- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | RAM (words) | ROM Programmability | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 S9S08DZ48F2CLH NXP USA Inc. | 270 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 24x12b | 53 | - | - | - | - | - | -40°C~85°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | S9S08DZ48 | - | - | 5.5V | - | - | 2.7V | External | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | 1.5K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S9S12ZVLS3F0MFM NXP USA Inc. | 32 | - | Datasheet | 12 Weeks | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | YES | A/D 6x10b | 19 | - | - | 1024 | 32768 | Automotive grade | -40°C~125°C TA | Tray | 2011 | S12 MagniV | - | - | Active | 3 (168 Hours) | 32 | - | - | - | 8542.31.00.01 | QUAD | NO LEAD | - | 12V | 0.5mm | - | - | - | S-PQCC-N32 | Not Qualified | 18V | 5.5/18V | - | 5.5V | Internal | 32MHz | 1K x 8 | 5.5V~18V | MICROCONTROLLER | S12Z | LVD, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 26mA | 16 | YES | NO | YES | - | - | 128 x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MKV10Z16VLF7 NXP USA Inc. | 3000 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b; D/A 1x12b | 40 | - | - | 8192 | 16384 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | - | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | - | 1.71V | Internal | 75MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | NO | - | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MK60DN256ZVLQ10 NXP USA Inc. | 21 | - | Datasheet | 15 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e3 | - | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK60DN256 | S-PQFP-G144 | Not Qualified | 3.6V | - | - | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S12XEQ512MAL NXP USA Inc. | 3260 | - | Datasheet | 12 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | - | - | - | 524288 | - | -40°C~125°C TA | Tray | 1998 | HCS12X | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.65mm | - | 40 | MC9S12XEQ512 | S-PQFP-G112 | Not Qualified | 1.98V | 3.3/5V | - | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | NO | YES | NO | - | 4K x 8 | - | CPU12 | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK30DX128VLL7 NXP USA Inc. | 18 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 38x16b; D/A 1x12b | 70 | - | - | - | 131072 | - | -40°C~105°C TA | Tray | 2010 | Kinetis K30 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK30DX128 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | - | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
S9S12G240F0MLF NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x10b | 40 | - | - | 11264 | 245760 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | - | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | - | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23.5mA | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08JM8CLD NXP USA Inc. | 17 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x12b | 33 | - | - | - | - | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | - | 40 | MC9S08JM8 | S-PQFP-G44 | - | 5.5V | - | - | 2.7V | External | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI, USB | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MKE14Z256VLL7 NXP USA Inc. | 594 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | 32768 | 262144 | - | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | - | FLEXRAM WITH 2KB FOR EEPROM EMULATION | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | - | NOT SPECIFIED | - | S-PQFP-G100 | - | 5.5V | - | - | 2.7V | Internal | 72MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | FlexIO, I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | 34K x 8 | 8 | - | - | - | - | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
MC9S08AW32CPUER NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | - | - | 2048 | 32768 | - | -40°C~85°C TA | Tape & Reel (TR) | 2000 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | - | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MKL05Z32VFK4 NXP USA Inc. | 21 | - | Datasheet | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b; D/A 1x12b | 22 | - | - | - | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | - | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | 12-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | - | 40 | MKL05Z32 | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | - | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | 1mm | 4mm | 4mm | ROHS3 Compliant | ||
 MKW36A512VFP4 NXP USA Inc. | 2940 | - | Datasheet | 14 Weeks | Surface Mount | 40-QFN | YES | - | 18 | 105°C | -40°C | - | - | Automotive grade | - | - | - | Automotive, AEC-Q100 | - | - | Active | 3 (168 Hours) | 40 | - | - | - | - | QUAD | NO LEAD | 260 | 3V | 0.5mm | compliant | 40 | - | S-PQCC-N40 | - | 3.6V | - | INDUSTRIAL | 1.71V | - | 48 MHz | - | - | MICROCONTROLLER, RISC | - | - | 32MHz | - | - | - | - | - | 32 | YES | YES | YES | NO | - | - | 8 | - | - | - | - | - | - | - | FLASH | - | - | 1mm | 6mm | 6mm | RoHS Compliant | ||
DSP56F801FA60E NXP USA Inc. | 44 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x12b | 11 | - | - | - | - | - | -40°C~85°C TA | Tray | 1998 | 56F8xx | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | DSP56F801 | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | - | 3V | Internal | 60MHz | 1K x 16 | 3V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800 | POR, PWM, WDT | 60MHz | FLASH | 16-Bit | 16KB 8K x 16 | SCI, SPI | - | 16 | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | 1024 | - | YES | MULTIPLE | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC68332GCEH20 NXP USA Inc. | 353 | - | Datasheet | 10 Weeks | Surface Mount | 132-BQFP Bumpered | YES | - | 15 | - | - | - | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 132 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 245 | 5V | 0.635mm | - | 30 | MC68332 | S-PQFP-G132 | Not Qualified | - | - | - | - | Internal | 20MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 20MHz | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | - | 32 | NO | NO | YES | NO | 24 | - | - | - | - | - | - | 16 | - | - | - | - | - | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | ||
MCF5212CAE66 NXP USA Inc. | 18 |
| Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 55 | - | - | - | - | - | -40°C~85°C TA | Tray | 2001 | MCF521x | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MCF5212 | S-PQFP-G64 | Not Qualified | 3.6V | - | - | 3V | Internal | 66MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC56F84550VLFR NXP USA Inc. | 14 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 10x12b; D/A 1x12b | 39 | - | - | 16384 | 98304 | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | - | S-PQFP-G48 | Not Qualified | 3.6V | 3/3.3V | - | 2.7V | Internal | 80MHz | 16K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MK21DX256AVLK5 NXP USA Inc. | 310 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 20x16b | 60 | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | - | S-PQFP-G80 | - | 3.6V | - | - | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
MC9S08LH64CLH NXP USA Inc. | 30 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x16b | 37 | - | - | - | 65536 | - | -40°C~85°C TA | Tray | 2010 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES WITH 2.1 V TO 1.8 V SUPPLY AT 20 MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MC9S08LH64 | S-PQFP-G64 | Not Qualified | 3.6V | 2/3.3V | - | 2.1V | Internal | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LCD, LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MC9S08DV16AMLF NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b | 39 | - | - | - | - | - | -40°C~125°C TA | Tray | 2013 | S08 | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MC9S08DV16 | S-PQFP-G48 | - | 5.5V | - | - | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MCF5216CVM66 NXP USA Inc. | 1000 | - | Datasheet | - | Surface Mount | 256-LBGA | YES | A/D 8x12b | 142 | - | - | - | - | - | -40°C~85°C TA | Tray | 2002 | MCF521x | e1 | - | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | - | 40 | MCF5216 | S-PBGA-B256 | Not Qualified | 3.6V | - | - | 2.7V | Internal | 66MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66.67MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, SPI, UART/USART | - | - | YES | YES | YES | NO | 24 | - | - | - | - | - | - | 32 | - | - | - | - | - | 1.6mm | 17mm | 17mm | ROHS3 Compliant |