- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 S912XET256J2MAG NXP USA Inc. | 130 | - | Datasheet | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | - | 262144 | - | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S912XET256 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 16 | YES | YES | YES | - | 23 | 4K x 8 | - | CPU12 | - | - | - | 16 | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC56F84786VLK NXP USA Inc. | 5250 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b, 10x16b; D/A 1x12b | 68 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F847 | - | S-PQFP-G80 | Not Qualified | 3.6V | 3/3.3V | 2.7V | Internal | 100MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LPC845M301JBD64E NXP USA Inc. | 30 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | - | A/D 12x12b; D/A 2x10b | 54 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC84x | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal/External | 30MHz | 16K x 8 | 1.8V~3.6V | - | ARM® Cortex®-M0+ | Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LPC4357JET256,551 NXP USA Inc. | 156 | - | Datasheet | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | - | 1048576 | - | -40°C~105°C TA | Tray | 2010 | LPC43xx | e1 | - | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | NOT SPECIFIED | - | 1mm | NOT SPECIFIED | LPC4357 | 256 | S-PBGA-B256 | Not Qualified | - | 2.5/3.3V | - | Internal | 204MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | - | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 16K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||
 MK60DN256VMC10 NXP USA Inc. | 1500 | - | - | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 42x16b; D/A 2x12b | 100 | 65536 | 262144 | - | -40°C~105°C TA | Tray | 2013 | Kinetis K60 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | - | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||
MK22FN1M0AVLQ12 NXP USA Inc. | 500 | - | - | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G144 | - | 3.6V | - | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08LH36CLH NXP USA Inc. | 155 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x16b | 37 | - | 36864 | - | -40°C~85°C TA | Tray | 2012 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES WITH 2.1 V TO 1.8 V SUPPLY AT 20 MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08LH36 | - | S-PQFP-G64 | Not Qualified | 3.6V | 2/3.3V | 2.1V | Internal | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LCD, LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 36KB 36K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MK10DX128VLQ10 NXP USA Inc. | 19 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 104 | - | 131072 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX128 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 S9S12G48BCLC NXP USA Inc. | 2500 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x10b | 26 | - | - | - | -40°C~85°C TA | Tray | - | HCS12 | - | - | Active | 3 (168 Hours) | 32 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.8mm | - | - | - | S-PQFP-G32 | - | 5.5V | - | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | NO | - | 1.5K x 8 | 8 | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S12DT256MPVE NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 8x10b | 91 | - | 262144 | - | -40°C~125°C TA | Tray | 2001 | HCS12 | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DT256 | - | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 19 | 4K x 8 | - | CPU12 | - | - | - | 16 | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
MC9S08FL16CLC NXP USA Inc. | 12500 | - | Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x8b | 30 | - | 16384 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08FL16 | - | S-XQFP-G32 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 20MHz | 1K x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | SCI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08PA4VTGR NXP USA Inc. | 2000 | - | Datasheet | 8 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 14 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2005 | S08 | - | yes | Not For New Designs | 3 (168 Hours) | 16 | - | - | - | - | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 MC56F8322MFAE NXP USA Inc. | 1759 | - | Datasheet | - | Surface Mount | 48-LQFP | YES | A/D 6x12b | 21 | - | - | - | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | - | Not For New Designs | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8322 | - | S-PQFP-G48 | Not Qualified | 2.75V | - | 2.25V | Internal | 60MHz | 6K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 32KB 16K x 16 | CANbus, SCI, SPI | - | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | MULTIPLE | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC56F84769VLL NXP USA Inc. | 1800 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b, 16x16b; D/A 1x12b | 86 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F847 | - | S-PQFP-G100 | Not Qualified | 3.6V | 3/3.3V | 2.7V | Internal | 100MHz | 24K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5644AF0MLU1R NXP USA Inc. | 1000 | - | - | 12 Weeks | Surface Mount | 176-LQFP | YES | A/D 40x12b | 84 | - | 4194304 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2004 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 176 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.2V | 0.5mm | - | SPC5644 | - | S-PQFP-G176 | Not Qualified | 1.32V | 1.23.35V | 1.14V | Internal | 150MHz | 192K x 8 | 1.14V~5.25V | MICROCONTROLLER, RISC | e200z4 | DMA, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 4MB 4M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 400mA | 32 | YES | YES | YES | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | 24mm | 24mm | ROHS3 Compliant | ||
 MCF52258CVN66 NXP USA Inc. | 14 | - | - | 10 Weeks | Surface Mount | 144-LBGA | YES | A/D 8x12b | 96 | - | 524288 | - | -40°C~85°C TA | Tray | 2004 | MCF5225x | e2 | - | Active | 3 (168 Hours) | 144 | 5A992 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF52258 | - | S-XBGA-B144 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 66MHz | 64K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 MC9S08GT16ACFBE NXP USA Inc. | 517 | - | Datasheet | 10 Weeks | Surface Mount | 44-QFP | YES | A/D 8x10b | 36 | - | 16384 | - | -40°C~85°C TA | Tray | 2005 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08GT16 | - | S-PQFP-G44 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 2.45mm | 10mm | 10mm | ROHS3 Compliant | ||
SPC5675KFF0MMS2 NXP USA Inc. | 1259 | - | Datasheet | 12 Weeks | Surface Mount | 473-LFBGA | YES | A/D 34x12b | - | - | 2097152 | Automotive grade | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 473 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 3.3V | 0.8mm | - | SPC5675 | - | S-PBGA-B473 | Not Qualified | 5.5V | 1.23.35V | 3V | Internal | 180MHz | 512K x 8 | 1.14V~5.5V | MICROCONTROLLER, RISC | e200z7d | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI | 900mA | 32 | YES | YES | YES | - | - | 64K x 8 | - | - | - | - | AEC-Q100 | - | - | - | - | - | 19mm | 19mm | ROHS3 Compliant | ||
 MC9S12XDG128MAA NXP USA Inc. | 1200 | - | Datasheet | - | Surface Mount | 80-QFP | YES | A/D 8x10b | 59 | - | 131072 | - | -40°C~125°C TA | Tray | 2004 | HCS12X | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12XDG128 | - | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 12K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 2K x 8 | - | CPU12 | - | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
MK40DX64VLH7 NXP USA Inc. | 800 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 18x16b; D/A 1x12b | 36 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK40DX64 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant |