- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
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 SPC5674FF3MVR3 NXP USA Inc. | 2539 | - | Datasheet | 12 Weeks | Surface Mount | 416-BBGA | YES | A/D 64x12b | 32 | - | 4194304 | Automotive grade | -40°C~125°C TA | Tray | 2008 | MPC56xx Qorivva | e2 | - | Active | 3 (168 Hours) | 416 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | SPC5674 | S-PBGA-B416 | Not Qualified | - | 1.23.35V | 1.14V | External | 264MHz | 256K x 8 | 1.08V~5.25V | MICROCONTROLLER, RISC | e200z7 | DMA, POR, PWM | 40MHz | FLASH | 32-Bit | 4MB 4M x 8 | CANbus, SCI, SPI | 1000mA | 32 | YES | YES | YES | - | - | - | - | - | AEC-Q100 | - | - | 27mm | 27mm | ROHS3 Compliant | ||
 MK24FN256VDC12 NXP USA Inc. | 10086 | - | Datasheet | 52 Weeks | Surface Mount | 121-XFBGA | YES | A/D 37x16b; D/A 2x12b | 83 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK24FN256 | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MC9S08PA8AVTGR NXP USA Inc. | 44 | - | Datasheet | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 14 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2006 | S08 | - | - | Active | 3 (168 Hours) | 16 | - | - | - | - | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 S9S08SG32E1VTLR NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | YES | A/D 16x10b | 22 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 1999 | S08 | - | - | Active | 3 (168 Hours) | 28 | - | - | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | NOT SPECIFIED | S9S08SG32 | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | 9.7mm | 4.4mm | ROHS3 Compliant | ||
 SPC5606BK0MLL6R NXP USA Inc. | 18 | - | Datasheet | 14 Weeks | Surface Mount | 100-LQFP | YES | A/D 7x10b, 5x12b | 77 | 81920 | 1048576 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | - | S-PQFP-G100 | Not Qualified | - | 3.3/5V | - | Internal | 64MHz | 80K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z0h | DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | - | - | - | - | - | 64K x 8 | - | - | AEC-Q100 | - | - | 14mm | 14mm | ROHS3 Compliant | ||
S9S12G192F0CLL NXP USA Inc. | 445 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x10b | 86 | 11264 | 196608 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | - | S-PQFP-G100 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23.5mA | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | AEC-Q100 | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 S9KEAZN16ACLH NXP USA Inc. | 29 | - | - | 20 Weeks | Surface Mount | 64-LQFP | - | A/D 16x12b | 57 | - | - | - | -40°C~85°C TA | Tray | 2012 | Kinetis KEA | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5606SF2VLU6 NXP USA Inc. | 4000 | - | - | 12 Weeks | Surface Mount | 176-LQFP | YES | A/D 16x10b | 136 | - | 1048576 | Automotive grade | -40°C~105°C TA | Tray | 2008 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 176 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | SPC5606 | S-PQFP-G176 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 48K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, LCD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, QSPI, SCI, SPI | 180mA | 32 | YES | YES | YES | - | - | 64K x 8 | - | - | AEC-Q100 | - | - | 24mm | 24mm | ROHS3 Compliant | ||
FS32K146HNT0VLLT NXP USA Inc. | 30000 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 24x12b; D/A 1x8b | 89 | - | - | - | -40°C~105°C TA | Tray | - | S32K | - | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 80MHz | 128K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 S9S08QD2J1CSCR NXP USA Inc. | 12500 | - | Datasheet | 16 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | 128 | - | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2004 | S08 | e3 | - | Active | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | - | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 2KB 2K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | AEC-Q100 | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
 MC9S12XDT256CAL NXP USA Inc. | 6540 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | 262144 | - | -40°C~85°C TA | Tray | 2005 | HCS12X | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12XDT256 | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 16K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 4K x 8 | - | CPU12 | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 S9S12P64J0MFT NXP USA Inc. | 2860 | - | Datasheet | 16 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | - | 65536 | Automotive grade | -40°C~125°C TA | Tray | 1998 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | NO LEAD | - | 5V | 0.5mm | - | 9S12P64 | S-PQCC-N48 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 4K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | AEC-Q100 | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MC912DT128ACPVE NXP USA Inc. | 180 | - | Datasheet | - | Surface Mount | 112-LQFP | YES | A/D 16x8/10b | 67 | - | - | - | -40°C~85°C TA | Tray | 1994 | HC12 | e3 | - | Not For New Designs | 3 (168 Hours) | 112 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MC912DT128 | S-PQFP-G112 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 8K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 2K x 8 | - | - | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK10DN512ZVLK10 NXP USA Inc. | 3256 | - | Datasheet | - | Surface Mount | 80-LQFP | YES | A/D 37x16b; D/A 1x12b | 56 | - | - | - | -40°C~105°C TA | Tray | 2013 | Kinetis K10 | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G80 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 MKL05Z32VFM4R NXP USA Inc. | 5037 | - | - | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 14x12b; D/A 1x12b | 28 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL0 | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
S9S08DZ60F2MLHR NXP USA Inc. | 7870 | - | - | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 24x12b | 53 | - | - | - | -40°C~125°C TA | Tape & Reel (TR) | 1996 | S08 | - | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | - | - | 5.5V | - | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | 2K x 8 | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S9S12G48F1VLC NXP USA Inc. | 10 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | A/D 12x10b | 26 | - | 49152 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 32 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.8mm | - | S9S12G48 | S-PQFP-G32 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 1.5K x 8 | - | CPU12 | AEC-Q100 | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 S9S08AW32E5MFGE NXP USA Inc. | 797 | - | Datasheet | 12 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x10b | 34 | - | 32768 | Automotive grade | -40°C~125°C TA | Tray | 2013 | S08 | - | - | Active | 3 (168 Hours) | 44 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.8mm | - | S9S08AW32 | S-PQFP-G44 | Not Qualified | - | 3/5V | - | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | - | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | ROHS3 Compliant | ||
MKE14Z128VLH7 NXP USA Inc. | 11 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | 16384 | 131072 | - | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xZ | - | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | FLEXRAM WITH 2KB FOR EEPROM EMULATION | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 72MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | FlexIO, I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | 34K x 8 | 8 | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 S9S12G64AMLF NXP USA Inc. | 1733 | - | - | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 12x10b | 40 | - | - | - | -40°C~125°C TA | Tray | - | HCS12 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant |