- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
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 MC9S08PT16AVTG NXP USA Inc. | 10000 | - | Datasheet | 20 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | - | - | A/D 12x12b | 14 | - | - | - | -40°C~105°C TA | Tube | 2002 | S08 | e3 | - | Active | 3 (168 Hours) | - | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68LK332ACAG16 NXP USA Inc. | 999 | - | Datasheet | 10 Weeks | Surface Mount | 144-LQFP | YES | - | - | 15 | - | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | - | Not For New Designs | 3 (168 Hours) | 144 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC68LK332 | - | S-PQFP-G144 | Not Qualified | - | - | - | Internal | 16.78MHz | 2K x 8 | 3V~3.6V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 16MHz | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | - | 32 | NO | NO | YES | NO | 24 | - | - | - | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK22FX512VLH12 NXP USA Inc. | 4 | - | Datasheet | - | Surface Mount | 64-LQFP | YES | - | A/D 22x16b; D/A 1x12b | 40 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK22FX512 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S9S12G128F0CLL NXP USA Inc. | 3150 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 12x10b | 86 | - | 131072 | Automotive grade | -40°C~85°C TA | Tray | 2011 | HCS12 | - | - | Active | 3 (168 Hours) | 100 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12G128 | - | S-PQFP-G100 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | - | - | 4K x 8 | - | CPU12 | AEC-Q100 | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK10DX128VMP5 NXP USA Inc. | 22 | - | - | 13 Weeks | Surface Mount | 64-LFBGA | YES | - | A/D 19x16b | 44 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MK10DX128 | - | S-PBGA-B64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | 1.2mm | 5mm | 5mm | ROHS3 Compliant | ||
 MC912D60AMFUE8 NXP USA Inc. | 33 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | - | A/D 8x8/10b | 48 | - | - | - | -40°C~125°C TA | Tray | 1994 | HC12 | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MC912D60 | - | S-PQFP-G80 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 60KB 60K x 8 | CANbus, MI Bus, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 1K x 8 | - | - | - | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
MK50DX256CLL7 NXP USA Inc. | 37 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 34x16b; D/A 1x12b | 59 | - | 262144 | - | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK50DX256 | - | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MC908AZ60AVFUE NXP USA Inc. | 458 | - | Datasheet | - | Surface Mount | 64-QFP | YES | - | A/D 15x8b | 52 | - | - | - | -40°C~105°C TA | Tray | 1996 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908AZ60 | - | S-PQFP-G64 | Not Qualified | 5.5V | - | 4.5V | Internal | 8.4MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 1K x 8 | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
MKE06Z128VQH4 NXP USA Inc. | 1260 | - | - | 20 Weeks | Surface Mount | 64-QFP | YES | - | A/D 16x12b; D/A 2x6b | 58 | 16384 | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE06 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | - | 8 | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC68HC11E0CFNE2 NXP USA Inc. | 3000 | - | Datasheet | - | Surface Mount | 52-LCC (J-Lead) | YES | - | A/D 8x8b | 38 | - | - | - | -40°C~85°C TA | Tray | 1996 | HC11 | e3 | - | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | SEATED HEIGHT CALCULATED | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MC68HC11 | - | S-PQCC-J52 | - | 5.5V | - | 4.5V | Internal | 2MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | - | POR, WDT | 8MHz | ROMless | 8-Bit | - | SCI, SPI | - | 8 | YES | NO | NO | NO | 16 | - | - | - | - | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | ||
 SPC5748GGK1MMJ6 NXP USA Inc. | 200 | - | Datasheet | 18 Weeks | Surface Mount | 256-LBGA | YES | - | A/D 80x10b, 64x12b | 178 | 786432 | 6291456 | Automotive grade | -40°C~125°C TA | Bulk | 2016 | MPC57xx | - | yes | Active | 3 (168 Hours) | 256 | - | - | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORT CAN FD, 2ND ETHERNET | - | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | - | - | S-PBGA-B256 | - | 1.32V | - | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | - | 32 | YES | YES | NO | NO | - | - | 8 | - | ISO 26262 | - | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||
 LPC1343FBD48,151 NXP USA Inc. | 10 |
| Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 8x10b | 40 | - | 32768 | - | -40°C~85°C TA | Tray | 2009 | LPC13xx | e3 | - | Active | 1 (Unlimited) | 48 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | LPC1343 | 48 | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | 2V | Internal | 72MHz | 8K x 8 | 2V~3.6V | MICROCONTROLLER | ARM® Cortex®-M3 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | - | 32 | YES | NO | NO | NO | - | - | 8 | ARM7 | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC812A4CPVE8 NXP USA Inc. | 7388 |
| Datasheet | - | Surface Mount | 112-LQFP | YES | - | A/D 8x8b | 83 | - | 4096 | - | -40°C~85°C TA | Tray | 1999 | HC12 | - | - | Not For New Designs | 3 (168 Hours) | 112 | EAR99 | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.65mm | - | MC812 | - | S-PQFP-G112 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 8MHz | 1K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, WDT | 16MHz | EEPROM | 16-Bit | 4KB 4K x 8 | SCI, SPI | - | 16 | YES | NO | NO | - | 22 | - | - | - | - | 16 | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC56F8002VWL NXP USA Inc. | 4213 | - | Datasheet | 12 Weeks | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | YES | - | A/D 15x12b | 23 | - | 12288 | - | -40°C~105°C TA | Tube | 1999 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 40 | MC56F8002 | - | R-PDSO-G28 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 32MHz | 1K x 16 | 1.8V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 64MHz | FLASH | 16-Bit | 12KB 6K x 16 | I2C, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | - | - | - | - | - | 2.65mm | 17.925mm | 7.5mm | ROHS3 Compliant | ||
MKE02Z32VQH4 NXP USA Inc. | 84 | - | - | 20 Weeks | Surface Mount | 64-QFP | YES | - | A/D 16x12b; D/A 2x6b | 57 | 4096 | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MKS22FN256VLH12 NXP USA Inc. | 1472 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 1x16b; D/A 1x12b | 40 | - | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis KS22 | - | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | - | - | 3.6V | - | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
FS32K144URT0VLHT NXP USA Inc. | 5 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x12b; D/A 1x8b | 58 | - | - | - | -40°C~105°C TA | Tray | - | S32K | - | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 112MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
S9S12G128AMLH NXP USA Inc. | 5376 | - | - | 12 Weeks | Surface Mount | 64-LQFP | - | - | A/D 12x10b | 54 | - | - | - | -40°C~125°C TA | Tray | - | HCS12 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MKM34Z128CLL5 NXP USA Inc. | 503 | - | Datasheet | 26 Weeks | Surface Mount | 100-LQFP | YES | - | A/D 12x16b, 4x24b | 68 | - | - | - | -40°C~85°C TA | Tray | 2002 | Kinetis KM | e3 | - | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | VOLTAGE RANGE: 2.7 V TO 3.6 V (WHEN ANALOG FRONT END (AFE) IS USED) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKM34Z128 | - | S-PQFP-G100 | - | 3.6V | - | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LCD, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | NO | NO | - | - | - | - | - | - | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC68331CEH16 NXP USA Inc. | 323 | - | Datasheet | 10 Weeks | Surface Mount | 132-BQFP Bumpered | - | 132-PQFP (24.13x24.13) | - | 18 | - | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68331 | - | - | - | - | - | - | Internal | 16MHz | - | 4.5V~5.5V | - | CPU32 | POR, PWM, WDT | - | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |