- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 S9S08SG8E2MTJR NXP USA Inc. | 14850 | - | Datasheet | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 16 | 8192 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 1999 | S08 | e3 | Active | 3 (168 Hours) | 20 | EAR99 | MATTE TIN | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | S9S08SG8 | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | - | - | - | - | - | AEC-Q100 | - | - | - | 1.2mm | 6.5mm | 5mm | ROHS3 Compliant | ||
 MC9S08DZ32ACLF NXP USA Inc. | 103 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | - | A/D 16x12b | 39 | - | - | -40°C~85°C TA | Tray | 1996 | S08 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | MC9S08DZ32 | - | - | - | - | - | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK22FN128VLL10 NXP USA Inc. | 891 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | 131072 | - | -40°C~105°C TA | Tray | - | Kinetis K20 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK22FN128 | - | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M4F | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MC9S12DG128CPVE NXP USA Inc. | 10550 | - | Datasheet | 15 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | - | -40°C~85°C TA | Tray | 1998 | HCS12 | - | Active | 3 (168 Hours) | 112 | - | - | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 2.5V | 0.65mm | NOT SPECIFIED | MC9S12DG128 | - | S-PQFP-G112 | Not Qualified | 2.75V | - | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | MICROCONTROLLER | - | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | - | 16 | YES | NO | YES | NO | 20 | 2K x 8 | - | - | - | - | 16 | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MK60DN512ZVLQ10 NXP USA Inc. | 2688 | - | Datasheet | 15 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | K60DN512 | - | S-PQFP-G144 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MKL16Z256VMP4 NXP USA Inc. | 627 | - | Datasheet | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D - 16bit; D/A - 12bit | 54 | 262144 | - | -40°C~105°C TA | Tray | 2013 | Kinetis KL1 | e1 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MKL16Z256 | - | S-PBGA-B64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, TSI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MK10DX64VLH7 NXP USA Inc. | 792 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 26x16b; D/A 1x12b | 44 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX64 | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
MK22FN1M0AVLL12 NXP USA Inc. | 3600 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | - | - | -40°C~105°C TA | Tray | 2005 | Kinetis K20 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G100 | - | 3.6V | - | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
MK64FN1M0VLL12R NXP USA Inc. | 6000 | - | - | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 32x16b; D/A 1x12b | 66 | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2015 | Kinetis K60 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G100 | - | 3.6V | - | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MK82FN256VDC15 NXP USA Inc. | 1740 |
| - | 13 Weeks | Surface Mount | 121-XFBGA | - | A/D 18x16b; D/A 2x6b, 1x12b | 87 | - | - | -40°C~105°C TA | Tray | 2014 | Kinetis K8x | - | Active | 3 (168 Hours) | - | 5A992 | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | Internal | 150MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM | - | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SPI, UART/USART, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MK64FX512VDC12 NXP USA Inc. | 3800 | - | - | 13 Weeks | Surface Mount | 121-XFBGA | YES | A/D 37x16b; D/A 2x12b | 86 | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | - | 40 | - | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 192K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | - | YES | YES | YES | YES | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC68332ACEH25 NXP USA Inc. | 898 | - | Datasheet | - | Surface Mount | 132-BQFP Bumpered | YES | - | 15 | - | - | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | Not For New Designs | 3 (168 Hours) | 132 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 245 | 5V | 0.635mm | 30 | MC68332 | - | S-PQFP-G132 | Not Qualified | - | - | - | Internal | 25MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | - | EBI/EMI, SCI, SPI, UART/USART | - | 32 | NO | NO | YES | NO | 24 | - | - | - | - | - | 16 | - | - | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | ||
S9S12G128F0MLH NXP USA Inc. | 1600 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x10b | 54 | 131072 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12G128 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | - | - | 4K x 8 | CPU12 | - | - | AEC-Q100 | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MK10DN512VMD10 NXP USA Inc. | 800 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | 104 | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK10DN512 | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M4 | - | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
MIMXRT1021CAF4A NXP USA Inc. | 1604 | - | Datasheet | 14 Weeks | Surface Mount | 100-LQFP | - | A/D 10x12b | 57 | - | - | -40°C~105°C TJ | Tray | - | RT1020 | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal/External | 396MHz | 128K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL26Z128VFM4 NXP USA Inc. | 2426 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D - 16bit; D/A - 12bit | 23 | 131072 | - | -40°C~105°C TA | Tray | 2013 | Kinetis KL2 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL26Z128 | - | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MCF5474VR266 NXP USA Inc. | 118 | - | Datasheet | 14 Weeks | Surface Mount | 388-BBGA | YES | - | 99 | - | - | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | Not For New Designs | 3 (168 Hours) | 388 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5474 | - | S-PBGA-B388 | Not Qualified | 1.58V | - | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | - | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | - | 32 | - | - | - | - | 32 | - | - | YES | YES | - | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
MK40DX256VLQ10 NXP USA Inc. | 5 | - | Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 98 | 262144 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK40DX256 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | CORTEX-M4 | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 LPC1833JET100E NXP USA Inc. | 19 | - | Datasheet | 12 Weeks | Surface Mount | 100-TFBGA | YES | A/D 4x10b; D/A 1x10b | 49 | 524288 | - | -40°C~105°C TA | Tray | 2010 | LPC18xx | - | Active | 3 (168 Hours) | 100 | - | - | - | - | BOTTOM | BALL | - | 3.3V | 0.8mm | - | LPC1833 | 100 | S-PBGA-B100 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | 16K x 8 | CORTEX-M3 | - | - | - | - | - | - | - | 9mm | 9mm | ROHS3 Compliant | ||
 MKE04Z128VLD4 NXP USA Inc. | 11880 | - | - | 20 Weeks | Surface Mount | 44-LQFP | - | A/D 12x12b; D/A 2x6b | 38 | - | - | -40°C~105°C TA | Tray | 2014 | Kinetis KE04 | e3 | Active | 3 (168 Hours) | - | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | - | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |