8

1.71V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M4

DMA, I2S, LVD, POR, PWM, WDT

50MHz

FLASH

32-Bit

512KB 512K x 8

I2C, IrDA, SPI, UART/USART

-

-

YES

YES

YES

NO

-

-

-

-

-

-

-

-

-

-

-

12mm

12mm

ROHS3 Compliant

MKL28Z512VLL7
MKL28Z512VLL7

NXP USA Inc.

450

-

Datasheet

13 Weeks

Surface Mount

100-LQFP

YES

-

A/D 24x16b; D/A 1x12b

82

-

-

-40°C~105°C TA

Tray

2016

Kinetis KL2

-

-

Active

3 (168 Hours)

100

3A991.A.2

-

-

8542.31.00.01

QUAD

GULL WING

NOT SPECIFIED

3.3V

0.5mm

NOT SPECIFIED

-

-

-

-

3.6V

-

1.71V

Internal

72MHz

128K x 8

1.71V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M0+

DMA, I2S, PWM, WDT

48MHz

FLASH

32-Bit

512KB 512K x 8

I2C, FlexIO, SPI, UART/USART, USB

-

32

YES

YES

YES

-

-

-

-

-

-

-

-

-

-

-

-

14mm

14mm

ROHS3 Compliant

LPC1857FET256,551
LPC1857FET256,551

NXP USA Inc.

540

-

Datasheet

12 Weeks

Surface Mount

256-LBGA

YES

-

A/D 8x10b; D/A 1x10b

164

1048576

-

-40°C~85°C TA

Tray

2010

LPC18xx

e1

-

Active

3 (168 Hours)

256

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

BOTTOM

BALL

260

3.3V

1mm

30

LPC1857

256

S-PBGA-B256

Not Qualified

3.6V

2.5/3.3V

2.2V

Internal

180MHz

136K x 8

2.2V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M3

Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT

25MHz

FLASH

32-Bit

1MB 1M x 8

CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG

-

32

YES

YES

YES

YES

24

16K x 8

CORTEX-M3

-

-

-

32

-

-

2013-06-14 00:00:00

1.55mm

17mm

17mm

ROHS3 Compliant

MCF52277CVM160
MCF52277CVM160

NXP USA Inc.

20

-

Datasheet

12 Weeks

Surface Mount

196-LBGA

YES

-

-

55

-

-

-40°C~85°C TA

Tray

2006

MCF5227x

e1

-

Active

3 (168 Hours)

196

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.31.00.01

BOTTOM

BALL

260

1.5V

0.5mm

NOT SPECIFIED

MCF52277

-

S-PBGA-B196

Not Qualified

1.6V

1.51.82.53.3V

1.4V

External

166.67MHz

128K x 8

1.4V~1.6V

MICROPROCESSOR, RISC

Coldfire V2

DMA, LCD, PWM, WDT

66.67MHz

ROMless

32-Bit

-

CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG

-

32

-

-

-

-

24

-

-

YES

NO

-

32

FIXED POINT

YES

-

1.7mm

15mm

15mm

ROHS3 Compliant

MK10FN1M0VMD12
MK10FN1M0VMD12

NXP USA Inc.

30

-

Datasheet

13 Weeks

Surface Mount

144-LBGA

YES

-

A/D 66x16b; D/A 2x12b

104

-

-

-40°C~105°C TA

Tray

2002

Kinetis K10

e1

-

Active

3 (168 Hours)

144

3A991.A.2

TIN SILVER COPPER OVER NICKEL

ALSO OPERATES AT 1 V MINIMUM SUPPLY

8542.31.00.01

BOTTOM

BALL

260

3V

1mm

40

MK10FN1M0

-

S-PBGA-B144

Not Qualified

3.6V

1.8/3.3V

1.71V

Internal

120MHz

128K x 8

1.71V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M4

DMA, I2S, LVD, POR, PWM, WDT

32MHz

FLASH

32-Bit

1MB 1M x 8

CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART

-

32

YES

YES

YES

YES

-

-

CORTEX-M4

-

-

-

-

-

-

-

1.7mm

13mm

13mm

ROHS3 Compliant

SPC5644AF0MLU1
SPC5644AF0MLU1

NXP USA Inc.

500

-

-

12 Weeks

Surface Mount

176-LQFP

YES

-

A/D 40x12b

84

4194304

Automotive grade

-40°C~125°C TA

Tray

2004

MPC56xx Qorivva

e3

-

Active

3 (168 Hours)

176

3A991.A.2

Matte Tin (Sn)

-

8542.31.00.01

QUAD

GULL WING

260

1.2V

0.5mm

40

SPC5644

-

S-PQFP-G176

Not Qualified

1.32V

1.23.35V

1.14V

Internal

150MHz

192K x 8

1.14V~5.25V

MICROCONTROLLER

e200z4

DMA, POR, PWM, WDT

40MHz

FLASH

32-Bit

4MB 4M x 8

CANbus, EBI/EMI, LINbus, SCI, SPI

400mA

32

YES

YES

YES

-

-

-

-

-

-

AEC-Q100

-

-

-

-

-

24mm

24mm

ROHS3 Compliant

MCF51AC128ACFUE
MCF51AC128ACFUE

NXP USA Inc.

322

-

Datasheet

10 Weeks

Surface Mount

64-QFP

-

64-QFP (14x14)

A/D 20x12b

54

-

-

-40°C~85°C TA

Tray

2007

MCF51AC

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

MCF51AC128

-

-

-

-

-

-

External

50MHz

32K x 8

2.7V~5.5V

-

Coldfire V1

LVD, PWM, WDT

-

FLASH

32-Bit

128KB 128K x 8

CANbus, I2C, SCI, SPI

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC9S08JM16CGT
MC9S08JM16CGT

NXP USA Inc.

8029

-

Datasheet

10 Weeks

Surface Mount

48-VFQFN Exposed Pad

YES

-

A/D 8x12b

37

-

-

-40°C~85°C TA

Tray

2008

S08

-

-

Active

3 (168 Hours)

48

EAR99

-

-

8542.31.00.01

QUAD

NO LEAD

260

3V

0.5mm

40

MC9S08JM16

-

S-XQCC-N48

-

5.5V

-

2.7V

External

48MHz

1K x 8

2.7V~5.5V

MICROCONTROLLER

-

LVD, POR, PWM, WDT

16MHz

FLASH

8-Bit

16KB 16K x 8

I2C, LINbus, SCI, SPI, USB

-

8

YES

NO

YES

NO

-

-

-

-

-

-

-

-

-

-

1mm

7mm

7mm

ROHS3 Compliant

MKL17Z64VLH4
MKL17Z64VLH4

NXP USA Inc.

51

-

Datasheet

13 Weeks

Surface Mount

64-LQFP

YES

-

A/D 20x16b

54

-

-

-40°C~105°C TA

Tray

2015

Kinetis KL1

e3

-

Active

3 (168 Hours)

64

3A991.A.2

Tin (Sn)

DIFFERENTIAL ANALOG CHANNEL INPUTS: 4-CH 16-BIT

-

QUAD

GULL WING

260

3V

0.5mm

40

-

-

S-PQFP-G64

-

3.6V

-

1.71V

Internal

48MHz

16K x 8

1.71V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M0+

DMA, I2S, PWM, WDT

48MHz

FLASH

32-Bit

64KB 64K x 8

I2C, FlexIO, SPI, UART/USART

-

32

YES

YES

YES

NO

-

-

-

-

-

-

-

-

-

-

1.6mm

10mm

10mm

ROHS3 Compliant

MK22FX512AVLL12
MK22FX512AVLL12

NXP USA Inc.

450

-

-

13 Weeks

Surface Mount

100-LQFP

YES

-

A/D 33x16b; D/A 1x12b

66

-

-

-40°C~105°C TA

Tray

2010

Kinetis K20

-

-

Active

3 (168 Hours)

100

3A991.A.2

-

-

8542.31.00.01

QUAD

GULL WING

260

3.3V

0.5mm

NOT SPECIFIED

-

-

S-PQFP-G100

-

3.6V

-

1.71V

Internal

120MHz

64K x 8

1.71V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M4

DMA, I2S, LVD, POR, PWM, WDT

50MHz

FLASH

32-Bit

512KB 512K x 8

CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG

-

32

YES

YES

YES

YES

-

-

-

-

-

-

-

-

-

-

-

14mm

14mm

ROHS3 Compliant

S9S12G64F1MLC
S9S12G64F1MLC

NXP USA Inc.

500

-

Datasheet

12 Weeks

Surface Mount

32-LQFP

YES

-

A/D 12x10b

26

65536

Automotive grade

-40°C~125°C TA

Tray

2008

HCS12

-

-

Active

3 (168 Hours)

32

-

-

-

8542.31.00.01

QUAD

GULL WING

-

5V

0.8mm

-

S9S12G64

-

S-PQFP-G32

Not Qualified

5.5V

3.3/5V

3.13V

Internal

25MHz

4K x 8

3.13V~5.5V

MICROCONTROLLER

12V1

LVD, POR, PWM, WDT

16MHz

FLASH

16-Bit

64KB 64K x 8

CANbus, IrDA, LINbus, SCI, SPI

-

16

YES

NO

YES

-

-

2K x 8

CPU12

-

-

AEC-Q100

-

-

-

-

-

7mm

7mm

ROHS3 Compliant

S9S08DZ60F2CLF
S9S08DZ60F2CLF

NXP USA Inc.

21

-

Datasheet

12 Weeks

Surface Mount

48-LQFP

-

-

A/D 16x12b

39

-

-

-40°C~85°C TA

Tray

1996

S08

-

yes

Active

3 (168 Hours)

-

-

-

-

-

-

-

260

-

-

40

S9S08DZ60

-

-

-

-

-

-

External

40MHz

4K x 8

2.7V~5.5V

MICROCONTROLLER

-

LVD, POR, PWM, WDT

-

FLASH

8-Bit

60KB 60K x 8

CANbus, I2C, LINbus, SCI, SPI

-

-

-

-

-

-

-

2K x 8

-

-

-

-

-

-

-

-

-

-

-

ROHS3 Compliant

MC908QB8CDWE
MC908QB8CDWE

NXP USA Inc.

583

-

Datasheet

-

Surface Mount

16-SOIC (0.295, 7.50mm Width)

YES

-

A/D 10x10b

13

-

-

-40°C~85°C TA

Tube

2000

HC08

e3

-

Not For New Designs

3 (168 Hours)

16

3A991.A.2

Matte Tin (Sn)

OPERATES AT 3V SUPPLY AT 4 MHZ

8542.31.00.01

DUAL

GULL WING

260

5V

1.27mm

40

MC908QB8

-

R-PDSO-G16

Not Qualified

5.5V

-

4.5V

Internal

8MHz

256 x 8

2.7V~5.5V

MICROCONTROLLER

-

LVD, POR, PWM

32MHz

FLASH

8-Bit

8KB 8K x 8

SCI, SPI

-

8

YES

NO

YES

NO

-

-

-

-

-

-

-

-

-

-

2.65mm

10.3mm

7.5mm

ROHS3 Compliant

MC9S12XET256CAG
MC9S12XET256CAG

NXP USA Inc.

10826

-

Datasheet

16 Weeks

Surface Mount

144-LQFP

YES

-

A/D 24x12b

119

262144

-

-40°C~85°C TA

Tray

2001

HCS12X

e3

-

Active

3 (168 Hours)

144

3A991.A.2

Matte Tin (Sn)

IT ALSO REQUIRES 5 V I/O SUPPLY

8542.31.00.01

QUAD

GULL WING

260

1.8V

0.5mm

40

MC9S12XET256

-

S-PQFP-G144

Not Qualified

1.98V

3.3/5V

1.72V

External

50MHz

16K x 8

1.72V~5.5V

MICROCONTROLLER, RISC

-

LVD, POR, PWM, WDT

40MHz

FLASH

16-Bit

256KB 256K x 8

CANbus, EBI/EMI, I2C, IrDA, SCI, SPI

-

32

YES

NO

YES

NO

23

4K x 8

CPU12

-

-

-

16

-

-

-

1.6mm

20mm

20mm

ROHS3 Compliant

MC9S08JM32CGT
MC9S08JM32CGT

NXP USA Inc.

