- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | RoHS Status |
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 MKL27Z32VLH4 NXP USA Inc. | 32 |
| - | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 17x16b | 51 | - | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis KL2 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, FlexIO, SPI, UART/USART, USB | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 FS32K148UJT0VLUT NXP USA Inc. | 400 | - | Datasheet | 16 Weeks | Surface Mount | 176-LQFP | - | - | A/D 32x12b; D/A 1x8b | - | - | - | - | -40°C~105°C TA | Tray | - | S32K | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | Internal | 112MHz | 256K x 8 | 2.7V~5.5V | - | ARM® Cortex®-M4F | I2S, POR, PWM, WDT | - | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08AC96CFUE NXP USA Inc. | 1680 | - | Datasheet | 10 Weeks | Surface Mount | 64-QFP | YES | - | A/D 16x10b | 54 | - | 98304 | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08AC96 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 96KB 96K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S08SH32CTLR NXP USA Inc. | 1259 | - | Datasheet | 10 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 16x10b | 23 | - | 32768 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2007 | S08 | e3 | - | Active | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08SH32 | R-PDSO-G28 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | 1.2mm | 9.7mm | 4.4mm | ROHS3 Compliant | ||
MC56F8323MFBE NXP USA Inc. | 265 | - | Datasheet | - | Surface Mount | 64-LQFP | YES | - | A/D 8x12b | 27 | - | - | - | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | - | Not For New Designs | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8323 | S-PQFP-G64 | Not Qualified | 2.75V | - | 2.25V | Internal | 60MHz | 12K x 8 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 32KB 16K x 16 | CANbus, SCI, SPI | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | YES | MULTIPLE | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08QG8CPBE NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Through Hole | 16-DIP (0.300, 7.62mm) | NO | - | A/D 8x10b | 12 | - | 8192 | - | -40°C~85°C TA | Tube | 2005 | S08 | e3 | - | Last Time Buy | Not Applicable | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | - | NOT SPECIFIED | 3V | 2.54mm | NOT SPECIFIED | MC9S08QG8 | R-PDIP-T16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 4.44mm | 19.175mm | 7.62mm | ROHS3 Compliant | ||
 LPC54628J512ET180E NXP USA Inc. | 2000 | - | Datasheet | 12 Weeks | Surface Mount | 180-TFBGA | YES | - | A/D 12x12b | 145 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC546xx | e8 | - | Active | 3 (168 Hours) | 180 | - | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | - | - | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 30 | - | S-PBGA-B180 | - | 3.6V | - | 1.71V | Internal | 220MHz | 200K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | YES | NO | 21 | 16K x 8 | 8 | - | - | - | - | 16 | - | - | - | - | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||
 MC68331CEH25 NXP USA Inc. | 1000 | - | Datasheet | 10 Weeks | Surface Mount | 132-BQFP Bumpered | - | 132-PQFP (24.13x24.13) | - | 18 | - | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | - | - | Not For New Designs | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC68331 | - | - | - | - | - | Internal | 25MHz | - | 4.5V~5.5V | - | CPU32 | POR, PWM, WDT | - | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK53DN512CMD10 NXP USA Inc. | 800 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | - | A/D 41x16b; D/A 2x12b | 94 | - | 524288 | - | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e1 | - | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER OVER NICKEL | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK53DN512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | - | 13mm | 13mm | ROHS3 Compliant | ||
 S9S08DZ48F2MLF NXP USA Inc. | 4900 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | - | A/D 16x12b | 39 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | S9S08DZ48 | - | - | - | - | - | External | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | 1.5K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08AW60MFGE NXP USA Inc. | 3693 | - | Datasheet | 10 Weeks | Surface Mount | 44-LQFP | YES | - | A/D 8x10b | 34 | - | 63280 | - | -40°C~125°C TA | Tray | 2005 | S08 | e3 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08AW60 | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 S9S12VR48AF0VLC NXP USA Inc. | 1250 | - | - | 12 Weeks | Surface Mount | 32-LQFP | - | - | A/D 2x10b | 16 | - | - | - | -40°C~105°C TA | Tray | 2011 | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK20DX64VLF5 NXP USA Inc. | 10086 | - | Datasheet | 13 Weeks | Surface Mount | 48-LQFP | YES | - | A/D 11x16b | 29 | - | 65536 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK20DX64 | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MK20DN128VFM5 NXP USA Inc. | 1500 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | - | A/D 6x16b | 20 | - | 131072 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK20DN128 | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
MC56F84543VLH NXP USA Inc. | 19 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 16x12b, 8x16b; D/A 1x12b | 54 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F845 | S-PQFP-G64 | Not Qualified | 3.6V | 3/3.3V | 2.7V | Internal | 80MHz | 8K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | YES | - | 2K x 8 | - | - | - | - | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MCF54450VM240 NXP USA Inc. | 35 | - | Datasheet | 10 Weeks | Surface Mount | 256-LBGA | YES | - | - | 132 | - | - | - | 0°C~70°C TA | Tray | 2006 | MCF5445x | e1 | - | Active | 3 (168 Hours) | 256 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF54450 | S-PBGA-B256 | Not Qualified | 1.65V | 1.51.82.53.3V | 1.35V | Internal | 240MHz | 32K x 8 | 1.35V~3.6V | MICROPROCESSOR, RISC | Coldfire V4 | DMA, WDT | 60MHz | ROMless | 32-Bit | - | I2C, SPI, SSI, UART/USART, USB OTG | 32 | - | - | - | - | 32 | - | - | - | YES | YES | - | 32 | FIXED POINT | YES | - | - | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
MC9S08SH32CTL NXP USA Inc. | 2000 |
| Datasheet | 10 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | YES | - | A/D 16x10b | 23 | - | 32768 | Automotive grade | -40°C~85°C TA | Tube | 2007 | S08 | e3 | - | Active | 3 (168 Hours) | 28 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08SH32 | R-PDSO-G28 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | 1.2mm | 9.7mm | 4.4mm | ROHS3 Compliant | ||
S9S08DZ32F2MLH NXP USA Inc. | 200 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | - | - | A/D 24x12b | 53 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | S9S08DZ32 | - | - | - | - | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 SPC5517SBMLQ66 NXP USA Inc. | 5 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | - | A/D 40x12b | 111 | - | 196608 | Automotive grade | -40°C~125°C TA | Tray | 2006 | MPC55xx Qorivva | - | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | SPC5517 | S-PQFP-G144 | Not Qualified | 5.25V | 5V | 4.5V | Internal | 66MHz | 64K x 8 | 4.5V~5.25V | MICROCONTROLLER, RISC | e200z1 | DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | 32 | YES | YES | YES | - | - | - | - | - | - | - | AEC-Q100 | - | - | - | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
S9S12P32J0MLHR NXP USA Inc. | 37 | - | Datasheet | 16 Weeks | Surface Mount | 64-LQFP | YES | - | A/D 10x12b | 49 | 2048 | 32768 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2006 | HCS12 | - | - | Active | 3 (168 Hours) | 64 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | - | 0.5mm | - | - | S-PQFP-G64 | Not Qualified | - | 1.83.3/5V | - | Internal | 32MHz | 2K x 8 | 1.72V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 16 | - | - | - | - | - | 4K x 8 | - | CPU12 | - | - | AEC-Q100 | - | - | - | - | - | - | - | - | ROHS3 Compliant |