- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | HTS Code | Terminal Position | Terminal Form | Supply Voltage | Terminal Pitch | Reach Compliance Code | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | EEPROM Size | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC908AS60AMFUE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 64-QFP | - | - | A/D 15x8b | 52 | -40°C~125°C TA | Tray | - | HC08 | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | MC908AS60 | - | - | Internal | 8.4MHz | 2K x 8 | 4.5V~5.5V | - | - | LVD, POR, PWM | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | - | - | - | - | 1K x 8 | - | - | ROHS3 Compliant | ||
 MC908AS32AMFNE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 52-LCC (J-Lead) | - | - | A/D 15x8b | 40 | -40°C~125°C TA | Tube | - | HC08 | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | MC908AS32 | - | - | Internal | 8.4MHz | 1K x 8 | 4.5V~5.5V | - | - | LVD, POR, PWM | - | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | - | - | - | - | 512 x 8 | - | - | ROHS3 Compliant | ||
 MC908KX8VPE NXP USA Inc. | In Stock | - | Datasheet | - | Through Hole | 16-DIP (0.300, 7.62mm) | - | 16-DIP | A/D 4x8b | 13 | -40°C~105°C TA | Tube | 2014 | HC08 | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | MC908KX8 | - | - | Internal | 8MHz | 192 x 8 | 2.7V~5.5V | - | HC08 | LVD, POR, PWM | - | FLASH | 8-Bit | 8KB 8K x 8 | SCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08RE60FGE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 44-LQFP | - | - | - | 39 | 0°C~70°C TA | Tray | 2014 | S08 | Obsolete | 3 (168 Hours) | - | 8542.31.00.01 | - | - | - | - | unknown | MC9S08RE60 | - | - | Internal | 8MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | SCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08GT32CFBE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 44-QFP | - | - | A/D 8x10b | 36 | -40°C~85°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | MC9S08GT32 | - | - | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC9S08RD32CFGE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 44-LQFP | - | - | - | 39 | -40°C~85°C TA | Tray | 2014 | S08 | Obsolete | 3 (168 Hours) | - | 8542.31.00.01 | - | - | - | - | unknown | MC9S08RD32 | - | - | Internal | 8MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | SCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC9S08RC32CFGE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 44-LQFP | - | - | - | 39 | -40°C~85°C TA | Tray | 2014 | S08 | Obsolete | 3 (168 Hours) | - | 8542.31.00.01 | - | - | - | - | unknown | MC9S08RC32 | - | - | Internal | 8MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | SCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08RC60FJE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 32-LQFP | - | - | - | 25 | 0°C~70°C TA | Tray | 2014 | S08 | Obsolete | 3 (168 Hours) | - | 8542.31.00.01 | - | - | - | - | unknown | MC9S08RC60 | - | - | Internal | 8MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | SCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC9S08RE32CFJE NXP USA Inc. | In Stock | - | Datasheet | - | Surface Mount | 32-LQFP | - | - | - | 25 | -40°C~85°C TA | Tray | 2014 | S08 | Obsolete | 3 (168 Hours) | - | 8542.31.00.01 | - | - | - | - | unknown | MC9S08RE32 | - | - | Internal | 8MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | SCI | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 FS32K116BRT0MFMR NXP USA Inc. | 8518 | - | - | 16 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | - | A/D 13x12b SAR; D/A 1x8b | 43 | -40°C~125°C TA | Tape & Reel (TR) | - | S32K | Active | 3 (168 Hours) | 32 | - | QUAD | NO LEAD | 5V | 0.5mm | - | - | 5.5V | 2.7V | Internal | 48MHz | 17K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, PWM, WDT | 40MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | 2K x 8 | 5mm | 5mm | ROHS3 Compliant | ||
FS32K116LFT0MFMR NXP USA Inc. | 6000 | - | - | 16 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | - | A/D 13x12b SAR; D/A 1x8b | 43 | -40°C~125°C TA | Tape & Reel (TR) | - | S32K | Active | 3 (168 Hours) | 32 | - | QUAD | NO LEAD | 5V | 0.5mm | - | - | 5.5V | 2.7V | Internal | 48MHz | 17K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M0+ | DMA, PWM, WDT | 40MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 2K x 8 | 5mm | 5mm | ROHS3 Compliant | ||
 S9S12G96AVLHR NXP USA Inc. | 37 | - | - | 12 Weeks | Surface Mount | 64-LQFP | - | - | A/D 12x10b | 54 | -40°C~105°C TA | Tape & Reel (TR) | - | HCS12 | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | - | CPU12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | - | - | - | 3K x 8 | - | - | ROHS3 Compliant | ||
FS32K116LIT0VFMR NXP USA Inc. | 2500 | - | - | 16 Weeks | Surface Mount | 32-VFQFN Exposed Pad | - | - | A/D 13x12b SAR; D/A 1x8b | 43 | -40°C~105°C TA | Tape & Reel (TR) | - | S32K | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 48MHz | 17K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M0+ | DMA, PWM, WDT | - | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | - | - | - | 2K x 8 | - | - | ROHS3 Compliant | ||
 LPC5528JBD100K NXP USA Inc. | 3800 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | - | - | A/D 10x16b | 64 | -40°C~105°C TA | - | - | LPC552x | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 150MHz | 256K x 8 | 1.8V~3.6V | - | ARM® Cortex®-M33 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB | - | - | - | - | - | - | - | ROHS3 Compliant | ||
LPC55S28JEV98K NXP USA Inc. | 48 | - | Datasheet | 16 Weeks | Surface Mount | 98-VFBGA | - | - | A/D 10x16b | 64 | -40°C~105°C TA | - | - | LPC55S2x | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 150MHz | 256K x 8 | 1.8V~3.6V | - | ARM® Cortex®-M33 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 512KB 512K x 8 | Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5744BBK1AMMH6 NXP USA Inc. | 33 | - | - | 10 Weeks | Surface Mount | 100-LBGA | - | - | A/D 36x10b, 16x12b | - | -40°C~125°C TA | Tray | - | MPC57xx | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 160MHz | 192K x 8 | 3.15V~5.5V | - | e200z4 | DMA, I2S, POR, WDT | - | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | - | - | - | - | 64K x 8 | - | - | ROHS3 Compliant | ||
 S9S12DG12W2CPVER NXP USA Inc. | 33 | - | - | - | Surface Mount | 112-LQFP | - | - | A/D 16x10b | 91 | -40°C~85°C TA | Tape & Reel (TR) | - | HCS12 | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | - | - | PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | 2K x 8 | - | - | ROHS3 Compliant | ||
SP5746BBK1AMMH6R NXP USA Inc. | 33 | - | - | 16 Weeks | Surface Mount | 100-LBGA | - | - | A/D 36x10b, 16x12b | - | -40°C~125°C TA | Tape & Reel (TR) | - | MPC57xx | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 160MHz | 384K x 8 | 3.15V~5.5V | - | e200z4 | DMA, I2S, POR, WDT | - | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | - | - | - | - | 64K x 8 | - | - | ROHS3 Compliant | ||
S9S12DG25F0CPVE NXP USA Inc. | 50 | - | - | 13 Weeks | Surface Mount | 112-LQFP | - | - | A/D 16x10b | 91 | -40°C~85°C TA | Tray | 2011 | HCS12 | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | - | - | PWM, WDT | - | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | 4K x 8 | - | - | ROHS3 Compliant | ||
 SPC5746CSK1AVKU6 NXP USA Inc. | In Stock | - | - | 8 Weeks | Surface Mount | 176-LQFP Exposed Pad | - | - | A/D 80x10b, 64x12b | 129 | -40°C~105°C TA | Tray | - | MPC57xx | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | Internal | 80MHz, 160MHz | 512K x 8 | 3V~5.5V | - | e200z2, e200z4 | DMA, LVD, POR, WDT | - | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | - | - | - | - | - | - | - | ROHS3 Compliant |