- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MKE06Z128VLH4 NXP USA Inc. | 8712 | - | - | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | 58 | 16384 | 131072 | -40°C~105°C TA | Tray | 2002 | Kinetis KE06 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | - | S-PQFP-G64 | - | 5.5V | - | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | - | - | 8 | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MC908GP32CFBE NXP USA Inc. | 4323 | - | Datasheet | - | Surface Mount | 44-QFP | YES | A/D 8x8b | 33 | - | - | -40°C~85°C TA | Tray | 2006 | HC08 | e3 | Not For New Designs | 3 (168 Hours) | 44 | EAR99 | MATTE TIN | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 4.1 MHZ | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | MC908GP32 | - | S-PQFP-G44 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32.8MHz | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 2.45mm | 10mm | 10mm | ROHS3 Compliant | ||
 LPC1768FET100,551 NXP USA Inc. | 9687 |
| Datasheet | 12 Weeks | Surface Mount | 100-TFBGA | YES | A/D 8x12b; D/A 1x10b | 70 | - | 524288 | -40°C~85°C TA | Tray | 2009 | LPC17xx | e1 | Active | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC1768 | 100 | S-PBGA-B100 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M3 | - | - | - | - | - | 1.2mm | 9mm | 9mm | ROHS3 Compliant | ||
 MK20DX256VMC7 NXP USA Inc. | 12 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 35x16b; D/A 1x12b | 70 | - | 262144 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK20DX256 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MC68HC705C8ACFNE NXP USA Inc. | 5560 | - | Datasheet | 11 Weeks | Surface Mount | 44-LCC (J-Lead) | YES | - | 24 | - | - | -40°C~85°C TA | Tube | 1998 | HC05 | e3 | Not For New Designs | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY @ 1 MHZ | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MC68HC705 | - | S-PQCC-J44 | Not Qualified | 5.5V | - | 4.5V | Internal | 2.1MHz | 304 x 8 | 3V~5.5V | MICROCONTROLLER | - | POR, WDT | 4.2MHz | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | 8 | NO | NO | NO | NO | - | - | - | - | - | - | - | - | - | 4.57mm | 16.5862mm | 16.5862mm | ROHS3 Compliant | ||
MC56F8257VLH NXP USA Inc. | 3610 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 1x12b | 54 | - | 65536 | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F8257 | - | S-PQFP-G64 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
 MK10DX256VLQ10 NXP USA Inc. | 356 |
| Datasheet | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 104 | - | 262144 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX256 | - | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 MKL03Z32VFK4R NXP USA Inc. | 20000 | - | Datasheet | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 7x12b | 22 | 2048 | 32768 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL03 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | - | - | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | 0.65mm | 4mm | 4mm | ROHS3 Compliant | ||
MKL03Z8VFK4 NXP USA Inc. | 18 | - | - | 13 Weeks | Surface Mount | 24-UFQFN Exposed Pad | YES | A/D 7x12b | 22 | - | 8192 | -40°C~105°C TA | Tray | 2002 | Kinetis KL03 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL03Z8 | - | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | 0.65mm | 4mm | 4mm | ROHS3 Compliant | ||
 MK60FX512VMD12 NXP USA Inc. | 766 | - | Datasheet | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 58x16b; D/A 2x12b | 100 | - | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK60FX512 | - | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | 16K x 8 | - | CORTEX-M4F | - | - | - | - | - | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||
MKL27Z256VLH4 NXP USA Inc. | 1120 |
| - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x16b; D/A 1x12b | 50 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | MATTE TIN | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | - | 40 | - | - | S-PQFP-G64 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | - | YES | YES | YES | YES | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MKL17Z64VFM4 NXP USA Inc. | 2450 | - | - | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 11x16b | 28 | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | TIN | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART | 32 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | 0.65mm | 5mm | 5mm | ROHS3 Compliant | ||
MKL26Z256VMC4 NXP USA Inc. | 50 | - | Datasheet | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D - 16bit; D/A - 12bit | 80 | - | 262144 | -40°C~105°C TA | Tray | 2012 | Kinetis KL2 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MKL26Z256 | - | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
 MCF54415CMJ250 NXP USA Inc. | 3544 | - | - | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x12b; D/A 2x12b | 87 | - | - | -40°C~85°C TA | Tray | 2006 | MCF5441x | e2 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MCF54415 | - | S-PBGA-B256 | Not Qualified | 1.32V | 1.21.81.8/3.33.3V | 1.14V | Internal | 250MHz | 64K x 8 | 1.14V~1.32V | MICROPROCESSOR | Coldfire V4 | DMA, PWM, WDT | 100MHz | ROMless | 32-Bit | - | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | 32 | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | YES | - | - | - | ROHS3 Compliant | ||
MC9S12XDP512CAG NXP USA Inc. | 15 | - | Datasheet | 10 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x10b | 119 | - | 524288 | -40°C~85°C TA | Tray | 2004 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC9S12XDP512 | - | S-PQFP-G144 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 32K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | - | 4K x 8 | - | CPU12 | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
MKL03Z32VFK4 NXP USA Inc. | 580 | - | - | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 7x12b | 22 | - | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KL03 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL03Z32 | - | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | 0.65mm | 4mm | 4mm | ROHS3 Compliant | ||
 MKE02Z32VLD4 NXP USA Inc. | 6070 | - | - | 20 Weeks | Surface Mount | 44-LQFP | YES | A/D 16x12b; D/A 2x6b | 37 | 4096 | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | - | Active | 3 (168 Hours) | 44 | 3A991.A.2 | - | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | NOT SPECIFIED | - | - | S-PQFP-G44 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12C32CFAE16 NXP USA Inc. | 5460 | - | Datasheet | 10 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x10b | 31 | - | 32768 | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | Active | 3 (168 Hours) | 48 | EAR99 | Tin (Sn) | - | - | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC9S12C32 | - | S-PQFP-G48 | Not Qualified | 2.75V | 2.53.3/5V | 2.35V | Internal | 16MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | - | - | CPU12 | - | - | 16 | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MC56F8006VLF NXP USA Inc. | 250 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 24x12b | 40 | - | 16384 | -40°C~105°C TA | Tray | 1999 | 56F8xxx | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MC56F8006 | - | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | 1.8V | Internal | 32MHz | 1K x 16 | 1.8V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 64MHz | FLASH | 16-Bit | 16KB 8K x 16 | I2C, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
MKE04Z64VLD4 NXP USA Inc. | 24000 |
| - | 20 Weeks | Surface Mount | 44-LQFP | - | A/D 12x12b; D/A 2x6b | 38 | - | - | -40°C~105°C TA | Tray | 2013 | Kinetis KE04 | - | Active | 3 (168 Hours) | - | 3A991.A.2 | - | - | 8542.31.00.01 | - | - | 260 | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | - | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |