- Connectivity
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Program Memory Type
- RAM Size
Attribute column
Manufacturer
NXP Embedded - Microcontrollers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MC9S08GT32ACFDE NXP USA Inc. | 1200 | - | Datasheet | - | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | - | - | - | -40°C~85°C TA | Tray | 2008 | S08 | - | - | Not For New Designs | 3 (168 Hours) | 48 | EAR99 | - | OPERATES AT 1.8V MINIMUM SUPPLY | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | - | 40 | MC9S08GT32 | - | S-XQCC-N48 | Not Qualified | 3.6V | - | 2.08V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
 MC9S08DZ96CLL NXP USA Inc. | 11222 | - | Datasheet | 10 Weeks | Surface Mount | 100-LQFP | YES | A/D 24x12b | 87 | - | 98304 | - | -40°C~85°C TA | Tray | 2002 | S08 | e3 | - | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | MC9S08DZ96 | - | S-PQFP-G100 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 38.4MHz | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | 16 | 2K x 8 | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
 MKL13Z64VLH4 NXP USA Inc. | 21 | - | - | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 20x16b; D/A 1x12b | 54 | 8192 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | - | - | Active | 3 (168 Hours) | 64 | 3A991.A.2 | - | - | - | QUAD | GULL WING | NOT SPECIFIED | 3V | 0.5mm | - | NOT SPECIFIED | - | - | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | FlexIO, I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | - | - | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
 MC9S12XA256CAL NXP USA Inc. | 10000 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | 262144 | - | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | - | 40 | 9S12XA256 | - | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 16K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 4K x 8 | CPU12 | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
 S912ZVML31F1MKF NXP USA Inc. | 8518 | - | Datasheet | 12 Weeks | Surface Mount | 48-LQFP Exposed Pad | - | A/D 4x12b | 31 | - | - | - | -40°C~125°C TA | Tray | 2012 | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 32KB 32K x 8 | LINbus, SCI | - | - | - | - | - | - | - | 128 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MCF5232CVM150 NXP USA Inc. | 1 | - | Datasheet | - | Surface Mount | 196-LBGA | YES | - | 97 | - | - | - | -40°C~85°C TA | Tray | 1999 | MCF523x | e1 | - | Not For New Designs | 3 (168 Hours) | 196 | 5A992 | TIN SILVER COPPER | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | - | 40 | MCF5232 | - | S-PBGA-B196 | Not Qualified | 1.6V | - | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | - | CANbus, EBI/EMI, I2C, SPI, UART/USART | - | 32 | - | - | - | - | 24 | - | - | YES | YES | - | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||
 MC9S08EL32CTJ NXP USA Inc. | 265 | - | Datasheet | 10 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 16 | - | 32768 | - | -40°C~85°C TA | Tray | 1998 | S08 | e3 | - | Active | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | - | 40 | MC9S08EL32 | - | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | - | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | 512 x 8 | - | - | - | - | - | - | - | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||
 S9KEAZ128ACLK NXP USA Inc. | 7 | - | Datasheet | 20 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x12b | 71 | - | - | - | -40°C~85°C TA | Tray | 2013 | Kinetis KEA | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.65mm | - | 40 | - | - | S-PQFP-G80 | - | 5.5V | - | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
MC9S08LG32CLK NXP USA Inc. | 12 | - | Datasheet | - | Surface Mount | 80-LQFP | YES | A/D 16x12b | 69 | - | - | - | -40°C~85°C TA | Tray | 2008 | S08 | e3 | - | Not For New Designs | 3 (168 Hours) | 80 | EAR99 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | - | 40 | MC9S08LG32 | - | S-PQFP-G80 | Not Qualified | 5.5V | - | 2.7V | Internal | 40MHz | 1.9K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LCD, LVD, PWM | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||
 S9S08DV128F2CLFR NXP USA Inc. | 21 | - | - | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x12b | 39 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 1996 | S08 | - | - | Active | 3 (168 Hours) | 48 | - | - | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | - | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | - | - | - | - | - | - | - | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
 MK30DX256VLK7 NXP USA Inc. | 9 | - | Datasheet | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 31x16b; D/A 1x12b | 56 | - | 262144 | - | -40°C~105°C TA | Tray | 2012 | Kinetis K30 | e3 | - | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | - | 40 | MK30DX256 | - | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | CORTEX-M4 | - | - | - | - | - | - | - | 12mm | 12mm | ROHS3 Compliant | ||
S9S12P96J0CLH NXP USA Inc. | 209 | - | - | 16 Weeks | Surface Mount | 64-LQFP | - | A/D 10x12b | 49 | - | - | - | -40°C~85°C TA | Tray | 2006 | HCS12 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | S9S12P96 | - | - | - | - | - | - | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | - | - | LVD, POR, PWM, WDT | - | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, SCI, SPI | - | - | - | - | - | - | - | 4K x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 LPC2129FBD64/01,15 NXP USA Inc. | 891 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP | YES | A/D 4x10b | 46 | - | 262144 | - | -40°C~85°C TA | Tray | 2003 | LPC2100 | e3 | - | Not For New Designs | 1 (Unlimited) | 64 | EAR99 | TIN | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | - | 40 | LPC2129 | 64 | S-PQFP-G64 | Not Qualified | 1.95V | 1.83.3V | 1.65V | Internal | 60MHz | 16K x 8 | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM7® | POR, PWM, WDT | 50MHz | FLASH | 16/32-Bit | 256KB 256K x 8 | CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART | - | 32 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
FS32K142MNT0VLLT NXP USA Inc. | 15 | - | Datasheet | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | - | - | - | -40°C~105°C TA | Tray | - | S32K | - | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | 3.3V | 0.5mm | compliant | 40 | - | - | - | - | 5.5V | - | 2.7V | Internal | 64MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | - | 32 | YES | YES | YES | - | - | 4K x 8 | - | - | - | - | - | - | - | - | 14mm | 14mm | RoHS Compliant | ||
 SPC5668GK0MMG NXP USA Inc. | 10 | - | - | 12 Weeks | Surface Mount | 208-BGA | - | A/D 36x10b | 155 | - | - | - | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | - | yes | Active | 3 (168 Hours) | - | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | SPC5668 | - | - | - | - | - | - | Internal | 116MHz | 592K x 8 | 3V~5.5V | MICROCONTROLLER | e200z650 | DMA, POR, PWM, WDT | - | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
MC9S12XD256CAL NXP USA Inc. | 300 | - | Datasheet | 10 Weeks | Surface Mount | 112-LQFP | YES | A/D 16x10b | 91 | - | 262144 | - | -40°C~85°C TA | Tray | 2001 | HCS12X | e3 | - | Active | 3 (168 Hours) | 112 | - | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | - | 40 | 9S12XD256 | - | S-PQFP-G112 | Not Qualified | 2.75V | 2.55V | 2.35V | External | 80MHz | 14K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | - | 16 | YES | YES | YES | NO | - | 4K x 8 | CPU12 | - | - | - | - | - | - | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||
S9S08AW16AE0CFT NXP USA Inc. | 1500 | - | Datasheet | 12 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 38 | - | - | Automotive grade | -40°C~85°C TA | Tray | 2000 | S08 | - | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | - | 40 | S9S08AW16 | - | S-XQCC-N48 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | 18.5mA | 8 | YES | NO | YES | NO | - | - | - | - | - | AEC-Q100 | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
 S912ZVML64F3WKHR NXP USA Inc. | 21 | - | Datasheet | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | - | A/D 9x12b | 31 | - | - | - | -40°C~150°C TA | Tape & Reel (TR) | - | S12 MagniV | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Internal | 50MHz | 4K x 8 | 3.5V~40V | - | S12Z | DMA, POR, PWM, WDT | - | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, LINbus, SCI, SPI | - | - | - | - | - | - | - | 512 x 8 | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 MC908QY4CDWER NXP USA Inc. | 3000 | - | Datasheet | 11 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 4x8b | 13 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2010 | HC08 | e3 | - | Not For New Designs | 3 (168 Hours) | 16 | 3A991.A.2 | Tin (Sn) | ALSO OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | - | 40 | MC908QY4 | - | R-PDSO-G16 | Not Qualified | 5.5V | - | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 4KB 4K x 8 | - | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | - | - | - | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||
 MC9S08PA4AVWJ NXP USA Inc. | 3434 | - | Datasheet | 20 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 8x12b | 18 | - | - | - | -40°C~105°C TA | Tube | 2002 | S08 | e3 | - | Active | 3 (168 Hours) | 20 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | - | 40 | - | - | R-PDSO-G20 | - | 5.5V | - | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | NO | - | 128 x 8 | - | - | - | - | - | - | - | - | 12.8mm | 7.5mm | ROHS3 Compliant |