3800

-

Datasheet

10 Weeks

Surface Mount

48-VFQFN Exposed Pad

YES

-

A/D 8x12b

37

32768

-

-40°C~85°C TA

Tray

2007

S08

-

-

Active

3 (168 Hours)

48

EAR99

-

-

8542.31.00.01

QUAD

NO LEAD

260

3V

0.5mm

40

MC9S08JM32

-

S-XQCC-N48

Not Qualified

5.5V

3/5V

2.7V

External

48MHz

2K x 8

2.7V~5.5V

MICROCONTROLLER

-

LVD, POR, PWM, WDT

24MHz

FLASH

8-Bit

32KB 32K x 8

I2C, LINbus, SCI, SPI, USB

-

8

YES

YES

YES

NO

-

-

-

-

-

-

-

-

-

-

1mm

7mm

7mm

ROHS3 Compliant

MC56F8035VLD
MC56F8035VLD

NXP USA Inc.

127

-

-

10 Weeks

Surface Mount

44-LQFP

YES

-

A/D 8x12b; D/A 2x12b

35

65536

-

-40°C~105°C TA

Tray

1998

56F8xxx

e3

-

Active

3 (168 Hours)

44

3A991.A.2

Matte Tin (Sn)

-

8542.31.00.01

QUAD

GULL WING

260

3.3V

0.8mm

40

MC56F8035

-

S-PQFP-G44

Not Qualified

3.6V

3.3V

3V

Internal

32MHz

4K x 16

3V~3.6V

MICROCONTROLLER

56800E

POR, PWM, WDT

8MHz

FLASH

16-Bit

64KB 32K x 16

I2C, LINbus, SCI, SPI

-

16

YES

NO

YES

YES

-

-

-

-

-

-

-

-

-

-

1.6mm

10mm

10mm

ROHS3 Compliant

MK20DN512ZVMC10
MK20DN512ZVMC10

NXP USA Inc.

3594

-

Datasheet

-

Surface Mount

121-LFBGA

YES

-

A/D 38x16b; D/A 2x12b

86

-

-

-40°C~105°C TA

Tray

2002

Kinetis K20

e1

-

Not For New Designs

3 (168 Hours)

121

3A991.A.2

TIN SILVER COPPER

-

8542.31.00.01

BOTTOM

BALL

260

3.3V

0.65mm

40

MK20DN512

-

S-PBGA-B121

Not Qualified

3.6V

-

1.71V

Internal

100MHz

128K x 8

1.71V~3.6V

MICROCONTROLLER, RISC

ARM® Cortex®-M4

DMA, I2S, LVD, POR, PWM, WDT

50MHz

FLASH

32-Bit

512KB 512K x 8

CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

-

32

YES

YES

YES

YES

-

-

-

-

-

-

-

-

-

-

1.52mm

8mm

8mm

ROHS3 Compliant

S912XET256J2MAG
S912XET256J2MAG

NXP USA Inc.

130

-

Datasheet

16 Weeks

Surface Mount

144-LQFP

YES

-

A/D 24x12b

119

262144

-

-40°C~125°C TA

Tray

1996

HCS12X

e3

-

Active

3 (168 Hours)

144

3A991.A.2

Matte Tin (Sn)

-

8542.31.00.01

QUAD

GULL WING

260

1.8V

0.5mm

40

S912XET256

-

S-PQFP-G144

Not Qualified

1.98V

3.3/5V

1.72V

External

50MHz

16K x 8

1.72V~5.5V

MICROCONTROLLER, RISC

-

LVD, POR, PWM, WDT

40MHz

FLASH

16-Bit

256KB 256K x 8

CANbus, EBI/EMI, I2C, IrDA, SCI, SPI

-

16

YES

YES

YES

-

23

4K x 8

CPU12

-

-

-

16

-

-

-

-

20mm

20mm

ROHS3 Compliant