- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | ROM Programmability | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S08QE8CWL NXP USA Inc. | 12 | - | Datasheet | 10 Weeks | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | YES | A/D 10x12b | 22 | - | 8192 | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | Active | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9S08QE8 | - | R-PDSO-G28 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 17.95mm | 7.5mm | ROHS3 Compliant | ||
 MC9S08SH8MTJ NXP USA Inc. | 10000 | - | Datasheet | 22 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 17 | - | 8192 | - | -40°C~125°C TA | Tube | 2007 | S08 | e3 | Active | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | MC9S08SH8 | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
 MC9RS08KA8CTG NXP USA Inc. | In Stock | - | - | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 14 | - | 8192 | - | -40°C~85°C TA | Tube | 2006 | RS08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9RS08KA8 | - | R-PDSO-G16 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 254 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MC9S12XS128MAE NXP USA Inc. | 3200 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 44 | - | 131072 | - | -40°C~125°C TA | Tray | 2005 | HCS12X | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC9S12XS128 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 3.135V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | - | 16 | YES | NO | YES | NO | - | - | - | CPU12 | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MKE04Z64VLK4R NXP USA Inc. | 1150 | - | - | 20 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b; D/A 2x6b | 71 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2006 | Kinetis KE04 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S12DJ256CFUE NXP USA Inc. | 10000 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | A/D 16x10b | 59 | - | 262144 | - | -40°C~85°C TA | Tray | 1998 | HCS12 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DJ256 | - | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 4K x 8 | - | CPU12 | - | - | - | 16 | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
MKV42F256VLH16 NXP USA Inc. | 5760 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 29x12b | 48 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | - | - | 3.6V | - | 1.71V | Internal | 168MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08JM60CGT NXP USA Inc. | 7742 | - | Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x12b | 37 | - | 60912 | - | -40°C~85°C TA | Tray | 2009 | S08 | - | Active | 3 (168 Hours) | 48 | EAR99 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08JM60 | - | S-XQCC-N48 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 48MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 24MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SCI, SPI, USB | - | 8 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC56F8335VFGE NXP USA Inc. | 106 | - | Datasheet | 10 Weeks | Surface Mount | 128-LQFP | YES | A/D 16x12b | 49 | - | 65536 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8335 | - | R-PQFP-G128 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 6K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 11 | - | - | - | YES | YES | - | 4 | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||
 S9S12G240F0VLF NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x10b | 40 | 11264 | 245760 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | - | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23.5mA | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 FS32K144HFT0MLLR NXP USA Inc. | 10006 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | - | S32K | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
MC9S08GT16ACFDE NXP USA Inc. | 16900 |
| Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | - | 16384 | - | -40°C~85°C TA | Tray | 2006 | S08 | - | Active | 3 (168 Hours) | 48 | EAR99 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08GT16 | - | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
MK50DX128CLH7 NXP USA Inc. | 10475 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 22x16b; D/A 1x12b | 35 | - | 131072 | - | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK50DX128 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK21DN512VMC5 NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 121-LFBGA | YES | A/D 20x16b; D/A 1x12b | 64 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | Obsolete | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.635mm | 40 | MK21DN512 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MCF51AC256BCPUE NXP USA Inc. | 420 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 20x12b | 54 | - | 262144 | - | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MCF51AC256 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MK51DX256CLK10 NXP USA Inc. | 18 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 30x16b; D/A 2x12b | 39 | - | 262144 | - | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK51DX256 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||
 LPC4330FET100,551 NXP USA Inc. | 30000 |
| Datasheet | 12 Weeks | Surface Mount | 100-TFBGA | YES | A/D 4x10b; D/A 1x10b | 49 | - | 0 | - | -40°C~85°C TA | Tray | 2010 | LPC43xx | e1 | Active | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC4330 | 100 | S-PBGA-B100 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | - | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | NO | YES | 24 | - | - | CORTEX-M4 | - | - | - | 32 | - | FLASH | - | - | 1.2mm | 9mm | 9mm | ROHS3 Compliant | ||
MK10DX128VLF5 NXP USA Inc. | 1250 | - | - | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x16b | 33 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX128 | - | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MKE02Z16VFM4 NXP USA Inc. | 180 | - | - | 20 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 16x12b; D/A 2x6b | 28 | 2048 | 16384 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | 40 | - | - | S-XQCC-N32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MK40DN512VLK10 NXP USA Inc. | 7 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | 52 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK40DN512 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant |