- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | ROM Programmability | Source Url Status Check Date | Height Seated (Max) | Length | Width | RoHS Status |
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 MC9S08PA8AVTG NXP USA Inc. | 10000 | - | Datasheet | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 14 | - | - | - | -40°C~105°C TA | Tube | 2010 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
MC9RS08KA4CTGR NXP USA Inc. | 60000 | - | - | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 14 | - | 4096 | - | -40°C~85°C TA | Tape & Reel (TR) | 2013 | RS08 | - | - | Active | 3 (168 Hours) | 16 | - | - | - | 8542.31.00.01 | DUAL | GULL WING | - | 3.3V | 0.65mm | - | MC9RS08KA4 | - | R-PDSO-G16 | Not Qualified | 5.5V | 2/5V | 2V | Internal | 20MHz | 126 x 8 | 1.8V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
S9S08SG16E1MTGR NXP USA Inc. | 29700 | - | Datasheet | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 1999 | S08 | - | - | Active | 3 (168 Hours) | 16 | - | - | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | NOT SPECIFIED | S9S08SG16 | - | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 S9S08DN32F2MLC NXP USA Inc. | 416 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | - | A/D 10x12b | 25 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | S9S08DN32 | - | - | - | - | - | - | Internal | 40MHz | 1.5K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S9S12G48F0CLF NXP USA Inc. | 1250 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 12x10b | 40 | - | 49152 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | S9S12G48 | - | S-PQFP-G48 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | - | - | - | - | - | 1.5K x 8 | - | CPU12 | AEC-Q100 | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK20DX128VLQ10 NXP USA Inc. | 10006 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MKL27Z32VFM4 NXP USA Inc. | 5130 | - | - | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 8x16b | 24 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | TIN | DIFFERENTIAL ANALOG CHANNEL INPUTS: 6-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, FlexIO, SPI, UART/USART, USB | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | 0.65mm | 5mm | 5mm | ROHS3 Compliant | ||
MKE02Z16VLC2 NXP USA Inc. | 5 | - | - | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 16x12b; D/A 2x6b | 28 | 2048 | 16384 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | MATTE TIN | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | - | S-PQFP-G32 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK10DX256ZVMD10 NXP USA Inc. | 19 | - | Datasheet | 15 Weeks | Surface Mount | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | 104 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | - | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK10DX256 | - | S-PBGA-B144 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
S9S12GN48F1VLC NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x10b | 26 | - | 49152 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 32 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.8mm | - | S9S12GN48 | - | S-PQFP-G32 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 1.5K x 8 | - | CPU12 | AEC-Q100 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 S912ZVMC12F3WKH NXP USA Inc. | 5200 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | A/D 9x12b | 31 | - | - | - | -40°C~150°C TA | Tray | - | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 8K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S9S08SG8E2MSC NXP USA Inc. | 28000 | - | Datasheet | 12 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | - | 8192 | Automotive grade | -40°C~125°C TA | Tube | 1999 | S08 | e3 | - | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | - | - | DUAL | GULL WING | 260 | 5V | 1.27mm | 40 | S9S08SG8 | - | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | - | - | - | - | AEC-Q100 | - | - | - | 1.75mm | 5mm | 3.9mm | ROHS3 Compliant | ||
 MC9S08GB32ACFUE NXP USA Inc. | 2000 | - | Datasheet | - | Surface Mount | 64-LQFP | YES | A/D 8x10b | 56 | - | - | - | -40°C~85°C TA | Tray | 2005 | S08 | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | OPERATES AT 1.8V MINIMUM SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08GB32 | - | S-PQFP-G64 | Not Qualified | 3.6V | - | 2.08V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC9S08AC60MPUE NXP USA Inc. | 3800 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | - | 63280 | - | -40°C~125°C TA | Tray | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC9S08AC60 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
SPC5604PGF1MLQ6 NXP USA Inc. | 12 | - | - | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 30x10b | 108 | - | 524288 | Automotive grade | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | SPC5604 | - | S-PQFP-G144 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 40K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 89mA | 32 | YES | YES | YES | - | - | 64K x 8 | - | - | AEC-Q100 | 32 | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
MC56F82746VLFR NXP USA Inc. | 1100 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 10x12b; D/A 2x12b | 39 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G48 | - | 3.6V | - | 2.7V | Internal | 100MHz | 4K x 16 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 32K x 16 | CANbus, I2C, SCI, SPI | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MKE15Z256VLH7 NXP USA Inc. | 3500 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | 32768 | 262144 | - | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | FLEXRAM WITH 2KB FOR EEPROM EMULATION | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 72MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | FlexIO, I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | 34K x 8 | 8 | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MCF51JM128VLD NXP USA Inc. | 480 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x12b | 33 | - | 131072 | - | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | - | Active | 3 (168 Hours) | 44 | 5A992 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MCF51JM128 | - | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SCI, SPI, USB OTG | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 LPC1850FET256,551 NXP USA Inc. | 141 |
| Datasheet | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | - | 65536 | - | -40°C~85°C TA | Tray | 2010 | LPC18xx | e1 | - | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | NOT SPECIFIED | LPC1850 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 200K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | 24 | - | - | CORTEX-M3 | - | 32 | FLASH | 2013-06-14 00:00:00 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||
 S9S12G96F0CLL NXP USA Inc. | 1800 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 12x10b | 86 | - | 98304 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12G96 | - | S-PQFP-G100 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | - | - | 3K x 8 | - | CPU12 | AEC-Q100 | - | - | - | - | 14mm | 14mm | ROHS3 Compliant |