- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
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![]() MC9S08PA32AVLC NXP USA Inc. | 15000 | - | Datasheet | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x12b | 28 | - | - | -40°C~105°C TA | Tray | 2013 | S08 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | - | 256 x 8 | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
![]() MCF5275CVM166 NXP USA Inc. | 180 | - | Datasheet | 12 Weeks | Surface Mount | 256-LBGA | YES | - | 69 | - | - | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5275 | S-PBGA-B256 | Not Qualified | 1.6V | - | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | - | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | - | - | - | - | 24 | - | - | YES | YES | - | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
![]() MCF5206ECAB40 NXP USA Inc. | 9 | - | Datasheet | 10 Weeks | Surface Mount | 160-BQFP | YES | - | 8 | - | - | -40°C~85°C TA | Tray | 1996 | MCF520x | e3 | Not For New Designs | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 245 | 3.3V | 0.65mm | 30 | MCF5206 | S-PQFP-G160 | - | 3.6V | - | 3V | External | 40MHz | 8K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 40MHz | ROMless | 32-Bit | - | EBI/EMI, I2C, UART/USART | 32 | - | - | - | - | 28 | - | - | YES | YES | - | 32 | FIXED POINT | YES | - | - | - | ROHS3 Compliant | ||
![]() MC9RS08KB2CSC NXP USA Inc. | 50 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 6 | 2048 | - | -40°C~85°C TA | Tube | 2009 | RS08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9RS08KB2 | R-PDSO-G8 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 126 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 2KB 2K x 8 | I2C, SPI | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | 4.9mm | 3.9mm | ROHS3 Compliant | ||
![]() MKL05Z16VLF4 NXP USA Inc. | 29 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 14x12b; D/A 1x12b | 41 | 16384 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL05Z16 | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
![]() MC9S08PA16VLC NXP USA Inc. | 2500 | - | Datasheet | 14 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x12b | 28 | 16384 | - | -40°C~105°C TA | Tray | 2002 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08PA16 | S-PQFP-G32 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
![]() MKL33Z256VMP4 NXP USA Inc. | 5000 | - | - | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D 20x16b; D/A 1x12b | 54 | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis KL3 | e1 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LCD, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
![]() MC9S08FL16CBM NXP USA Inc. | 748 | - | Datasheet | 10 Weeks | Through Hole | 32-SDIP (0.400, 10.16mm) | NO | A/D 12x8b | 30 | 16384 | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | Active | Not Applicable | 32 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | DUAL | - | NOT SPECIFIED | 5V | 1.778mm | NOT SPECIFIED | MC9S08FL16 | R-PDIP-T32 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 20MHz | 1K x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | SCI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 4.9mm | 28.1mm | 8.89mm | ROHS3 Compliant | ||
![]() MKL02Z16VFG4 NXP USA Inc. | 60 | - | Datasheet | 13 Weeks | Surface Mount | 16-UFQFN Exposed Pad | YES | A/D 6x12b | 14 | 16384 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL02 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL02Z16 | S-PQCC-N16 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 3mm | 3mm | ROHS3 Compliant | ||
![]() FS32K144HRT0MLHT NXP USA Inc. | 800 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | - | - | -40°C~125°C TA | Tray | - | S32K | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
![]() MC9S12A128CFUE NXP USA Inc. | 11 | - | Datasheet | 15 Weeks | Surface Mount | 80-QFP | YES | A/D 16x10b | 59 | 131072 | - | -40°C~85°C TA | Tray | 2002 | HCS12 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12A128 | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 2K x 8 | CPU12 | - | - | - | 16 | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
![]() MK10FX512VMD12 NXP USA Inc. | 49 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 66x16b; D/A 2x12b | 104 | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK10FX512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | - | 16K x 8 | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
![]() MCF51JM64VLH NXP USA Inc. | 800 |
| Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x12b | 51 | 65536 | - | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | Active | 3 (168 Hours) | 64 | 5A992 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MCF51JM64 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
![]() MCF51JM128VLH NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x12b | 51 | 131072 | - | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | Active | 3 (168 Hours) | 64 | 5A992 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MCF51JM128 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
![]() MC9S12GC96MFAE NXP USA Inc. | 1545 |
| Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 31 | - | - | -40°C~125°C TA | Tray | 2007 | HCS12 | e3 | Active | 3 (168 Hours) | 48 | EAR99 | MATTE TIN | ALSO REQUIRES 5V SUPPLY | - | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC9S12GC96 | S-PQFP-G48 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 96KB 96K x 8 | EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
![]() MC56F84766VLK NXP USA Inc. | 2102 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b, 10x16b; D/A 1x12b | 68 | 131072 | - | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F847 | S-PQFP-G80 | Not Qualified | 3.6V | 3/3.3V | 2.7V | Internal | 100MHz | 24K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC9S12XD64CAA NXP USA Inc. | 2000 | - | Datasheet | - | Surface Mount | 80-QFP | YES | A/D 8x10b | 59 | 65536 | - | -40°C~85°C TA | Tray | 2006 | HCS12X | e3 | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12XD64 | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | - | 1K x 8 | CPU12 | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
![]() S9S12G192F0VLH NXP USA Inc. | 5 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | 196608 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | - | 0.5mm | - | S9S12G192 | S-PQFP-G64 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | - | - | - | - | - | 4K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | ROHS3 Compliant | ||
![]() MC9S08QE96CFT NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 10x12b | 38 | 98304 | - | -40°C~85°C TA | Tray | 2006 | S08 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08QE96 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 6K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 96KB 96K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
![]() S912ZVCA19F0MLFR NXP USA Inc. | 2000 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 10x12b; D/A 1x8b | 28 | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2013 | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 12K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |