- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MK12DX128VLH5 NXP USA Inc. | 1600 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 22x16b; D/A 1x12b | 44 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK12DX128 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 4K x 8 | CORTEX-M4 | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9RS08KB4CTG NXP USA Inc. | 3155 | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 8x10b | 14 | - | 4096 | - | -40°C~85°C TA | Tube | 2009 | RS08 | e3 | Active | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.635mm | 40 | MC9RS08KB4 | R-PDSO-G16 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 126 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | 5mm | 4.4mm | ROHS3 Compliant | ||
 S912XEQ384J3VAGR NXP USA Inc. | 12 | - | Datasheet | 16 Weeks | Surface Mount | 144-LQFP | YES | - | A/D 24x12b | 119 | 24576 | 393216 | - | -40°C~105°C TA | Tape & Reel (TR) | 2013 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 16 | YES | YES | YES | - | 23 | 4K x 8 | CPU12 | - | 16 | - | 20mm | 20mm | ROHS3 Compliant | ||
 FS32K148UJT0VMHT NXP USA Inc. | 8800 | - | Datasheet | 16 Weeks | Surface Mount | 100-LBGA | YES | - | A/D 32x12b; D/A 1x8b | 89 | - | - | - | -40°C~105°C TA | Tray | - | S32K | - | Active | 3 (168 Hours) | 100 | - | - | - | - | BOTTOM | BALL | 260 | 5V | 1mm | 40 | - | - | - | 5.5V | - | 2.7V | Internal | 112MHz | 256K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M4F | I2S, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | 11mm | 11mm | ROHS3 Compliant | ||
 MC908AP64CFAER NXP USA Inc. | 10086 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 8x10b | 32 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | MC908AP64 | - | - | 5.5V | - | 4.5V | Internal | 8MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LED, LVD, POR, PWM | 8MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, IRSCI, SCI, SPI | - | 8 | YES | YES | YES | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S12DT128MPVE NXP USA Inc. | 2000 | - | Datasheet | 15 Weeks | Surface Mount | 112-LQFP | YES | - | A/D 16x10b | 91 | - | - | - | -40°C~125°C TA | Tray | 1996 | HCS12 | e3 | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12DT128 | S-PQFP-G112 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 20 | 2K x 8 | - | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
MKL27Z64VLH4 NXP USA Inc. | 1 | - | Datasheet | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 17x16b | 51 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | TIN | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART, USB | - | 32 | YES | YES | YES | NO | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08QB4CGK NXP USA Inc. | 21 | - | Datasheet | 10 Weeks | Surface Mount | 24-VQFN Exposed Pad | YES | - | A/D 8x12b | 18 | - | 4096 | - | -40°C~85°C TA | Tray | 2006 | S08 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | BOTTOM | NO LEAD | 260 | 3V | 0.65mm | 40 | MC9S08QB4 | S-XBCC-N24 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | External | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 1.05mm | 5mm | 5mm | ROHS3 Compliant | ||
 S9S08AW32E5VFGE NXP USA Inc. | 9 |
| Datasheet | 12 Weeks | Surface Mount | 44-LQFP | YES | - | A/D 8x10b | 34 | - | 32768 | Automotive grade | -40°C~105°C TA | Tray | 2014 | S08 | - | Active | 3 (168 Hours) | 44 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.8mm | - | S9S08AW32 | S-PQFP-G44 | Not Qualified | - | 3/5V | - | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | ROHS3 Compliant | ||
S9S12GN32F0CLF NXP USA Inc. | 20 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 8x10b | 40 | - | 32768 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12GN32 | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | - | - | 1K x 8 | CPU12 | AEC-Q100 | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MKV10Z32VLC7 NXP USA Inc. | 10 | - | Datasheet | 13 Weeks | Surface Mount | 32-LQFP | YES | - | A/D 16x12b; D/A 1x12b | 28 | 8192 | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.8mm | 40 | - | S-PQFP-G32 | Not Qualified | - | 1.8/3.3V | - | Internal | 75MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | - | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | - | 32 | - | - | - | - | - | - | CORTEX-M0 | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5607BF1MLU6 NXP USA Inc. | 1000 | - | - | 12 Weeks | Surface Mount | 176-LQFP | YES | - | A/D 29x10b, 5x12b | 149 | - | 1572864 | Automotive grade | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | e3 | Active | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | SPC5607 | S-PQFP-G176 | Not Qualified | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 96K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 32 | YES | YES | YES | - | 32 | 64K x 8 | - | AEC-Q100 | 64 | - | 24mm | 24mm | ROHS3 Compliant | ||
MC912DG128CCPVE NXP USA Inc. | 42 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | - | A/D 16x8/10b | 69 | - | - | - | -40°C~85°C | Tray | 2003 | HC12 | e3 | Not For New Designs | 3 (168 Hours) | 112 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MC912DG128 | S-PQFP-G112 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 8K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | 2K x 8 | - | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK20DN512ZVLK10 NXP USA Inc. | 18 | - | Datasheet | - | Surface Mount | 80-LQFP | YES | - | A/D 27x16b; D/A 1x12b | 52 | - | - | - | -40°C~105°C TA | Tray | 2013 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DN512 | S-PQFP-G80 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||
 MC9S08AC128CLKE NXP USA Inc. | 26550 | - | Datasheet | 10 Weeks | Surface Mount | 80-LQFP | YES | - | A/D 16x10b | 69 | - | 131072 | - | -40°C~85°C TA | Tray | 2000 | S08 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MC9S08AC128 | S-PQFP-G80 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
LPC845M301JBD48E NXP USA Inc. | 10000 | - | Datasheet | 16 Weeks | Surface Mount | 48-LQFP | - | - | A/D 12x12b; D/A 2x10b | 42 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC84x | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal/External | 30MHz | 16K x 8 | 1.8V~3.6V | - | ARM® Cortex®-M0+ | Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
S912ZVLA12F0MLF NXP USA Inc. | 1285 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | 48-LQFP (7x7) | A/D 10x10b; D/A 1x8b | 34 | - | - | - | -40°C~125°C TA | Tray | 2013 | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 1K x 8 | 5.5V~18V | - | S12Z | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
MKM33Z128CLH5 NXP USA Inc. | 630 | - | Datasheet | - | Surface Mount | 64-LQFP | YES | - | A/D 6x16b, 4x24b | 38 | - | - | - | -40°C~85°C TA | Tray | 2002 | Kinetis KM | e3 | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | VOLTAGE RANGE: 2.7 V TO 3.6 V (WHEN ANALOG FRONT END (AFE) IS USED) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKM33Z128 | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LCD, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | NO | NO | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
S912ZVCA96F0MLF NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | - | A/D 10x12b; D/A 1x8b | 28 | - | - | - | -40°C~125°C TA | Tray | 2013 | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 8K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | 2K x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9RS08KA2CSC NXP USA Inc. | 10 | - | Datasheet | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | - | 4 | - | - | - | -40°C~85°C TA | Tube | 2007 | RS08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9RS08KA2 | R-PDSO-G8 | Not Qualified | 5.5V | 1.8/5.5V | 1.8V | Internal | 10MHz | 63 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, WDT | - | FLASH | 8-Bit | 2KB 2K x 8 | - | - | 8 | NO | NO | NO | NO | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant |