- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | ROM Programmability | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MK30DX128VMC7 NXP USA Inc. | 21 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | - | A/D 38x16b; D/A 1x12b | 74 | - | 131072 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K30 | e1 | - | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK30DX128 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MC9S08PT60AVQH NXP USA Inc. | 840 | - | Datasheet | 20 Weeks | Surface Mount | 64-QFP | YES | - | A/D 16x12b | 57 | 4096 | 61440 | - | -40°C~105°C TA | Tray | 2012 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.8mm | 40 | - | - | S-PQFP-G64 | Not Qualified | - | 3/5V | - | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 8 | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK12DX256VLH5 NXP USA Inc. | 1 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 22x16b; D/A 1x12b | 44 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK12DX256 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | - | 4K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC908QY2ACDWE NXP USA Inc. | 9000 | - | Datasheet | 10 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | - | A/D 6x10b | 13 | - | - | - | -40°C~85°C TA | Tube | 1996 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | 40 | MC908QY2 | - | R-PDSO-G16 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||
 MC9S08SE8VTG NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 10x10b | 14 | - | 8192 | - | -40°C~105°C TA | Tube | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08SE8 | - | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MK53DN512CLQ10 NXP USA Inc. | 7 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | - | A/D 41x16b; D/A 2x12b | 94 | - | 524288 | - | -40°C~85°C TA | Tray | 2011 | Kinetis K50 | e3 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK53DN512 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S12E64CPVE NXP USA Inc. | 1000 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | - | A/D 16x10b; D/A 2x8b | 92 | - | - | - | -40°C~85°C TA | Tray | 2003 | HCS12 | e3 | - | Active | 3 (168 Hours) | 112 | EAR99 | MATTE TIN | ALSO REQUIRES 3.3V OR 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12E64 | - | S-PQFP-G112 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~2.75V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SCI, SPI | 16 | YES | NO | YES | YES | 16 | - | - | - | - | - | 16 | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC56F8011VFAE NXP USA Inc. | 10000 |
| Datasheet | 10 Weeks | Surface Mount | 32-LQFP | YES | - | A/D 6x12b | 26 | - | 12288 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 40 | MC56F8011 | - | S-PQFP-G32 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 32MHz | 1K x 16 | 3V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 8MHz | FLASH | 16-Bit | 12KB 6K x 16 | I2C, SCI, SPI | 16 | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
LPC4330FBD144,551 NXP USA Inc. | 13000 |
| Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | - | A/D 8x10b; D/A 1x10b | 83 | - | 0 | - | -40°C~85°C TA | Tray | 2009 | LPC43xx | e3 | - | Active | 3 (168 Hours) | 144 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC4330 | 144 | S-PQFP-G144 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | - | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | - | CORTEX-M4 | - | - | - | 32 | - | FLASH | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08GW64CLK NXP USA Inc. | 5000 | - | - | 10 Weeks | Surface Mount | 80-LQFP | YES | - | A/D 16x16b | 45 | - | 65536 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES WITH 1.8 V MINIMUM SUPPLY AT 10 MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08GW64 | - | S-PQFP-G80 | Not Qualified | 3.6V | 2/3.3V | 2.15V | Internal | 20MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LCD, PWM, WDT | 16MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
MC9S08DZ32ACLC NXP USA Inc. | 1258 |
| Datasheet | 10 Weeks | Surface Mount | 32-LQFP | - | 32-LQFP (7x7) | A/D 10x12b | 25 | - | - | - | -40°C~85°C TA | Tray | 1996 | S08 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9S08DZ32 | - | - | - | - | - | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | - | S08 | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC9S08PT60VLH NXP USA Inc. | 550 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x12b | 57 | - | 61440 | - | -40°C~105°C TA | Tray | 2002 | S08 | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.5mm | 40 | MC9S08PT60 | - | S-PQFP-G64 | Not Qualified | - | 3/5V | - | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 8 | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
S9S12P128J0MLH NXP USA Inc. | 27 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 10x12b | 49 | - | 131072 | Automotive grade | -40°C~125°C TA | Tray | 2004 | HCS12 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | 9S12P128 | - | S-XQFP-G64 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | - | 4K x 8 | CPU12 | - | - | AEC-Q100 | 16 | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MKV10Z128VLF7 NXP USA Inc. | 10000 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 2x16b; D/A 1x12b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-PQFP-G48 | - | 3.6V | - | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | YES | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 SPC5744PGK1AMMM9 NXP USA Inc. | 1500 | - | Datasheet | 16 Weeks | Surface Mount | 257-LFBGA | YES | - | A/D 64x12b | - | - | - | - | -40°C~125°C TA | Tray | 2010 | MPC57xx | - | yes | Active | 3 (168 Hours) | 257 | - | - | - | - | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | - | - | - | - | 3.6V | - | 3.15V | Internal | 200MHz | 384K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 2.5MB 2.5M x 8 | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | 32 | YES | YES | YES | - | 32 | - | - | - | - | - | 64 | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 SPC5606BK0MLU6 NXP USA Inc. | 378 | - | Datasheet | 14 Weeks | Surface Mount | 176-LQFP | YES | - | A/D 29x10b, 5x12b | 149 | - | 1048576 | Automotive grade | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 176 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | SPC5606 | - | S-PQFP-G176 | Not Qualified | - | 3.3/5V | - | Internal | 64MHz | 80K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z0h | DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | - | - | - | - | - | 64K x 8 | - | - | - | AEC-Q100 | - | - | - | - | - | - | 24mm | 24mm | ROHS3 Compliant | ||
S9S08SG8E2MTG NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 8x10b | 12 | - | 8192 | Automotive grade | -40°C~125°C TA | Tube | 1999 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | S9S08SG8 | - | R-PDSO-G16 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 MC9S08QD2CSCR NXP USA Inc. | 5000 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | A/D 4x10b | 4 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | IT ALSO OPERATES AT 3V SUPPLY | - | DUAL | GULL WING | 260 | 5V | 1.27mm | 40 | MC9S08QD2 | - | R-PDSO-G8 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 2KB 2K x 8 | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
MK20DX64VLH7 NXP USA Inc. | 143 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 24x16b; D/A 1x12b | 40 | - | 65536 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX64 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MKL26Z256VMP4 NXP USA Inc. | 12 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | - | A/D - 16bit; D/A - 12bit | 50 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MKL26Z256 | - | S-PBGA-B64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant |