- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 SPC5606BF1VLU6R NXP USA Inc. | 1000 | - | Datasheet | 12 Weeks | Surface Mount | 176-LQFP | YES | A/D 29x10b, 5x12b | 149 | - | 1048576 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | e3 | Active | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | SPC5606 | - | S-PQFP-G176 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 80K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | - | 32 | 64K x 8 | - | - | - | AEC-Q100 | 64 | - | - | - | - | 24mm | 24mm | ROHS3 Compliant | ||
 S9S12XS128J1CAER NXP USA Inc. | 10000 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 44 | - | 131072 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12X | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S9S12XS128 | - | S-PQFP-G64 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | - | 16 | YES | NO | YES | YES | - | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MKL26Z128CAL4R NXP USA Inc. | 19 | - | Datasheet | 16 Weeks | Surface Mount | 36-UFBGA, WLCSP | YES | A/D 12bit SAR; D/A 12bit | 27 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2002 | Kinetis KL2 | e1 | Active | 1 (Unlimited) | 36 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.35mm | 40 | - | - | R-PBGA-B36 | - | 3.6V | - | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | 2.459mm | 2.374mm | ROHS3 Compliant | ||
 LPC4330FET256,551 NXP USA Inc. | 3600 | - | Datasheet | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | - | 0 | - | -40°C~85°C TA | Tray | 2010 | LPC43xx | e1 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | NOT SPECIFIED | LPC4330 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | - | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | 24 | - | CORTEX-M4 | - | - | - | 32 | - | - | FLASH | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||
 MKL15Z64VLK4 NXP USA Inc. | 97 | - | - | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x16b; D/A 1x12b | 70 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 16-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL15Z64 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, TSI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||
 MCF5206EAB40 NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Surface Mount | 160-BQFP | YES | - | 8 | - | - | - | 0°C~70°C TA | Tray | 1996 | MCF520x | e3 | Not For New Designs | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 245 | 3.3V | 0.65mm | 30 | MCF5206 | - | S-PQFP-G160 | - | 3.6V | - | 3V | External | 40MHz | 8K x 8 | 3V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 40MHz | ROMless | 32-Bit | - | EBI/EMI, I2C, UART/USART | - | 32 | - | - | - | - | 28 | - | - | YES | YES | - | 32 | FIXED POINT | YES | - | - | - | - | ROHS3 Compliant | ||
 MK20DX128ZVLQ10 NXP USA Inc. | 450 | - | Datasheet | 15 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | - | S-PQFP-G144 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK51DX128CMC7 NXP USA Inc. | 331 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 35x16b; D/A 1x12b | 61 | - | 131072 | - | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK51DX128 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
MK22FN1M0VLK12 NXP USA Inc. | 1537 | - | Datasheet | 6 Weeks | Surface Mount | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | 56 | - | 1048576 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MK22FN1M0 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 MKL36Z256VLL4R NXP USA Inc. | 932 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D - 16bit; D/A - 12bit | 84 | 32768 | 262144 | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL3 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 LPC812M101JDH20J NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | - | 18 | - | 16384 | - | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC81xM | - | Active | 1 (Unlimited) | 20 | - | - | - | - | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | NOT SPECIFIED | LPC812M101 | 20 | R-PDSO-G20 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | - | 32 | NO | NO | YES | NO | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
 LPC1114LVFHI33/303 NXP USA Inc. | 10006 | - | Datasheet | 16 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 8x8b | 27 | - | - | - | -40°C~85°C TA | Tray | 2010 | LPC1100LV | - | Active | 3 (168 Hours) | 32 | EAR99 | - | - | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 1.8V | 0.5mm | NOT SPECIFIED | LPC1114 | 32 | S-PQCC-N32 | Not Qualified | 1.95V | 1.8V | 1.65V | Internal | 50MHz | 8K x 8 | 1.65V~1.95V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | NO | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MC908AP16CFBE NXP USA Inc. | 10 | - | Datasheet | - | Surface Mount | 44-QFP | YES | A/D 8x10b | 32 | - | - | - | -40°C~85°C TA | Tray | 2004 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908AP16 | - | - | - | 5.5V | - | 4.5V | Internal | 8MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LED, LVD, POR, PWM | 8MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, IRSCI, SCI, SPI | - | 8 | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12DJ256CPVE NXP USA Inc. | 10549 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | 262144 | - | -40°C~85°C TA | Tray | 1998 | HCS12 | e3 | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DJ256 | - | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 19 | 4K x 8 | CPU12 | - | - | - | 16 | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK20DN128VLF5 NXP USA Inc. | 134 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 11x16b | 29 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN128 | - | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M4 | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08AW48CFDE NXP USA Inc. | 17 | - | Datasheet | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 38 | - | 49152 | - | -40°C~85°C TA | Tray | 2000 | S08 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08AW48 | - | S-XQCC-N48 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 48KB 48K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
S9S12G96F0MLF NXP USA Inc. | 3237 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 12x10b | 40 | - | 98304 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | S9S12G96 | - | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | NO | - | 3K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC908JB8FBE NXP USA Inc. | 79 | - | Datasheet | 10 Weeks | Surface Mount | 44-QFP | YES | - | 37 | - | - | - | 0°C~70°C TA | Tray | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | EAR99 | MATTE TIN | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908JB8 | - | S-PQFP-G44 | Not Qualified | 5.5V | - | 4V | Internal | 3MHz | 256 x 8 | 4V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 6MHz | FLASH | 8-Bit | 8KB 8K x 8 | USB | - | 8 | NO | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | 2.45mm | 10mm | 10mm | ROHS3 Compliant | ||
 SPC5123YVY400B NXP USA Inc. | 2271 | - | Datasheet | 12 Weeks | Surface Mount | 516-BBGA Exposed Pad | YES | - | 147 | - | - | Automotive grade | -40°C~85°C TA | Tray | 2002 | MPC5123 | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 1mm | 40 | - | - | S-PBGA-B516 | Not Qualified | 1.47V | 1.43.3V | 1.33V | External | 400MHz | 128K x 8 | 1.08V~3.6V | MICROPROCESSOR, RISC | e300 | DMA, WDT | 35MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | - | 32 | - | - | - | - | 32 | - | - | YES | YES | AEC-Q100 | 32 | FIXED POINT | YES | - | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
S9S08DZ60F1MLH NXP USA Inc. | In Stock | - | - | - | Surface Mount | 64-LQFP | - | A/D 24x12b | 53 | - | - | - | -40°C~125°C TA | Tray | 2006 | S08 | - | Obsolete | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | S9S08DZ60 | - | - | - | - | - | - | External | 40MHz | 4K x 8 | 2.7V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |