- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MKE02Z64VFM4 NXP USA Inc. | 40 | - | - | 20 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 16x12b; D/A 2x6b | 28 | 4096 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | 40 | - | S-XQCC-N32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MK40DX128VLL7 NXP USA Inc. | 144 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 34x16b; D/A 1x12b | 66 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK40DX128 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MIMXRT1051DVL6B NXP USA Inc. | 13000 | - | Datasheet | 14 Weeks | Surface Mount | 196-LFBGA | - | A/D 20x12b | 127 | - | - | - | 0°C~95°C TJ | Tray | 2017 | RT1050 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | Internal/External | 600MHz | 512K x 8 | 3V~3.6V | - | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 S9S12XS256J0VAL NXP USA Inc. | 8125 | - | Datasheet | 16 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | 12288 | 262144 | Automotive grade | -40°C~105°C TA | Tray | - | HCS12X | - | Active | 3 (168 Hours) | 112 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.65mm | - | - | S-PQFP-G112 | Not Qualified | 1.98V | 1.83.3/5V | 1.72V | External | 40MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, SCI, SPI | 35mA | 16 | YES | YES | YES | - | - | - | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MCF51AC256BCLKE NXP USA Inc. | 900 | - | Datasheet | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 24x12b | 69 | - | 262144 | - | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MCF51AC256 | S-PQFP-G80 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.74mm | 14mm | 14mm | ROHS3 Compliant | ||
MKL04Z8VFM4 NXP USA Inc. | 116 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 14x12b | 28 | - | 8192 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL04Z8 | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 1K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 5mm | 5mm | Non-RoHS Compliant | ||
MKL17Z32VFM4 NXP USA Inc. | 1 | - | - | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 11x16b | 28 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | TIN | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, FlexIO, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 0.65mm | 5mm | 5mm | ROHS3 Compliant | ||
 MPC5554MZP132 NXP USA Inc. | 5105 | - | Datasheet | - | Surface Mount | 416-BBGA | YES | A/D 40x12b | 256 | - | 2097152 | - | -40°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | e0 | Not For New Designs | 3 (168 Hours) | 416 | 3A991.A.2 | Tin/Lead (Sn/Pb) | IT ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC5554 | S-PBGA-B416 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, SCI, SPI | - | 32 | YES | NO | YES | NO | 24 | - | - | - | - | - | - | 32 | - | - | - | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||
 MK20DX32VLF5 NXP USA Inc. | 10006 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 11x16b | 29 | - | 32768 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX32 | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MCF51AC256ACPUE NXP USA Inc. | 9638 |
| Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 20x12b | 54 | - | 262144 | - | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MCF51AC256 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MCF5235CVM150 NXP USA Inc. | 3000 | - | Datasheet | 10 Weeks | Surface Mount | 256-LBGA | YES | - | 97 | - | - | - | -40°C~85°C TA | Tray | 2004 | MCF523x | - | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper - with Nickel barrier | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5235 | S-PBGA-B256 | Not Qualified | 1.6V | - | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | 32 | - | - | - | - | 24 | - | - | - | YES | YES | - | 32 | FIXED POINT | YES | - | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
MK20DN128VLH5 NXP USA Inc. | 419 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 13x16b | 40 | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN128 | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08PA4MTGR NXP USA Inc. | 14 | - | Datasheet | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 14 | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 2013 | S08 | - | Active | 3 (168 Hours) | 16 | - | - | - | - | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
MCF54417CMJ250 NXP USA Inc. | 200 | - | - | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x12b; D/A 2x12b | 87 | - | - | - | -40°C~85°C TA | Tray | 2006 | MCF5441x | e2 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MCF54417 | S-PBGA-B256 | Not Qualified | 1.32V | 1.21.81.8/3.33.3V | 1.14V | Internal | 250MHz | 64K x 8 | 1.14V~1.32V | MICROPROCESSOR | Coldfire V4 | DMA, PWM, WDT | 100MHz | ROMless | 32-Bit | - | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | - | 32 | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | - | - | ROHS3 Compliant | ||
 MC68332ACAG16 NXP USA Inc. | 1 | - | Datasheet | 10 Weeks | Surface Mount | 144-LQFP | YES | - | 15 | - | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68332 | S-PQFP-G144 | Not Qualified | - | - | - | Internal | 16MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 16MHz | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | - | 32 | NO | NO | YES | NO | 24 | - | - | - | - | - | - | 16 | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
MKE14F512VLL16 NXP USA Inc. | 4950 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | - | A/D 16x12b; D/A 1x12b | 89 | - | - | - | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xF | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | Internal | 168MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | DMA, LVD, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | FlexIO, I2C, SPI, UART/USART | - | - | - | - | - | - | - | 68K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK40DN512VMD10 NXP USA Inc. | 740 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 98 | - | 524288 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK40DN512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
 MCHC11F1CFNE3 NXP USA Inc. | 16 | - | Datasheet | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | - | - | - | -40°C~85°C TA | Tube | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | - | 5.25V | - | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | - | POR, WDT | 12MHz | ROMless | 8-Bit | - | SCI, SPI | - | 8 | YES | NO | NO | NO | 16 | 512 x 8 | - | - | - | - | - | 8 | - | - | EEPROM | 4.572mm | 24.2062mm | 24.2062mm | ROHS3 Compliant | ||
 MPC561MVR56 NXP USA Inc. | 9 | - | Datasheet | 14 Weeks | Surface Mount | 388-BBGA | YES | A/D 32x10b | 64 | - | 0 | - | -40°C~125°C TA | Tray | 1999 | MPC5xx | e1 | Not For New Designs | 3 (168 Hours) | 388 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.6V | 1mm | 40 | MPC561 | S-PBGA-B388 | Not Qualified | 2.7V | 2.65V | 2.5V | External | 56MHz | 32K x 8 | 2.5V~2.7V | MICROCONTROLLER | PowerPC | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, SCI, SPI, UART/USART | - | 32 | YES | YES | YES | - | 24 | - | - | - | - | - | - | 16 | - | - | - | - | 27mm | 27mm | ROHS3 Compliant | ||
MK60DN256ZVLL10 NXP USA Inc. | 69 | - | Datasheet | - | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MK60DN256 | S-PQFP-G100 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant |