- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 S9S08SG8E2CTJR NXP USA Inc. | 12500 | - | Datasheet | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 12x10b | 16 | - | 8192 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1999 | S08 | e3 | Active | 3 (168 Hours) | 20 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | - | 40 | S9S08SG8 | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | 1.2mm | 6.5mm | 5mm | ROHS3 Compliant | ||
 S9S12GN48F0CLH NXP USA Inc. | 5500 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 12x10b | 54 | - | 49152 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.5mm | - | - | S9S12GN48 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 1.5K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 LPC11U68JBD100E NXP USA Inc. | 59310 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 12x12b | 80 | - | 262144 | - | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | - | Discontinued | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | NOT SPECIFIED | LPC11U | 100 | S-PQFP-G100 | - | 3.6V | - | 2.4V | Internal | 50MHz | 36K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | - | 32 | YES | YES | YES | NO | - | 4K x 8 | 8 | - | - | - | - | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
 MKL17Z128VMP4 NXP USA Inc. | 5120 | - | - | 13 Weeks | Surface Mount | 64-LFBGA | YES | - | A/D 20x16b; D/A 1x12b | 54 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e1 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 3V | 0.5mm | - | 40 | - | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MC56F8365MFGE NXP USA Inc. | 50 | - | Datasheet | 10 Weeks | Surface Mount | 128-LQFP | YES | - | A/D 16x12b | 49 | - | 524288 | - | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MC56F8365 | - | R-PQFP-G128 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 18K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | CANbus, EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 11 | - | - | - | YES | YES | - | 4 | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||
 LPC54113J128BD64QL NXP USA Inc. | 320 | - | Datasheet | 18 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 12x12b | 48 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC54100 | - | Active | 1 (Unlimited) | 64 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | NOT SPECIFIED | - | 64 | - | - | 3.6V | - | 1.62V | Internal | 100MHz | 96K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC908GR16VFAE NXP USA Inc. | 21 | - | Datasheet | - | Surface Mount | 48-LQFP | YES | - | A/D 8x10b | 37 | - | - | - | -40°C~105°C TA | Tray | 2007 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY AT 4.1MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | - | 40 | MC908GR16 | - | S-PQFP-G48 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 1K x 8 | 3V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32.8MHz | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 S9S12P128J0MQK NXP USA Inc. | 3634 | - | Datasheet | 16 Weeks | Surface Mount | 80-QFP | YES | - | A/D 10x12b | 64 | - | 131072 | Automotive grade | -40°C~125°C TA | Tray | 2004 | HCS12 | e3 | Active | 3 (168 Hours) | 80 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | - | 40 | 9S12P128 | - | S-XQFP-G80 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | - | 16 | YES | NO | YES | YES | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | 16 | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC68711E20CFNE3 NXP USA Inc. | 1352 | - | - | - | Surface Mount | 52-LCC (J-Lead) | YES | - | A/D 8x8b | 38 | - | - | - | -40°C~85°C TA | Tube | 2005 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | SEATED HEIGHT CALCULATED | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | - | 30 | MC68711 | - | S-PQCC-J52 | - | 5.5V | - | 4.5V | Internal | 3MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | - | POR, WDT | 12MHz | OTP | 8-Bit | 20KB 20K x 8 | SCI, SPI | - | 8 | YES | NO | NO | NO | 16 | 512 x 8 | - | - | - | - | - | 8 | - | - | - | - | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | ||
S9S12G64F0MLH NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 12x10b | 54 | - | 65536 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.5mm | - | - | S9S12G64 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 2K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK22FN1M0VLL12 NXP USA Inc. | 10086 | - | Datasheet | 14 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 33x16b; D/A 1x12b | 66 | - | 1048576 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | - | 40 | MK22FN1M0 | - | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S08QA2CDNE NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | A/D 4x10b | 4 | - | - | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | Active | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | - | 40 | MC9S08QA2 | - | R-PDSO-G8 | Not Qualified | 3.6V | 2/3.3V | 1.8V | Internal | 20MHz | 160 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 2KB 2K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
 MC908QB4CDWE NXP USA Inc. | 1 | - | Datasheet | 10 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | - | A/D 10x10b | 13 | - | - | - | -40°C~85°C TA | Tube | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | - | 40 | MC908QB4 | - | R-PDSO-G16 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 4KB 4K x 8 | SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||
MC9S08DZ32AMLH NXP USA Inc. | 11222 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | - | 64-LQFP (10x10) | A/D 24x12b | 53 | - | - | - | -40°C~125°C TA | Tray | 2005 | S08 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | MC9S08DZ32 | - | - | - | - | - | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | - | S08 | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MCF51QE64CLH NXP USA Inc. | 10000 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 20x12b | 54 | - | 65536 | - | -40°C~85°C TA | Tray | 2006 | MCF51QE | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MCF51QE64 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MK10DX256VLH7R NXP USA Inc. | 1500 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 26x16b; D/A 1x12b | 44 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK10DX256 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 LPC54101J256UK49Z NXP USA Inc. | 64000 | - | Datasheet | 26 Weeks | Surface Mount | 49-UFBGA, WLCSP | YES | - | A/D 12x12b | 39 | 106496 | 262144 | - | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC54100 | - | Active | 1 (Unlimited) | 49 | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.4mm | - | NOT SPECIFIED | - | - | S-PBGA-B49 | - | 3.6V | - | 1.62V | Internal | 100MHz | 104K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | 8 | - | - | - | - | - | - | - | - | - | 0.58mm | 3.29mm | 3.29mm | ROHS3 Compliant | ||
 MC9S08QG8CFFE NXP USA Inc. | 82 | - | Datasheet | 10 Weeks | Surface Mount | 16-VQFN Exposed Pad | YES | - | A/D 8x10b | 12 | - | 8192 | - | -40°C~85°C TA | Tray | 2005 | S08 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | - | 40 | MC9S08QG8 | - | S-XQCC-N16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
 MKV10Z128VFM7 NXP USA Inc. | 12 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | - | A/D 2x16b; D/A 1x12b | 28 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | - | NOT SPECIFIED | - | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | - | YES | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MCF5474ZP266 NXP USA Inc. | 550 | - | Datasheet | 14 Weeks | Surface Mount | 388-BBGA | YES | - | - | 99 | - | - | - | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | Not For New Designs | 3 (168 Hours) | 388 | - | TIN LEAD | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | unknown | 40 | MCF5474 | - | S-PBGA-B388 | Not Qualified | 1.58V | - | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | - | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | - | 32 | - | - | - | - | 32 | - | - | - | YES | YES | - | 32 | FLOATING POINT | YES | - | - | 2.55mm | 27mm | 27mm | Non-RoHS Compliant |