- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC68HC16Z1CEH16 NXP USA Inc. | 260 | - | Datasheet | 11 Weeks | Surface Mount | 132-BQFP Bumpered | YES | A/D 8x10b | 16 | - | - | - | -40°C~85°C TA | Tray | 1999 | HC16 | e3 | - | Not For New Designs | 3 (168 Hours) | 132 | EAR99 | Matte Tin (Sn) | IT ASLO OPERATES AT 3V | 8542.31.00.01 | QUAD | GULL WING | 245 | 5V | 0.635mm | - | 30 | MC68HC16 | - | S-PQFP-G132 | Not Qualified | 5.5V | - | 4.5V | Internal | 16MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | CPU16 | POR, PWM, WDT | - | ROMless | 16-Bit | - | EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 20 | - | - | - | 16 | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | ||
 S9S08RN16W2MLC NXP USA Inc. | 37 | - | Datasheet | 16 Weeks | Surface Mount | 32-LQFP | - | A/D 12x12b | 26 | - | - | - | -40°C~125°C TA | Tray | 2012 | S08 | e3 | - | Active | 3 (168 Hours) | - | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROPROCESSOR | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | - | 256 x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
S9S08DZ60F2CLC NXP USA Inc. | 118 | - | Datasheet | 12 Weeks | Surface Mount | 32-LQFP | - | A/D 10x12b | 25 | - | - | - | -40°C~85°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | - | 40 | S9S08DZ60 | - | - | - | - | - | - | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
 FS32R274KCK2MMM NXP USA Inc. | 2 | - | Datasheet | 12 Weeks | Surface Mount | 257-LFBGA | - | A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b | - | - | - | - | -40°C~125°C TA | Tray | - | S32R | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 180MHz, 240MHz | 1.5M x 8 | 1.19V~5.5V | - | e200z4, e200z7 (2) | POR, PWM, WDT | - | FLASH | 32-Bit Tri-Core | 2MB 2M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire | - | - | - | - | - | - | - | 64K x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
 S912XET256W1MAG NXP USA Inc. | 5 | - | - | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 16384 | 262144 | Automotive grade | -40°C~125°C TA | Tray | 1996 | HCS12X | - | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.5mm | - | - | - | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | - | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S12DJ128CFUE NXP USA Inc. | 11058 | - | Datasheet | 15 Weeks | Surface Mount | 80-QFP | YES | A/D 16x10b | 59 | - | - | - | -40°C~85°C TA | Tray | 2001 | HCS12 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | - | 40 | MC9S12DJ128 | - | S-PQFP-G80 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 2K x 8 | - | - | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MCF51AC128CCLKE NXP USA Inc. | 700 | - | Datasheet | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 24x12b | 69 | - | 131072 | - | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | - | 40 | MCF51AC128 | - | S-PQFP-G80 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SCI, SPI | - | 32 | YES | NO | YES | NO | - | - | - | - | - | 1.74mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC68HC908QT4CPE NXP USA Inc. | 78 | - | Datasheet | - | Through Hole | 8-DIP (0.300, 7.62mm) | NO | A/D 4x8b | 5 | - | - | - | -40°C~85°C TA | Tube | 1999 | HC08 | e3 | - | Last Time Buy | Not Applicable | 8 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 2.7V MINIMUM SUPPLY @ 4MHZ | - | DUAL | - | NOT SPECIFIED | 5V | - | - | NOT SPECIFIED | MC68HC908 | - | E3 | Not Qualified | - | - | - | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 9.78mm | 7.62mm | ROHS3 Compliant | ||
 LPC54606J256BD100E NXP USA Inc. | 10 |
| Datasheet | 12 Weeks | Surface Mount | 100-LQFP | - | A/D 12x12b | 64 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC546xx | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 180MHz | 136K x 8 | 1.71V~3.6V | - | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | - | - | - | - | - | - | - | 16K x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL15Z64VFT4 NXP USA Inc. | 25 | - | - | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 15x16b; D/A 1x12b | 40 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | 16-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | - | 40 | MKL15Z64 | - | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 7.8mA | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | 1mm | 7mm | 7mm | Non-RoHS Compliant | ||
 MPC5554AZP132 NXP USA Inc. | 10000 | - | Datasheet | 13 Weeks | Surface Mount | 416-BBGA | YES | A/D 40x12b | 256 | - | 2097152 | - | -55°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | e0 | - | Not For New Designs | 3 (168 Hours) | 416 | 3A991.A.2 | Tin/Lead (Sn/Pb) | IT ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC5554 | - | S-PBGA-B416 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, SCI, SPI | - | 32 | YES | NO | YES | NO | 24 | - | - | - | 32 | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||
S912XEQ512BVAG NXP USA Inc. | 21 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | - | 524288 | Automotive grade | -40°C~105°C TA | Tray | 1996 | HCS12X | - | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.5mm | - | - | S912XEQ512 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | - | 20mm | 20mm | ROHS3 Compliant | ||
 LPC824M201JDH20J NXP USA Inc. | 11500 | - | Datasheet | 56 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | - | A/D 5x12b | 16 | - | - | - | -40°C~105°C TA | Cut Tape (CT) | 2010 | LPC82x | - | - | Active | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | - | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK20DN128VMP5 NXP USA Inc. | 19 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D 13x16b | 40 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | - | 40 | MK20DN128 | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | 1.2mm | 5mm | 5mm | ROHS3 Compliant | ||
 MC9S08QE8CPG NXP USA Inc. | 1417 | - | Datasheet | 10 Weeks | Through Hole | 16-DIP (0.300, 7.62mm) | NO | A/D 8x12b | 12 | - | 8192 | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | - | Active | Not Applicable | 16 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | DUAL | - | NOT SPECIFIED | 3V | 2.54mm | - | NOT SPECIFIED | MC9S08QE8 | - | R-PDIP-T16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 4.44mm | 19.175mm | 7.62mm | ROHS3 Compliant | ||
 MC9S08SH16MTJR NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 17 | 1024 | 16384 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2007 | S08 | e3 | - | Active | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | - | 40 | - | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | AEC-Q100 | - | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
MKL27Z128VFT4 NXP USA Inc. | 1300 | - | Datasheet | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 16x16b; D/A 1x12b | 36 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | DIFFERENTIAL ANALOG CHANNEL INPUTS: 1-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | - | 40 | - | - | S-XQCC-N48 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
LPC11D14FBD100/302 NXP USA Inc. | 2673 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 8x10b | 42 | - | 32768 | - | -40°C~85°C TA | Tray | 2010 | LPC11Dxx | - | - | Active | 3 (168 Hours) | 100 | EAR99 | - | - | - | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | - | NOT SPECIFIED | LPC11D | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, LCD, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | - | 32 | YES | NO | NO | NO | - | - | CORTEX-M0 | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
 FS32K144UFT0VLLT NXP USA Inc. | 2000 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | - | -40°C~105°C TA | Tray | 2011 | S32K | - | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 5V | 0.5mm | compliant | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 112MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | 14mm | 14mm | RoHS Compliant | ||
 MC9S08EL16CTL NXP USA Inc. | 7742 | - | Datasheet | 10 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | YES | A/D 16x10b | 22 | - | 16384 | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | - | Active | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | - | 40 | MC9S08EL16 | - | R-PDSO-G28 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 512 x 8 | - | - | - | 1.2mm | 9.7mm | 4.4mm | ROHS3 Compliant |