- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
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 LPC11U67JBD100E NXP USA Inc. | 9 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | - | A/D 12x12b | 80 | - | - | - | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 20K x 8 | 2.4V~3.6V | - | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MK22DX256VLK5 NXP USA Inc. | 45 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 20x16b; D/A 1x12b | 56 | - | 262144 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK22DX256 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 MC9S08AW60CPUER NXP USA Inc. | 10006 | - | Datasheet | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | - | 63280 | - | -40°C~85°C TA | Tape & Reel (TR) | 2011 | S08 | e3 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08AW60 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MK22FN512VLL12R NXP USA Inc. | 20 | - | Datasheet | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 33x16b; D/A 2x12b | 66 | - | - | - | -40°C~105°C TA | Tape & Reel (TR) | - | Kinetis K20 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | - | - | S-PQFP-G100 | - | 3.6V | - | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 S912XEQ384F1CAGR NXP USA Inc. | 500 | - | Datasheet | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 24576 | 393216 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | - | - | Active | 3 (168 Hours) | 144 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 1.8V | 0.5mm | - | - | - | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | - | 23 | 4K x 8 | - | CPU12 | AEC-Q100 | 16 | - | 20mm | 20mm | ROHS3 Compliant | ||
 MK10DN64VFM5 NXP USA Inc. | 1 | - | - | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 10x16b | 24 | - | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | - | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK10DN64 | - | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M4 | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
 MKL03Z8VFG4R NXP USA Inc. | 5907 | - | Datasheet | 13 Weeks | Surface Mount | 16-UFQFN Exposed Pad | YES | A/D 7x12b | 14 | 2048 | 8192 | - | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL03 | e3 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | - | - | S-XQCC-N16 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | - | - | CORTEX-M0 | - | - | - | 3mm | 3mm | ROHS3 Compliant | ||
 S9S08SG32E1WTL NXP USA Inc. | 1650 | - | Datasheet | 12 Weeks | Surface Mount | 28-TSSOP (0.173, 4.40mm Width) | YES | A/D 16x10b | 22 | - | - | - | -40°C~150°C TA | Tube | 1999 | S08 | - | - | Active | 3 (168 Hours) | 28 | - | - | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | NOT SPECIFIED | S9S08SG32 | - | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | 9.7mm | 4.4mm | ROHS3 Compliant | ||
 MCF5282CVF66 NXP USA Inc. | 1 | - | Datasheet | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b | 142 | - | - | - | -40°C~85°C TA | Tray | 2002 | MCF528x | e0 | - | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | - | 8542.31.00.01 | BOTTOM | BALL | 220 | 3.3V | 1mm | 30 | MCF5282 | - | S-PBGA-B256 | Not Qualified | 3.6V | - | 2.7V | External | 66MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | - | 32 | YES | YES | YES | NO | 24 | - | 8 | - | - | 32 | 1.6mm | 17mm | 17mm | Non-RoHS Compliant | ||
LPC1766FBD100,551 NXP USA Inc. | 5 | - | Datasheet | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 8x12b; D/A 1x10b | 70 | - | 262144 | - | -40°C~85°C TA | Tray | 2009 | LPC17xx | e3 | - | Discontinued | 3 (168 Hours) | 100 | EAR99 | Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 30 | LPC1766 | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 2.5/3.33/3.3V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | ARM7 | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
S9S12GN48F0VLH NXP USA Inc. | 5 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x10b | 54 | - | 49152 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | - | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | - | 0.5mm | - | S9S12GN48 | - | S-PQFP-G64 | Not Qualified | - | 3.3/5V | - | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | - | 12V1 | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | 20mA | 16 | - | - | - | - | - | 1.5K x 8 | - | CPU12 | AEC-Q100 | - | - | - | - | ROHS3 Compliant | ||
 MC9S08SH4CTJR NXP USA Inc. | 30000 | - | Datasheet | 22 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 17 | - | 4096 | - | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | - | Active | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08SH4 | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
 MKL43Z256VMP4 NXP USA Inc. | 19 | - | - | 13 Weeks | Surface Mount | 64-LFBGA | YES | A/D 16x16b; D/A 1x12b | 50 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL4 | e1 | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | - | 40 | - | - | S-PBGA-B64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LCD, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC9S08GT60ACFDE NXP USA Inc. | 10000 | - | Datasheet | - | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | - | - | - | -40°C~85°C TA | Tray | 2005 | S08 | - | - | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08GT60 | - | - | - | 3.6V | - | 2.08V | Internal | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 S9S08DZ32F2MLF NXP USA Inc. | 700 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 16x12b | 39 | - | - | - | -40°C~125°C TA | Tray | 2006 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | S9S08DZ32 | - | - | - | - | - | - | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | 1K x 8 | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LPC4088FET180,551 NXP USA Inc. | 32 | - | Datasheet | 18 Weeks | Surface Mount | 180-TFBGA | YES | A/D 8x12b; D/A 1x10b | 142 | - | 524288 | - | -40°C~85°C TA | Tray | 2010 | LPC40xx | e1 | - | Active | 3 (168 Hours) | 180 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | - | 3.3V | 0.8mm | - | LPC4088 | 180 | S-PBGA-B180 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | - | - | 4032 x 8 | - | CORTEX-M4 | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
 MC9S12XDT256MAA NXP USA Inc. | 2000 | - | Datasheet | 10 Weeks | Surface Mount | 80-QFP | YES | A/D 8x10b | 59 | - | 262144 | - | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12XDT256 | - | S-PQFP-G80 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 16K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 4K x 8 | - | CPU12 | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
S9S12G128AVLH NXP USA Inc. | 10400 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 12x10b | 54 | - | - | - | -40°C~105°C TA | Tray | - | HCS12 | - | - | Active | 3 (168 Hours) | 64 | - | - | - | - | QUAD | GULL WING | - | 5V | 0.5mm | - | - | - | S-PQFP-G64 | - | 5.5V | - | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | NO | - | 4K x 8 | 8 | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
S9S08DV60F2MLF NXP USA Inc. | 780 | - | - | 12 Weeks | Surface Mount | 48-LQFP | - | A/D 16x12b | 39 | - | - | - | -40°C~125°C TA | Tray | 1996 | S08 | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | 260 | - | - | 40 | - | - | - | - | - | - | - | Internal | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC9S08GT32ACFDE NXP USA Inc. | 1200 | - | Datasheet | - | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | - | - | - | -40°C~85°C TA | Tray | 2008 | S08 | - | - | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | - | OPERATES AT 1.8V MINIMUM SUPPLY | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08GT32 | - | S-XQCC-N48 | Not Qualified | 3.6V | - | 2.08V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant |