- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | ADC Resolution (bit) | Analog Comparators | Brand | DAC Resolution (bit) | Data Bus Width (bit) | Data Converters | ECCN (US) | Factory Pack QuantityFactory Pack Quantity | Family Name | I2C | I2S | Instruction Set Architecture | Interface Type | Manufacturer | Maximum Clock Rate (MHz) | Maximum CPU Frequency (MHz) | Maximum Expanded Memory Size | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | No. of Timers | Number of ADCs | Number of DAC's | Number of I/Os | Package Height | Package Length | Package Width | Parallel Master Port | Part # Aliases | PCB changed | Programmability | RAM(byte) | Real Time Clock | RoHS | ROM(word) | Standard Package Name | Supplier Package | Typical Operating Supply Voltage (V) | UART | Usage Level | USART | Watchdog | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | Product Type | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Ethernet | USB | SPI | CAN | PWM | Product Category | ADC Channels | Device Core | Height Seated (Max) | Length | Width | RoHS Status |
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 MC9S08DZ16AMLF NXP USA Inc. | 3037 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | - | 48-LQFP (7x7) | - | - | - | - | - | A/D 16x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 39 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2008 | S08 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | MC9S08DZ16 | - | - | - | - | - | - | External | 40MHz | 1K x 8 | 2.7V~5.5V | - | S08 | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC908AP32CFBE NXP USA Inc. | 1027 | - | Datasheet | - | Surface Mount | 44-QFP | YES | - | - | - | - | - | - | A/D 8x10b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908AP32 | - | - | - | 5.5V | - | 4.5V | Internal | 8MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LED, LVD, POR, PWM | 8MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, IRSCI, SCI, SPI | - | 8 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MKL02Z16VFK4 NXP USA Inc. | 59 | - | Datasheet | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | - | - | - | - | - | - | A/D 12x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 22 | - | - | - | - | - | - | - | - | - | - | 16384 | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL02 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | - | QUAD | NO LEAD | 260 | - | 0.5mm | 40 | MKL02Z16 | - | S-PQCC-N24 | Not Qualified | - | 1.8/3.3V | - | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | - | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | - | - | - | - | - | - | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
MC9S08GT8AMFBE NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | Surface Mount | 44-QFP | YES | - | - | - | - | - | - | A/D 8x10b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 36 | - | - | - | - | - | - | - | - | - | - | 8192 | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 44 | EAR99 | MATTE TIN | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08GT8 | - | S-PQFP-G44 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.45mm | 10mm | 10mm | ROHS3 Compliant | ||
S9S12GN48F0VLF NXP USA Inc. | 250 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | - | - | - | - | - | - | A/D 12x10b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | 49152 | - | - | - | - | Automotive grade | - | - | -40°C~105°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | - | QUAD | GULL WING | - | - | 0.5mm | - | S9S12GN48 | - | S-PQFP-G48 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | - | 16 | - | - | - | - | - | - | - | 1.5K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LPC54102J512UK49Z NXP USA Inc. | 1512 | - | Datasheet | 26 Weeks | Surface Mount | 49-UFBGA, WLCSP | YES | - | - | - | - | - | - | A/D 12x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 39 | - | - | - | - | - | - | - | 106496 | - | - | 524288 | - | - | - | - | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC54100 | - | Active | 1 (Unlimited) | 49 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.4mm | NOT SPECIFIED | - | - | S-PBGA-B49 | - | 3.6V | - | 1.62V | Internal | 100MHz | 104K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit Dual-Core | 512KB 512K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.58mm | 3.29mm | 3.29mm | ROHS3 Compliant | ||
 MCHC11F1CFNE3R NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | - | - | - | - | - | - | A/D 8x8b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 30 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | - | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | - | S-PQCC-J68 | - | 5.25V | - | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | - | POR, WDT | 12MHz | ROMless | 8-Bit | - | SCI, SPI | - | 8 | YES | NO | NO | NO | 16 | - | - | 512 x 8 | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | 24.23mm | 24.23mm | ROHS3 Compliant | ||
 MC9S08PT16AVLC NXP USA Inc. | 15000 | - | Datasheet | 20 Weeks | Surface Mount | 32-LQFP | - | - | - | - | - | - | - | A/D 12x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 28 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | S08 | e3 | Active | 3 (168 Hours) | - | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK26FN2M0VMD18 NXP USA Inc. | 8518 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | - | - | - | - | - | - | A/D 5x12b, 3x16b; D/A 2x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 | - | - | - | - | - | - | - | 262144 | - | - | 2097152 | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | NOT SPECIFIED | - | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 S9S08SG8E2VTJR NXP USA Inc. | 250 | - | Datasheet | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | - | - | - | - | - | - | A/D 12x10b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 16 | - | - | - | - | - | - | - | - | - | - | 8192 | - | - | - | - | Automotive grade | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2011 | S08 | e3 | Active | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | - | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | S9S08SG8 | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 6.5mm | 5mm | ROHS3 Compliant | ||
MC908GZ16MFAE NXP USA Inc. | 1050 | - | Datasheet | - | Surface Mount | 48-LQFP | YES | - | - | - | - | - | - | A/D 8x10b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 37 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2006 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY AT 4MHZ | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC908GZ16 | - | S-PQFP-G48 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 1K x 8 | 3V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MK64FN1M0CAJ12R NXP USA Inc. | 2397 | - | - | 16 Weeks | Surface Mount | 142-UFBGA, WLCSP | YES | - | - | - | - | - | - | A/D 41x16b; D/A 2x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2014 | Kinetis K60 | - | Active | 1 (Unlimited) | 142 | 3A991.A.2 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 3.3V | 0.4mm | 40 | - | - | R-PBGA-B142 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.58mm | 4.84mm | ROHS3 Compliant | ||
 SPC5634MF2MLQ60 NXP USA Inc. | 41 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | - | - | - | - | - | - | A/D 32x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80 | - | - | - | - | - | - | - | - | - | - | 1572864 | - | - | - | - | Automotive grade | - | - | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 40 | SPC5634 | - | S-PQFP-G144 | Not Qualified | 1.32V | 1.23.35V | 1.14V | Internal | 60MHz | 94K x 8 | 4.5V~5.25V | MICROCONTROLLER, RISC | e200z3 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | 195mA | 32 | YES | YES | YES | - | 32 | - | - | - | - | - | - | - | AEC-Q100 | 64 | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MCF54452CVR200 NXP USA Inc. | 18 | - | Datasheet | 10 Weeks | Surface Mount | 360-BBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 132 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2006 | MCF5445x | e2 | Active | 3 (168 Hours) | 360 | 5A992 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF54452 | - | S-PBGA-B360 | Not Qualified | 1.65V | 1.51.82.53.3V | 1.35V | Internal | 200MHz | 32K x 8 | 1.35V~3.6V | MICROPROCESSOR, RISC | Coldfire V4 | DMA, WDT | 66MHz | ROMless | 32-Bit | - | I2C, SPI, SSI, UART/USART, USB OTG | - | 32 | - | - | - | - | 32 | - | - | - | - | - | YES | YES | - | 32 | FIXED POINT | YES | - | - | - | - | - | - | - | - | 2.48mm | 23mm | 23mm | ROHS3 Compliant | ||
 MKL17Z256VFM4R NXP Semiconductors | 20000 | - | - | - | - | - | - | - | 16 | 1 | NXP Semiconductors | 12 | 32 | - | 3A991.a.2 | 5000 | KL1x | 2 | 1 | RISC | I2C/I2S/SPI/UART | NXP | 48 | 48 | 4GB | 3.6 | 105 | 1.71 | -40 | Surface Mount | 5 | Single | Single | 28 | 0.6(Max) | 5 | 5 | No | 935315582528 | 32 | Yes | - | Yes | Details | - | QFN | HUQFN EP | 1.8|3.3|2.5 | 3 | - | 0 | 1 | - | Tape and Reel | - | - | - | - | - | - | - | - | - | - | Microcontrollers - MCU | - | - | - | - | - | - | - | 32 | - | - | - | - | - | - | - | 32KB | - | - | - | - | - | Flash | - | 256KB | - | - | - | - | - | - | 1 | - | ARM Microcontrollers - MCU | ARM | - | - | - | - | - | - | - | - | - | 0 | 0 | 4 | 0 | 3 | ARM Microcontrollers - MCU | 16 | ARM Cortex M0+ | - | - | - | RoHS Compliant | ||
S912XEQ512BCAG NXP USA Inc. | 154 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | - | - | - | - | - | - | A/D 24x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 119 | - | - | - | - | - | - | - | - | - | - | 524288 | - | - | - | - | Automotive grade | - | - | -40°C~85°C TA | Tray | 1996 | HCS12X | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | - | QUAD | GULL WING | - | 1.8V | 0.5mm | - | S912XEQ512 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | 23 | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | 16 | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 S912ZVC19F0MKH NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | - | - | - | - | - | - | A/D 16x10b; D/A 1x8b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 42 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2011 | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 12K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
S9S12G48F1CLCR NXP USA Inc. | 3637 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | YES | - | - | - | - | - | - | A/D 12x10b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 26 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | - | Active | 3 (168 Hours) | 32 | - | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | - | - | - | - | 5.5V | - | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | - | - | 1.5K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MK20DN32VLH5 NXP USA Inc. | 11 |
| Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | - | - | - | - | - | A/D 13x16b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN32 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MK22DX256VLH5 NXP USA Inc. | 85 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | - | - | - | - | - | A/D 18x16b; D/A 1x12b | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | 262144 | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK22DX256 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant |