- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S08PA16VTJ NXP USA Inc. | 80 | - | Datasheet | 10 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 18 | - | - | - | -40°C~105°C TA | Tube | 2002 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 0.65mm | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | - | - | 256 x 8 | - | - | - | - | 6.5mm | 4.4mm | ROHS3 Compliant | ||
 MC56F8247VLHR NXP USA Inc. | 21 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x12b | 54 | 8192 | 49152 | - | -40°C~105°C TA | Tape & Reel (TR) | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 24K x 16 | CANbus, I2C, LINbus, SCI, SPI | - | 16 | YES | NO | YES | YES | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S08AC128MFUE NXP USA Inc. | 7 | - | Datasheet | 10 Weeks | Surface Mount | 64-QFP | YES | A/D 16x10b | 54 | - | 131072 | - | -40°C~125°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC9S08AC128 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
 MKV11Z64VFM7 NXP USA Inc. | 45 | - | Datasheet | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 2x16b; D/A 1x12b | 28 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KV | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SPI, UART/USART | - | - | YES | YES | NO | YES | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
 MC9S08QG8CFQE NXP USA Inc. | 19 | - | Datasheet | 10 Weeks | Surface Mount | 8-VDFN Exposed Pad | YES | A/D 4x10b | 4 | - | 8192 | - | -40°C~85°C TA | Tray | 2003 | S08 | - | Active | 3 (168 Hours) | 8 | 3A991.A.2 | - | - | - | QUAD | NO LEAD | 260 | 3V | 0.8mm | 40 | MC9S08QG8 | - | S-XQCC-N8 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 1mm | - | - | ROHS3 Compliant | ||
S9S12GA192F0MLH NXP USA Inc. | 176 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x8b | 54 | - | 196608 | Automotive grade | -40°C~125°C TA | Tray | 2011 | HCS12 | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12GA192 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 4K x 8 | CPU12 | AEC-Q100 | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 S912XEG128W1MAL NXP USA Inc. | 5 | - | - | 16 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x12b | 91 | 12288 | 131072 | Automotive grade | -40°C~125°C TA | Tray | 1996 | HCS12X | - | Active | 3 (168 Hours) | 112 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.65mm | - | - | - | S-PQFP-G112 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | - | 2K x 8 | CPU12 | AEC-Q100 | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 S9S08DZ128F2MLF NXP USA Inc. | 330 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b | 39 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | - | 0.5mm | 40 | S9S08DZ128 | - | S-PQFP-G48 | - | 5.5V | - | 2.7V | Internal | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 2K x 8 | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9RS08KA1CDB NXP USA Inc. | 1750 |
| Datasheet | 10 Weeks | Surface Mount | 6-VDFN Exposed Pad | YES | - | 2 | - | - | - | -40°C~85°C TA | Tray | 2008 | RS08 | - | Active | 3 (168 Hours) | 6 | EAR99 | - | - | - | DUAL | NO LEAD | 260 | 3V | 0.95mm | 40 | MC9RS08KA1 | - | S-XDSO-N6 | Not Qualified | 5.5V | 1.8/5.5V | 1.8V | Internal | 10MHz | 63 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, WDT | - | FLASH | 8-Bit | 1KB 1K x 8 | - | - | 8 | NO | NO | NO | NO | - | - | - | - | - | 1mm | 3mm | 3mm | ROHS3 Compliant | ||
 MC9S08FL8CBM NXP USA Inc. | In Stock | - | Datasheet | 10 Weeks | Through Hole | 32-SDIP (0.400, 10.16mm) | NO | A/D 12x8b | 30 | - | 8192 | - | -40°C~85°C TA | Tube | 2006 | S08 | e3 | Active | Not Applicable | 32 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | DUAL | - | NOT SPECIFIED | 5V | 1.778mm | NOT SPECIFIED | MC9S08FL8 | - | R-PDIP-T32 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 20MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | - | LVD, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | SCI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 4.9mm | 28.1mm | 8.89mm | ROHS3 Compliant | ||
 MK21FX512VLQ12 NXP USA Inc. | 8 | - | Datasheet | 26 Weeks | Surface Mount | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | - | 524288 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | MK21FX512 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | - | CORTEX-M4F | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
S912ZVC64F0MLF NXP USA Inc. | 154 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 10x10b; D/A 1x8b | 28 | - | - | - | -40°C~125°C TA | Tray | - | S12 MagniV | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 32MHz | 4K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL17Z64VFM4R NXP USA Inc. | 18000 | - | Datasheet | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 11x16b | 28 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART | - | 32 | YES | YES | YES | NO | - | - | - | - | - | 0.65mm | 5mm | 5mm | ROHS3 Compliant | ||
MC9S08AW48CFUE NXP USA Inc. | 2406 | - | Datasheet | 10 Weeks | Surface Mount | 64-QFP | YES | A/D 16x10b | 54 | - | 49152 | - | -40°C~85°C TA | Tray | 2005 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08AW48 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 48KB 48K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
MK53DN512ZCLQ10 NXP USA Inc. | 280 |
| Datasheet | - | Surface Mount | 144-LQFP | YES | A/D 41x16b; D/A 2x12b | 94 | - | - | - | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK53DN512 | - | S-PQFP-G144 | Not Qualified | 3.6V | - | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MC9S08QE4CTGR NXP USA Inc. | 5217 | - | Datasheet | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 12 | - | 4096 | - | -40°C~85°C TA | Tape & Reel (TR) | 2009 | S08 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QE4 | - | R-PDSO-G16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | ||
LPC4078FBD144,551 NXP USA Inc. | 1020 | - | Datasheet | 18 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x12b; D/A 1x10b | 109 | - | 524288 | - | -40°C~85°C TA | Tray | 2011 | LPC40xx | e3 | Active | 2 (1 Year) | 144 | - | Tin (Sn) | - | - | QUAD | GULL WING | - | 3.3V | 0.5mm | - | LPC4078 | 144 | S-PQFP-G144 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | 4032 x 8 | CORTEX-M4 | - | - | - | 20mm | 20mm | ROHS3 Compliant | ||
 MCHC11F1CFNE4 NXP USA Inc. | 100 | - | Datasheet | 11 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | - | - | - | -40°C~85°C TA | Tube | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | - | S-PQCC-J68 | - | 5.25V | - | 4.75V | Internal | 4MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | - | POR, WDT | 16MHz | ROMless | 8-Bit | - | SCI, SPI | - | 8 | YES | NO | NO | NO | 16 | 512 x 8 | - | - | 8 | - | 24.23mm | 24.23mm | ROHS3 Compliant | ||
MC9S12XEQ384MAG NXP USA Inc. | 1579 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | - | 393216 | - | -40°C~125°C TA | Tray | 2001 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | MC9S12XEQ384 | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | - | 32 | YES | NO | YES | NO | 23 | 4K x 8 | CPU12 | - | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MPC5566MZP144 NXP USA Inc. | 2861 | - | Datasheet | 12 Weeks | Surface Mount | 416-BBGA | YES | A/D 40x12b | 256 | - | 3145728 | - | -40°C~125°C TA | Tray | 2007 | MPC55xx Qorivva | e0 | Active | 3 (168 Hours) | 416 | 3A991.A.2 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | PC5566 | - | S-PBGA-B416 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 144MHz | 128K x 8 | 1.35V~1.65V | MICROCONTROLLER, RISC | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | - | 32 | YES | YES | YES | NO | 24 | - | - | - | 32 | 2.55mm | 27mm | 27mm | Non-RoHS Compliant |