- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
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 SPC5775KQK0MMY3R NXP USA Inc. | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 PK20N512VLQ100 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 144-LQFP | - | A/D 33x16b; D/A 2x12b | 100 | - | - | -40°C~105°C TA | Tray | 2013 | Kinetis K20 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | PK20N512 | - | - | - | - | - | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | - | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 P87LPC779HDH,529 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | - | A/D 4x8b; D/A 2x8b | 18 | - | - | -40°C~125°C TA | Tube | - | LPC700 | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | P87LPC779 | - | - | - | - | - | Internal | 20MHz | 128 x 8 | 2.7V~5.5V | - | 8051 | Brown-out Detect/Reset, POR, WDT | - | OTP | 8-Bit | 8KB 8K x 8 | I2C, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 PK21DX256VMB5 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 121-LFBGA | - | A/D 20x16b; D/A 1x12b | 64 | - | - | -40°C~105°C TA | Tray | - | Kinetis K20 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | PK21DX256 | - | - | - | - | - | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | - | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | Non-RoHS Compliant | ||
 PK50N512CMD100 NXP USA Inc. | In Stock | - | - | - | Surface Mount | 144-LBGA | - | A/D 25x16b; D/A 2x12b | 96 | - | - | -40°C~85°C TA | Tray | - | Kinetis K50 | - | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | PK50N512 | - | - | - | - | - | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | - | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08PB8MTJ NXP USA Inc. | 55 | - | Datasheet | 20 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 18 | - | - | -40°C~125°C TA | - | - | S08 | - | - | Active | 3 (168 Hours) | 20 | - | - | - | DUAL | GULL WING | - | 3V | 0.65mm | - | - | - | - | - | 5.5V | - | 2.7V | External | 20MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | 6.5mm | 4.4mm | - | ||
 MKE16Z32VLF4 NXP USA Inc. | 49 | - | Datasheet | 14 Weeks | Surface Mount | 48-LQFP | - | A/D 12x12b; D/A 1x8b | 42 | - | - | -40°C~105°C TA | - | - | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 48MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 32KB 32K x 8 | CANbus, I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 MC9S12XS128MAL NXP USA Inc. | 3 | - | Datasheet | 16 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | 131072 | - | -40°C~125°C TA | Tray | 2002 | HCS12X | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | - | 40 | MC9S12XS128 | S-PQFP-G112 | Not Qualified | 5.5V | 3.3/5V | 3.135V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | - | 16 | YES | NO | YES | NO | - | - | CPU12 | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MIMXRT633SFVKB NXP USA Inc. | 47 | - | Datasheet | 8 Weeks | - | - | - | - | - | - | - | - | - | - | - | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKE14Z64VLD4 NXP USA Inc. | 10000 | - | Datasheet | 14 Weeks | Surface Mount | 44-LQFP | - | A/D 12x12b; D/A 1x8b | 38 | - | - | -40°C~105°C TA | - | - | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MKE15Z64VLD4 NXP USA Inc. | 2400 | - | Datasheet | 14 Weeks | Surface Mount | 44-LQFP | - | A/D 12x12b; D/A 1x8b | 38 | - | - | -40°C~105°C TA | - | - | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | compliant | 40 | - | - | - | - | - | - | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | ||
MKE15Z32VLD4 NXP USA Inc. | 981 | - | Datasheet | 14 Weeks | Surface Mount | 44-LQFP | - | A/D 12x12b; D/A 1x8b | 38 | - | - | -40°C~105°C TA | - | - | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 48MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 S9S08DZ96F2MLL NXP USA Inc. | 370 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 24x12b | 87 | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | 100 | - | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | S9S08DZ96 | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | 2K x 8 | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 FS32K144UAT0VMHT NXP USA Inc. | 5 | - | Datasheet | 16 Weeks | Surface Mount | 100-LBGA | - | A/D 16x12b; D/A 1x8b | - | - | - | -40°C~105°C TA | Tray | - | S32K | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 112MHz | 64K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M4F | POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
 S912ZVMC12F1WKH NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 64-LQFP Exposed Pad | YES | A/D 9x12b | 31 | - | - | -40°C~150°C TA | Tray | 2012 | S12 MagniV | - | - | Obsolete | 3 (168 Hours) | 64 | 3A001.A.2.A | - | - | QUAD | GULL WING | - | - | 0.5mm | - | - | S912ZVMC12 | S-PQFP-G64 | Not Qualified | - | 5.5/18V | - | Internal | 50MHz | 8K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 55mA | 16 | - | - | - | - | - | 512 x 8 | CPU12 | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5775EDK3MME3R NXP USA Inc. | 42 |
| Datasheet | 16 Weeks | Surface Mount | 416-BGA | - | A/D 40x12b eQADCx2 | 293 | - | - | -40°C~125°C TA | Tape & Reel (TR) | - | MPC57xx | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | External | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | - | FLASH | 32-Bit Dual-Core | 4MB 4M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5553MVZ132 NXP USA Inc. | 42 | - | Datasheet | 12 Weeks | Surface Mount | 324-BBGA | YES | A/D 40x12b | 220 | 1572864 | Automotive grade | -40°C~125°C TA | Tray | 2008 | MPC55xx Qorivva | - | - | Active | 3 (168 Hours) | 324 | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.5V | 1mm | - | - | PC5553 | S-PBGA-B324 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 1.5KB 1.5K x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | 510mA | 32 | YES | NO | YES | - | 24 | - | - | AEC-Q100 | 32 | - | 23mm | 23mm | ROHS3 Compliant | ||
SPC5777CDK3MME4R NXP USA Inc. | 500 | - | Datasheet | 16 Weeks | Surface Mount | 416-BGA | YES | A/D 16b Sigma-Delta, eQADC | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | - | MPC57xx | - | - | Active | 3 (168 Hours) | 416 | - | - | - | BOTTOM | BALL | - | - | 1mm | - | - | - | - | - | 1.32V | - | 1.2V | Internal | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | 27mm | 27mm | ROHS3 Compliant | ||
 SPC5777CDK3MMO4R NXP USA Inc. | 42 | - | Datasheet | 16 Weeks | Surface Mount | 516-BGA | YES | A/D 16b Sigma-Delta, eQADC | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | - | MPC57xx | - | - | Active | 3 (168 Hours) | 516 | - | - | - | BOTTOM | BALL | - | - | 1mm | - | - | - | - | - | 1.32V | - | 1.2V | Internal | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | 27mm | 27mm | ROHS3 Compliant | ||
 SPC565MZP56DR2 NXP USA Inc. | 2244 | - | - | 14 Weeks | Surface Mount | 388-BBGA | - | A/D 40x10b | 56 | - | - | -40°C~125°C TA | Tape & Reel (TR) | 1999 | MPC5xx | e0 | - | Not For New Designs | 3 (168 Hours) | - | - | Tin/Lead (Sn/Pb) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | External | 56MHz | 36K x 8 | 2.5V~2.7V | MICROCONTROLLER, RISC | PowerPC | POR, PWM, WDT | - | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant |