- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | ROM Programmability | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S12C64CPBE NXP USA Inc. | 10000 | - | Datasheet | 10 Weeks | Surface Mount | 52-LQFP | YES | - | A/D 8x10b | 35 | - | 65536 | - | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | - | Active | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12C64 | - | S-PQFP-G52 | Not Qualified | 2.75V | 2.53.3/5V | - | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | - | - | CPU12 | - | - | - | 16 | - | - | - | - | 1.7mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08QB4CTG NXP USA Inc. | 60 | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 8x12b | 12 | - | 4096 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QB4 | - | R-PDSO-G16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | External | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
 SPC5674FAMVR3R NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | Surface Mount | 416-BBGA | YES | - | A/D 64x12b | 32 | - | 4194304 | - | -40°C~125°C TA | Tape & Reel (TR) | 2008 | MPC56xx Qorivva | - | - | Active | 3 (168 Hours) | 416 | 3A001.A.2 | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | SPC5674 | - | S-PBGA-B416 | - | - | - | 1.14V | External | 264MHz | 256K x 8 | 1.08V~5.25V | MICROCONTROLLER, RISC | e200z7 | DMA, POR, PWM | 40MHz | FLASH | 32-Bit | 4MB 4M x 8 | CANbus, SCI, SPI | - | 32 | YES | YES | YES | NO | - | - | 8 | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
 SPC5743RK1MLQ5 NXP USA Inc. | 9 | - | Datasheet | 16 Weeks | Surface Mount | 144-LQFP | YES | - | A/D 12b SAR, 16b Sigma-Delta | - | - | - | - | -40°C~125°C TA | Bulk | 2012 | Automotive, AEC-Q100 MPC57xx | - | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.25V | 0.5mm | NOT SPECIFIED | - | - | - | - | 1.32V | - | 1.2V | Internal | 200MHz | 128K x 8 | 3.5V~5.5V | - | e200z4 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART | - | 32 | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 LPC2138FBD64/01,11 NXP USA Inc. | 1500 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x10b; D/A 1x10b | 47 | - | 524288 | - | -40°C~85°C TA | Tape & Reel (TR) | 2003 | LPC2100 | - | - | Not For New Designs | 1 (Unlimited) | 64 | EAR99 | - | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC2138 | 64 | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | - | 32 | YES | NO | YES | YES | 8 | - | - | - | - | - | - | 8 | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC56F8027VLH NXP USA Inc. | 460 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x12b; D/A 2x12b | 53 | - | 32768 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F8027 | - | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 32MHz | 2K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | POR, PWM, WDT | 8MHz | FLASH | 16-Bit | 32KB 16K x 16 | I2C, LINbus, SCI, SPI | - | 16 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
MK22FX512AVLH12 NXP USA Inc. | 38 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 22x16b; D/A 1x12b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S9S08SG16E1MTJ NXP USA Inc. | 320 | - | Datasheet | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 12x10b | 16 | - | - | - | -40°C~125°C TA | Tube | 1999 | S08 | - | - | Active | 3 (168 Hours) | 20 | 3A991.A.2 | - | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | NOT SPECIFIED | S9S08SG16 | - | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 6.5mm | 4.4mm | ROHS3 Compliant | ||
 MK20FN1M0VMD12 NXP USA Inc. | 1 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | - | A/D 58x16b; D/A 2x12b | 100 | - | 1048576 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK20FN1M0 | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.32.5/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
MK20DX32VLH5 NXP USA Inc. | 10086 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 13x16b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX32 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC56F8157VPYE NXP USA Inc. | 33 | - | - | 10 Weeks | Surface Mount | 160-LQFP | YES | - | A/D 16x12b | 76 | - | 262144 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8157 | - | S-PQFP-G160 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 40MHz | 8K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 256KB 128K x 16 | EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 24 | - | - | - | YES | YES | - | 16 | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 24mm | 24mm | ROHS3 Compliant | ||
 MC9S08DN32AMLC NXP USA Inc. | 21 | - | Datasheet | 8 Weeks | Surface Mount | 32-LQFP | - | 32-LQFP (7x7) | A/D 10x12b | 25 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9S08DN32 | - | - | - | - | - | - | External | 40MHz | 1.5K x 8 | 2.7V~5.5V | - | S08 | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5642AF2MLU1 NXP USA Inc. | 52 | - | Datasheet | 12 Weeks | Surface Mount | 176-LQFP | YES | - | A/D 40x12b | 84 | 131072 | 2097152 | Automotive grade | -40°C~125°C TA | Tray | 2004 | MPC56xx Qorivva | e3 | - | Active | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 40 | - | - | S-PQFP-G176 | Not Qualified | 1.32V | 1.2V | 1.14V | Internal | 150MHz | 128K x 8 | 1.14V~5.25V | MICROCONTROLLER, RISC | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 400mA | 32 | YES | YES | YES | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | - | 24mm | 24mm | ROHS3 Compliant | ||
 S9S12ZVL32F0CLF NXP USA Inc. | 10000 | - | - | 12 Weeks | Surface Mount | 48-LQFP | - | - | A/D 10x10b | 34 | - | - | - | -40°C~85°C TA | Tray | 2013 | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 1K x 8 | 5.5V~18V | - | S12Z | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | - | - | - | - | - | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LPC3250FET296/01,5 NXP USA Inc. | 20 |
| Datasheet | 12 Weeks | Surface Mount | 296-TFBGA | YES | - | A/D 3x10b | 51 | - | 0 | - | -40°C~85°C TA | Tray | 2008 | LPC3200 | e1 | - | Not For New Designs | 3 (168 Hours) | 296 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.35V | 0.8mm | NOT SPECIFIED | LPC32*0 | 296 | S-PBGA-B296 | Not Qualified | 1.39V | 1.23.3V | 1.31V | Internal | 266MHz | 256K x 8 | 0.9V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, Motor Control PWM, PWM, WDT | 20MHz | ROMless | 16/32-Bit | - | EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | - | 32 | YES | YES | YES | NO | 24 | - | - | - | - | - | - | 32 | - | FLASH | - | - | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||
MC9S08DZ48ACLF NXP USA Inc. | 30 | - | Datasheet | 8 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 16x12b | 39 | - | - | - | -40°C~85°C TA | Tray | 2008 | S08 | - | yes | Active | 3 (168 Hours) | 48 | - | - | - | - | QUAD | GULL WING | - | 3V | 0.5mm | - | MC9S08DZ48 | - | S-PQFP-G48 | - | 5.5V | - | 2.7V | External | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 1.5K x 8 | 8 | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MKL25Z32VFT4 NXP USA Inc. | 100 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | - | A/D 13x16b; D/A 1x12b | 36 | - | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL25Z32 | - | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | - | 7mm | 7mm | Non-RoHS Compliant | ||
S9S12GN32F0CLFR NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 8x10b | 40 | - | 32768 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12GN32 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | - | - | 1K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
MC56F8167VPYE NXP USA Inc. | 6600 | - | - | 10 Weeks | Surface Mount | 160-LQFP | YES | - | A/D 16x12b | 76 | - | 524288 | - | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8167 | - | S-PQFP-G160 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 40MHz | 16K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | EBI/EMI, SCI, SPI | - | 16 | - | - | - | - | 24 | - | - | - | YES | YES | - | 16 | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 24mm | 24mm | ROHS3 Compliant | ||
LPC11U67JBD64E NXP USA Inc. | 30 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | - | - | A/D 10x12b | 48 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | - | - | Active | 2 (1 Year) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 20K x 8 | 2.4V~3.6V | - | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |